Patents by Inventor Rachel G. Taylor

Rachel G. Taylor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240075307
    Abstract: A wearable cardioverter defibrillator monitor case includes a housing configured to surround a defibrillator electronics assembly, a front cover removably attachable to the housing, and a rear cover removably attachable to the housing. The wearable cardioverter defibrillator case has a shock indicator positioned on the housing at an interface between the housing and the front cover.
    Type: Application
    Filed: November 6, 2023
    Publication date: March 7, 2024
    Applicant: West Affum Holdings DAC
    Inventors: Robert R. Buchanan, Quan H. Nguyen, Allison Staheli, Larry J. Spyridis, Rachel G. Taylor
  • Patent number: 11844954
    Abstract: A wearable cardioverter defibrillator monitor case includes a housing configured to surround a defibrillator electronics assembly, a front cover removably attachable to the housing, and a rear cover removably attachable to the housing. The wearable cardioverter defibrillator case has a shock indicator positioned on the housing at an interface between the housing and the front cover.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: December 19, 2023
    Assignee: West Affum Holdings DAC
    Inventors: Robert R. Buchanan, Quan H. Nguyen, Allison Staheli, Larry J. Spyridis, Rachel G. Taylor
  • Publication number: 20190255341
    Abstract: A wearable cardioverter defibrillator monitor case includes a housing configured to surround a defibrillator electronics assembly, a front cover removably attachable to the housing, and a rear cover removably attachable to the housing. The wearable cardioverter defibrillator case has a shock indicator positioned on the housing at an interface between the housing and the front cover.
    Type: Application
    Filed: April 15, 2019
    Publication date: August 22, 2019
    Inventors: Robert R. Buchanan, Quan H. Nguyen, Allison Staheli, Larry J. Spyridis, Rachel G. Taylor
  • Publication number: 20170179066
    Abstract: Reflow Grid Array technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a BGA package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is solder cleaning and removal when removing a BGA package. Technical solutions described herein provide processes and equipment for bulk solder removal from a BGA package that can be executed in the field.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 22, 2017
    Inventors: Russell S. Aoki, John W. Jaeger, Michael S. Brazel, Daniel P. Carter, Anthony P. Valpiani, Michael R. Hui, Rashelle Yee, Joseph J. Jasniewski, Shelby A. Ferguson, Thomas A. Boyd, Jonathan W. Thibado, Penny K. Woodcock, Rachel G. Taylor, Laura S. Mortimer