Patents by Inventor R. Michael Powell

R. Michael Powell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7524390
    Abstract: A fixture for holding a workpiece during a manufacturing process includes a base and a rod received by and moveable relative to the base. The rod includes a proximal end presenting a bonding surface. Adhesive establishes an adhesive bond extending between and bonding to the bonding surface and the workpiece. The bonding surface is moveable with the rod relative to the base in an adhesive bond destroying motion. A method of holding the workpiece on the fixture includes the step of adjoining the adhesive to the bonding surface and to the workpiece to create the adhesive bond between the bonding surface and the workpiece during the manufacturing process. The method also includes the step of displacing the bonding surface relative to the base and relative to the workpiece to destroy the adhesive bond between the bonding surface and the workpiece after the manufacturing process has been performed on the workpiece.
    Type: Grant
    Filed: July 26, 2006
    Date of Patent: April 28, 2009
    Assignee: The Penn State Research Foundation
    Inventors: Edward C. DeMeter, R. Michael Powell
  • Publication number: 20070221328
    Abstract: A fixture for holding a workpiece during a manufacturing process includes a base and a rod received by and moveable relative to the base. The rod includes a proximal end presenting a bonding surface. Adhesive establishes an adhesive bond extending between and bonding to the bonding surface and the workpiece. The bonding surface is moveable with the rod relative to the base in an adhesive bond destroying motion. A method of holding the workpiece on the fixture includes the step of adjoining the adhesive to the bonding surface and to the workpiece to create the adhesive bond between the bonding surface and the workpiece during the manufacturing process. The method also includes the step of displacing the bonding surface relative to the base and relative to the workpiece to destroy the adhesive bond between the bonding surface and the workpiece after the manufacturing process has been performed on the workpiece.
    Type: Application
    Filed: July 26, 2006
    Publication date: September 27, 2007
    Inventors: Edward C. DeMeter, R. Michael Powell