Abstract: A solar cell has a photovoltaic element having a back electrical contact, and a front current-collection grid cap structure overlying and contacting the photovoltaic solar cell element. The front current-collection grid cap structure is made of a doped semiconductor material and has openings therethrough to the photovoltaic solar cell element. An anti-reflection layer formed of an anti-reflection material overlies and contacts the photovoltaic solar cell element in the openings of the front current-collection grid cap structure. An edge stripe of a cap-top protective material, preferably the same as the anti-reflection material, overlies and contacts each top grid-cap margin of the top cap structure but not a top grid-cap central region of the top cap-structure. A metallic electrical current collector overlies and contacts the top cap structure and at least some of the edge stripe, but does not contact the anti-reflection layer and does not contact the photovoltaic solar cell element.

Abstract: A solar cell has a photovoltaic element having a back electrical contact, and a front current-collection grid cap structure overlying and contacting the photovoltaic solar cell element. The front current-collection grid cap structure is made of a doped semiconductor material and has openings therethrough to the photovoltaic solar cell element. An anti-reflection layer formed of an anti-reflection material overlies and contacts the photovoltaic solar cell element in the openings of the front current-collection grid cap structure. An edge stripe of a cap-top protective material, preferably the same as the anti-reflection material, overlies and contacts each top grid-cap margin of the top cap structure but not a top grid-cap central region of the top cap-structure. A metallic electrical current collector overlies and contacts the top cap structure and at least some of the edge stripe, but does not contact the anti-reflection layer and does not contact the photovoltaic solar cell element.

Abstract: A solar cell includes a photovoltaic energy source, a frontside array of metallic gridlines deposited upon a front face of the photovoltaic energy source, and a busbar structure in electrical continuity with the frontside array of metallic gridlines. The busbar structure has an electrical insulator layer overlying and contacting the front face of the photovoltaic energy source, and a metallic busbar layer overlying and contacting the electrical insulator layer. The metallic busbar layer is in electrical continuity with the frontside array of metallic gridlines. The solar cell is preferably a concentrator solar cell.

Abstract: A high solar flux photovoltaic concentrator receiver is disclosed for the generation of high electrical power at high efficiency for public and private use. The invention uses a wraparound interconnect to allow direct bonding of concentrator solar cells to a heat sink with solder or conductive epoxy. This approach allows series or parallel interconnection between multiple cells and provides for high thermal conductance to improve cooling the solar cells. Cooling the solar cells under high concentration of solar energy increases their electrical efficiency. A highly conductive di-electric is utilized to insulate the cell backs from the metal heat sink. The invention minimizes obscuration losses, improves thermal conduction, reduces coefficient of thermal expansion stresses, and can be produced at reduced manufacturing costs.

Abstract: A high solar flux photovoltaic concentrator receiver is disclosed for the generation of high electrical power at high efficiency for public and private use. The invention uses a wraparound interconnect to allow direct bonding of concentrator solar cells to a heat sink with solder or conductive epoxy. This approach allows series or parallel interconnection between multiple cells and provides for high thermal conductance to improve cooling the solar cells. Cooling the solar cells under high concentration of solar energy increases their electrical efficiency. A highly conductive di-electric is utilized to insulate the cell backs from the metal heat sink. The invention minimizes obscuration losses, improves thermal conduction, reduces coefficient of thermal expansion stresses, and can be produced at reduced manufacturing costs.

Abstract: A sealed electronic circuit module includes a ceramic chip carrier with a top surface, a cover having a mating surface and a seal at the periphery of the carrier between the carrier and the cover. The seal includes a non-metallic soft lower frame, preferably polyimide, atop the carrier at the periphery of the carrier. There is an upper adhesion layer shaped as a matching an upper frame facing downwardly from the cover towards the lower frame. Above the soft lower frame is a lower metal adhesion layer. Between the upper frame and the lower adhesion layer is a solder layer which has been heated to seal the cover to the chip carrier. The soft frame can include a channel through which a metal to metal via-seal is formed by the lower metal adhesion layer and the solder through the channel through the soft layer or there can be a lateral extension of the lower metal adhesion layer to a distal location beyond the periphery of the soft lower frame.

Abstract: A sealed electronic circuit module includes a ceramic chip carrier with a top surface, a cover having a mating surface and a seal at the periphery of the carrier between the carrier and the cover. The seal includes a non-metallic soft lower frame, preferably polyimide, atop the carrier at the periphery of the carrier. There is an upper adhesion layer shaped as a matching an upper frame facing downwardly from the cover towards the lower frame. Above the soft lower frame is a lower metal adhesion layer. Between the upper frame and the lower adhesion layer is a solder layer which has been heated to seal the cover to the chip carrier. The soft frame can include a channel through which a metal to metal via-seal is formed by the lower metal adhesion layer and the solder through the channel through the soft layer or there can be a lateral extension of the lower metal adhesion layer to a distal location beyond the periphery of the soft lower frame.

Abstract: A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.

Abstract: A reconfigurable solar panel system having a plurality of solar cells arranged in a predefined pattern on a printed circuit board having a predefined pattern of interconnection paths to form at least one solar cell module. The solar panel being made of at least one solar cell module and having the capability to be configured and reconfigured by programming at least one integrated circuit that communicates with each and every solar cell on the solar module. The present invention is capable of monitoring, controlling, and protecting the solar panel, as well as being reconfigured before, during and after the panel is assembled. With the present invention it is also possible to reconfigure the solar panel after it has been employed in an application, such as a satellite that is in orbit.

