Abstract: The present invention provides a thermally enhanced molded cavity package (10) having a package body (12) with upper (40) and lower (42) sections. The package body (12) has a cavity (22) with the cavity opening (32) in the upper section (40) of the package body (12). The present package (10) includes a lead frame (14) with a plurality of individual leads (16) that are external to the cavity (22) and a plurality of lead fingers (28) that are internal to the cavity (22). The present package (10) also includes a heat spreader (34) for increasing heat dissipation from the package (10) in the lower section (42) of the package body (12) and coupled to the lead frame (14). The heat spreader (34) has a first surface (26) forming a floor of the cavity upon which a microcircuit chip (24) may be mounted and a second surface forming a base (36) of the package body (12).