Abstract: A low cost power splitter that has a small size and can be used with automated surface mount manufacturing equipment. The power splitter includes a case having a cavity and a lead mounting surface. Leads are secured to the lead mounting surface. A substrate is mounted in the cavity. The substrate has top surface, a bottom surface and inner layers. A resistor is formed on the top surface. A capacitor is formed on the inner layers. Terminals are located on the top surface and vias extend through the substrate. A pair of transformers are attached to the bottom surface and to the case by an adhesive. The transformers have windings that are connected to the terminals. Connector wires are connected between the terminals and the leads.

Abstract: A low cost power splitter that has a small size and can be used with automated surface mount manufacturing equipment. The power splitter includes a case having a cavity and a lead mounting surface. Leads are secured to the lead mounting surface. A substrate is mounted in the cavity. The substrate has top surface, a bottom surface and inner layers. A resistor is formed on the top surface. A capacitor is formed on the inner layers. Terminals are located on the top surface and vias extend through the substrate. A pair of transformers are attached to the bottom surface and to the case by an adhesive. The transformers have windings that are connected to the terminals. Connector wires are connected between the terminals and the leads.