Abstract: A sealed electronic circuit module includes a ceramic chip carrier with a top surface, a cover having a mating surface and a seal at the periphery of the carrier between the carrier and the cover. The seal includes a non-metallic soft lower frame, preferably polyimide, atop the carrier at the periphery of the carrier. There is an upper adhesion layer shaped as a matching an upper frame facing downwardly from the cover towards the lower frame. Above the soft lower frame is a lower metal adhesion layer. Between the upper frame and the lower adhesion layer is a solder layer which has been heated to seal the cover to the chip carrier. The soft frame can include a channel through which a metal to metal via-seal is formed by the lower metal adhesion layer and the solder through the channel through the soft layer or there can be a lateral extension of the lower metal adhesion layer to a distal location beyond the periphery of the soft lower frame.

Abstract: An electronic chip assembly having the following components: a substrate having electrical conductors therein; an electronic circuit chip affixed face down to the substrate so as to make electrical connection to the conductors; a male framing member, compliantly adhered to the substrate; a lid having a female channel, the channel having sidewalls, the channel being disposed on or within said lid for receiving said male framing member; and sealant material disposed within the channel between the sidewalls of said channel and the female lid sealing member.

Abstract: This invention relates to an apparatus or device for exchanging heat from electronic components or heat sinks, and method thereof. More particularly, this invention is directed to heat sinks which incorporates an innovative thermo-mechanically actuated device which modulates the capability of the heat sink to dissipate heat, and method thereof.

Abstract: A method and apparatus for electronic chip assembly maintains a thin gap spacing between the chip and the lid or heat sink and provides for the electronic chip to operate at a relatively cool temperature. The thermal performance is enhanced by a thermal interface material provided in the thin gap and maintained at a minimal thickness as a result of the structure and assembly process. A thin thermal interface material layer may be achieved with a compression step to compress the thermal interface material before the sealant is cured. In addition, a vent hole is provided in the assembly to prevent pressure build-up inside the module during sealant cure. As the sealant is cured, the gap spacing is maintained, further compression of the thermal interface material is not required, and seal defects are prevented.

Abstract: The present invention relates generally to a new method for improving the reliability of cooling designs using thermal paste to cool chips in semiconductor modules and structure thereof. More particularly, the invention encompasses a structure and a method that uses surface chemistry modification of the inside of the thermal cooling caps where it contacts thermal paste. The internal surface of the cap is modified by embedding particles that have the same chemical composition as one or more of the solids used in the thermal paste. The particles may be embedded in the cap by casting, grit blasting, or pressing the particles permanently into the surface.

Abstract: In a direct lid attach structure incorporating thermally conductive material between a lid and an electronic circuit chip, there are provided a number of apertures in the lid. These apertures are provided directly opposite disks or pads disposed on the substrate to which the chip is attached. A hardenable adhesive such as an epoxy is disposed through the apertures and hardened in place so as to provide a bond between the lid and the underlying pad which has been previously affixed to the substrate to which the chip is attached with a compliant adhesive. There is thus provided an electronic chip assembly which allows bonded chip-to-lid thermal interfaces to be used with LGA interconnection techniques. The support structure mitigates the mechanical loads associated with LGA socketing which could otherwise damage the substrate and affect the integrity of the bonded thermal interface.

Abstract: Tolerances in chip, substrate and hardware dimensions are accommodated by means of a floating sealing structure to insure that compliant thermally conductive paste disposed between the chip and its lid is as trim as possible in order to reduce thermal resistance of the paste so as to be able to run the chip at a cooler temperature. Standoffs are also preferably employed to insure proper paste gap thickness.

Abstract: The present invention relates generally to a new method for improving the reliability of cooling designs using thermal paste to cool chips in semiconductor modules and structure thereof. More particularly, the invention encompasses a structure and a method that uses surface chemistry modification of the inside of the thermal cooling caps where it contacts thermal paste. The internal surface of the cap is modified by embedding particles that have the same chemical composition as one or more of the solids used in the thermal paste. The particles may be embedded in the cap by casting, grit blasting, or pressing the particles permanently into the surface.

Abstract: A thermal conduction module for cooling one or more integrated circuit chips mounted on a substrate is described. At least one shim is disposed between the base plate and the cover plate of the module to establish a predetermined dimension between the cover plate and the integrated circuit chips mounted on the substrate for insertion of a thermal paste. The shims may be metal, engineered plastic, or thermally and electrically conductive or nonconductive creep resistant materials able to withstand the stress and load within the module over time. The shim may be a plurality of shims having the same thickness or a plurality of shims having a multiplicity of thicknesses. Most preferably, the shim conforms to the periphery of the cover plate or base plate. A method of determining the proper shim thickness is also described wherein an initial reading of the thickness of the cover plate and base plate of the module is obtained.

Abstract: A device and method for hermetically sealing an integrated circuit chip between a substrate and a lid while providing effective dissipation of heat generated by the integrated circuit chip. The device includes an integrated circuit chip, carrier substrate, interface coolant, and a lid. The integrated circuit chip is attached to the top of the carrier substrate. The interface coolant is disposed on the top of the integrated circuit chip and the lid is placed on top of the carrier substrate/integrated circuit chip combination and contacts the interface coolant. The interface coolant provides a thermal path for conducting heat from the integrated circuit chip to the lid. The substrate is attached to a circuit board by a ceramic ball grid array (CBGA) or a ceramic column grid array (CCGA).

Abstract: A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.