Abstract: An automated wafer lapping system including a robot which loads wafers from a cassette into a wafer carrier on a lapping machine one at a time and one after another. The robot is capable of delivering lapped wafers to a thickness gauging device for measuring the wafer thickness and recalibrating the lapping machine between each run. Openings in the wafer carriers for receiving wafers are sized closely to the wafer for minimal relative motion between the wafer and carrier. A centering jig and search program for the robot facilitate fast location of the wafers in the openings. The lapping system also inspects wafers for defects and sorts them accordingly after lapping.

Abstract: The present invention relates to a combined process for separating and converting asphaltenes of high molecular weight and high softening point from heavy hydrocarbon material containing asphaltenes by a process that combines a deasphalting method to produce solid asphaltenes and a continuous coking procedure for the solid asphaltenes. The combined process converts the material into more valuable liquid hydrocarbon products of lower molecular weight and coke.