Patents by Inventor Radu REIT
Radu REIT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11667111Abstract: Display modules typically incorporate a transparent hard material such as glass on the outside of the module in order to better protect the display stack from scratches, dents, and other mechanical deformations. However, as displays move to novel form factors such as bendable, foldable, and reliable display modules, these transparent hard materials (e.g., glass) may not be used due to their limited flexibility. Therefore, it is desirable that replacement materials be sufficiently flexible while maintaining the desirable optical (e.g., >90% transmission and low yellow index) and mechanical properties (e.g., pencil hardness>H) that comparable glass hard materials offer.Type: GrantFiled: June 19, 2018Date of Patent: June 6, 2023Assignee: Ares Materials Inc.Inventors: Radu Reit, Adrian Avendano-Bolivar, Apostolos Voutsas, David Arreaga-Salas
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Patent number: 11427684Abstract: Provided is a method for forming an organic planarization layer. The method includes forming lithographically-patterned arrays atop a substrate; disposing a thiol-based photocurable resin on to the lithographically-patterned arrays to form a photocurable planarization layer; and curing the photocurable planarization layer to form a flat surface above the lithographically-patterned array.Type: GrantFiled: June 20, 2018Date of Patent: August 30, 2022Assignee: Ares Materials, Inc.Inventors: Radu Reit, Adrian Avendano-Bolivar, Apostolos Voutsas, David Arreaga-Salas
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Publication number: 20210363304Abstract: A photocurable resin composition for forming an optically clear film. The photocurable resin composition includes a polyfunctional thiol monomer comprising 2 thiol functional groups, a polyfunctional (meth)acrylate monomer comprising 2 (meth)acryloyl functional groups, a photo-initiator present in a concentration of about 1 parts per hundred (phr) or less, a sterically hindered phenolic antioxidant present in a concentration of about 5 phr or less, and a phosphite antioxidant present in a concentration of about 5 phr or less.Type: ApplicationFiled: December 9, 2019Publication date: November 25, 2021Inventors: Kejia YANG, Radu REIT
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Publication number: 20210323217Abstract: Provided are methods and systems for manufacturing and using heat-shrink elastomeric. An example method of manufacturing a heat-shrink elastomeric element comprises providing a thermoplastic elastomeric element having a first shape; modifying the thermoplastic elastomeric element to produce a thermoset elastomeric element having the first shape; heating the thermoset elastomeric element to a temperature of at least the glass transition temperature of the thermoset elastomeric element; adjusting the first shape of the thermoset elastomeric element to produce a second shape with at least one dimension greater than that of the first shape; and cooling the thermoset elastomeric element to a temperature below that of the glass transition temperature of the thermoset elastomeric element to produce the heat-shrink elastomeric element.Type: ApplicationFiled: June 23, 2021Publication date: October 21, 2021Inventors: Michael L. FRIPP, Kejia YANG, Radu REIT, Benjamin LUND, Walter VOIT
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Patent number: 11065807Abstract: Provided are methods and systems for manufacturing and using heat-shrink elastomeric. An example method of manufacturing a heat-shrink elastomeric element comprises providing a thermoplastic elastomeric element having a first shape; modifying the thermoplastic elastomeric element to produce a thermoset elastomeric element having the first shape; heating the thermoset elastomeric element to a temperature of at least the glass transition temperature of the thermoset elastomeric element; adjusting the first shape of the thermoset elastomeric element to produce a second shape with at least one dimension greater than that of the first shape; and cooling the thermoset elastomeric element to a temperature below that of the glass transition temperature of the thermoset elastomeric element to produce the heat-shrink elastomeric element.Type: GrantFiled: April 13, 2017Date of Patent: July 20, 2021Assignees: The University of Texas System Board of Regents, Halliburton Energy Services, Inc.Inventors: Michael L. Fripp, Kejia Yang, Radu Reit, Benjamin Lund, Walter Voit
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Publication number: 20210147631Abstract: Provided is a method for forming an organic planarization layer. The method includes forming lithographically-patterned arrays atop a substrate; disposing a thiol-based photocurable resin on to the lithographically-patterned arrays to form a photocurable planarization layer; and curing the photocurable planarization layer to form a flat surface above the lithographically-patterned array.Type: ApplicationFiled: June 20, 2018Publication date: May 20, 2021Inventors: Radu REIT, Adrian AVENDANO-BOLIVAR, Apostolos VOUTSAS, David ARREAGA-SALAS
