Patents by Inventor Raghavendra Doddi

Raghavendra Doddi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11755080
    Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: September 12, 2023
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
  • Patent number: 11551891
    Abstract: Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: January 10, 2023
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Raghavendra Doddi, Prasanna Pichumani, Sachin Bedare, Bijendra Singh, Gopinath Kandasamy
  • Publication number: 20220113759
    Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 14, 2022
    Applicant: Intel Corporation
    Inventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
  • Patent number: 11231757
    Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: January 25, 2022
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
  • Patent number: 11206748
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Raghavendra Doddi, Ravishankar Srikanth, Kathiravan D, Prakash Kurma Raju
  • Publication number: 20210218845
    Abstract: Techniques for video conferencing are disclosed. In one embodiment, a mirror assembly can be used to position a mirror in front of a camera, reflecting a view of the camera downward towards a whiteboard or other drawing surface, allowing a user to show a drawing during a video conference. In another embodiment, video data and audio data of a user in a video conference can be analyzed to determine what portions of the video data and audio data should be transmitted to a remote participant in the video conference. Unintentional input supplied by the user in the video data and audio data may be used to determine which portions of the video data and audio data to transmit.
    Type: Application
    Filed: March 26, 2021
    Publication date: July 15, 2021
    Inventors: Aleksander Magi, Soethiha Soe, Marko Bartscherer, Prakash Kurma Raju, Arvind Sundaram, Ayeshwarya B. Mahajan, Akarsha Rajeshwar Kadadevaramath, Gokul V. Subramaniam, Raghavendra Doddi, Prasanna Pichumani
  • Publication number: 20210103317
    Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.
    Type: Application
    Filed: November 21, 2020
    Publication date: April 8, 2021
    Applicant: Intel Corporation
    Inventors: Prakash Kurma Raju, Samarth Alva, Bhavaneeswaran Anbalagan, Triplicane Gopikrishnan Babu, Prasanna Pichumani, Raghavendra Doddi, Sudheera Sudhakar, Ritu Bawa
  • Publication number: 20200120832
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.
    Type: Application
    Filed: December 13, 2019
    Publication date: April 16, 2020
    Applicant: Intel Corporation
    Inventors: Raghavendra Doddi, Ravishankar Srikanth, Kathiravan D, Prakash Kurma Raju
  • Publication number: 20190326081
    Abstract: Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.
    Type: Application
    Filed: June 27, 2019
    Publication date: October 24, 2019
    Applicant: Intel Corporation
    Inventors: Prakash Kurma Raju, Raghavendra Doddi, Prasanna Pichumani, Sachin Bedare, Bijendra Singh, Gopinath Kandasamy