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Publication number: 20210115258Abstract: Provided are methods for selecting a polymer for use as a flexible electronics substrate. An example method includes selecting a thermosetting polymer from a plurality of polymers, wherein the thermosetting polymer: undergoes a thermomechanical transition at a transition temperature between room temperature and the highest temperature observed during processing from the glassy to the rubbery regime; wherein the thermosetting polymer has a Young's modulus below 3 GPa in the glassy regime and wherein the thermosetting polymer has a Young's modulus above 0.3 MPa in the rubbery regime. The method further includes producing a flexible electronic substrate from the selected polymer.Type: ApplicationFiled: April 13, 2018Publication date: April 22, 2021Inventors: Radu REIT, Adrian AVENDANO-BOLIVAR, David ARREAGA-SALAS
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Patent number: 10840120Abstract: Provided are microelectronics substrates and methods of manufacturing and using the microelectronics substrate. An example of a microelectronics substrate includes a carrier, a silicate bonding layer, and a flexible substrate, wherein the flexible substrate is bonded to the silicate bonding layer. The microelectronics substrate comprises a peel strength between the flexible substrate and silicate bonding layer; wherein the peel strength between the flexible substrate and the silicate bonding layer is below 1 kgf/m.Type: GrantFiled: November 27, 2017Date of Patent: November 17, 2020Assignee: ARES MATERIALS INC.Inventors: Radu Reit, David Arreaga-Salas
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Publication number: 20200255709Abstract: Provided are semi -interpenetrating optically clear adhesives, methods of use, and methods of manufacture. An example semi-interpenetrating optically clear adhesive comprises a transparent polymer network comprised of at least two or more interpenetrating polymer networks, wherein at least one polymer network is a thermoset material and at least one other polymer network is a thermoplastic material, yielding an optically clear adhesive with a transparency above 80% and an elastic toughness above 1 MJ/m3.Type: ApplicationFiled: October 17, 2017Publication date: August 13, 2020Inventors: Radu REIT, Jesus Espinoza DIAZ, Adrian AVENDANO-BOLIVAR, Apostolos VOUTSAS, David ARREAGA-SALAS
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Patent number: 10736212Abstract: A bulk substrate for stretchable electronics. The bulk substrate is manufactured with a process that forms a soft-elastic region of the bulk substrate. The soft-elastic region includes a strain capacity of greater than or equal to 25% and a first Young's modulus below 10% of a maximum local modulus of the bulk substrate. The process also forms a stiff-elastic region of the bulk substrate. The stiff-elastic region includes a strain capacity of less than or equal to 5% and a second Young's modulus greater than 10% of the maximum local modulus of the bulk substrate.Type: GrantFiled: September 7, 2017Date of Patent: August 4, 2020Assignee: ARES MATERIALS INC.Inventors: Radu Reit, David Arreaga-Salas
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Publication number: 20200123410Abstract: Display modules typically incorporate a transparent hard material such as glass on the outside of the module in order to better protect the display stack from scratches, dents, and other mechanical deformations. However, as displays move to novel form factors such as bendable, foldable, and reliable display modules, these transparent hard materials (e.g., glass) may not be used due to their limited flexibility. Therefore, it is desirable that replacement materials be sufficiently flexible while maintaining the desirable optical (e.g., >90% transmission and low yellow index) and mechanical properties (e.g., pencil hardness >H) that comparable glass hard materials offer.Type: ApplicationFiled: June 19, 2018Publication date: April 23, 2020Inventors: Radu REIT, Adrian AVENDANO-BOLIVAR, Apostolos VOUTSAS, David ARREAGA-SALAS
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Patent number: 10615191Abstract: Provided are flexible electronics stacks and methods of use. An example flexible electronics stack includes a flexible polymeric substrate film and a rigid inorganic electronic component. The flexible polymeric substrate film includes a thermoset polymer prepared by curing a monomer solution; wherein the monomer solution comprises about 25 wt % to about 65 wt % of one or more thiol monomers and from about 25 wt % to about 65 wt % of one or more co-monomers.Type: GrantFiled: April 21, 2017Date of Patent: April 7, 2020Assignee: ARES MATERIALS INC.Inventors: Radu Reit, Adrian Avendano-Bolivar, David Arreaga-Salas
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Publication number: 20190338092Abstract: Provided are flexible color filters and methods of manufacturing flexible color filters. An example flexible color filter comprises a transparent flexible substrate comprising a thermoset thiol-click polymer. An example method of manufacturing a flexible color filter comprises dispensing a release layer on a stiff carrier substrate; dispensing a polymer resin on the release layer; curing the polymer resin into a transparent film; fabricating a flexible color filter on the transparent film; and removing the flexible color filter from the release layer and stiff carrier substrate.Type: ApplicationFiled: January 24, 2018Publication date: November 7, 2019Inventors: Radu REIT, Adrian AVENDANO-BOLIVAR, David ARREAGA-SALAS
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Publication number: 20190305239Abstract: Provided are microelectronics substrates and methods of manufacturing and using the microelectronics substrate. An example of a microelectronics substrate includes a carrier, a silicate bonding layer, and a flexible substrate, wherein the flexible substrate is bonded to the silicate bonding layer. The microelectronics substrate comprises a peel strength between the flexible substrate and silicate bonding layer; wherein the peel strength between the flexible substrate and the silicate bonding layer is below 1 kgf/m.Type: ApplicationFiled: November 27, 2017Publication date: October 3, 2019Inventors: Radu REIT, David ARREAGA-SALAS
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Publication number: 20190077070Abstract: Provided are methods and systems for manufacturing and using heat-shrink elastomeric. An example method of manufacturing a heat-shrink elastomeric element comprises providing a thermoplastic elastomeric element having a first shape; modifying the thermoplastic elastomeric element to produce a thermoset elastomeric element having the first shape; heating the thermoset elastomeric element to a temperature of at least the glass transition temperature of the thermoset elastomeric element; adjusting the first shape of the thermoset elastomeric element to produce a second shape with at least one dimension greater than that of the first shape; and cooling the thermoset elastomeric element to a temperature below that of the glass transition temperature of the thermoset elastomeric element to produce the heat-shrink elastomeric element.Type: ApplicationFiled: April 13, 2017Publication date: March 14, 2019Inventors: Michael L. FRIPP, Kejia YANG, Radu REIT, Benjamin LUND, Walter VOIT
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Publication number: 20180155500Abstract: Novel and advantageous backplanes, which include a thermoset polymer substrate, are provided. The substrate can be flexible, and the polymer of the substrate can be made by mixing multifunctional thiol monomers and specifically chosen co-monomers. The monomers and co-monomers can undergo a thiol “click” chemistry reaction to form a low-cure-stress polymer network that can be used as the substrate for an electronics backplane.Type: ApplicationFiled: August 16, 2016Publication date: June 7, 2018Inventors: Radu Reit, Adrian E. Avendano-Bolivar, David E. Arreaga-Salas, Walter E. Voit
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Publication number: 20170374736Abstract: A bulk substrate for stretchable electronics. The bulk substrate is manufactured with a process that forms a soft-elastic region of the bulk substrate. The soft-elastic region includes a strain capacity of greater than or equal to 25% and a first Young's modulus below 10% of a maximum local modulus of the bulk substrate. The process also forms a stiff-elastic region of the bulk substrate. The stiff-elastic region includes a strain capacity of less than or equal to 5% and a second Young's modulus greater than 10% of the maximum local modulus of the bulk substrate.Type: ApplicationFiled: September 7, 2017Publication date: December 28, 2017Inventors: Radu REIT, David ARREAGA-SALAS
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Publication number: 20170338254Abstract: Provided are flexible electronics stacks and methods of use. An example flexible electronics stack includes a flexible polymeric substrate film and a rigid inorganic electronic component. The flexible polymeric substrate film includes a thermoset polymer prepared by curing a monomer solution; wherein the monomer solution comprises about 25 wt % to about 65 wt % of one or more thiol monomers and from about 25 wt % to about 65 wt % of one or more co-monomers.Type: ApplicationFiled: April 21, 2017Publication date: November 23, 2017Inventors: Radu REIT, Adrian AVENDANO-BOLIVAR, David ARREAGA-SALAS