Abstract: A spherical electromagnetic machine includes a spherical stator, a plurality of longitudinal slots, a plurality of latitudinal slots, a plurality of longitudinal coils, a plurality of latitudinal coils, a first hemispherical shell rotor, and a second hemispherical shell rotor. The longitudinal slots and latitudinal slots are formed in, and are spaced evenly around, the outer surface. The longitudinal coils are disposed within a different one of the longitudinal slots. The latitudinal coils are disposed within a different one of the latitudinal slots. The first and second hemispherical shell rotors are mounted for rotation relative to the spherical stator body and have magnets on their inner surfaces. A Lorentz force causes movement of the first and second hemispherical shell rotors when electrical current is supplied to one or more of the longitudinal coils or to one or more of the latitudinal coils.

Abstract: A spherical electromagnetic machine includes a spherical stator, a plurality of longitudinal slots, a plurality of latitudinal slots, a plurality of longitudinal coils, a plurality of latitudinal coils, a first hemispherical shell rotor, and a second hemispherical shell rotor. The longitudinal slots and latitudinal slots are formed in, and are spaced evenly around, the outer surface. The longitudinal coils are disposed within a different one of the longitudinal slots. The latitudinal coils are disposed within a different one of the latitudinal slots. The first and second hemispherical shell rotors are mounted for rotation relative to the spherical stator body and have magnets on their inner surfaces. A Lorentz force causes movement of the first and second hemispherical shell rotors when electrical current is supplied to one or more of the longitudinal coils or to one or more of the latitudinal coils.

Abstract: A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly.

Abstract: A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly.

Abstract: A light emitting diode (LED) lamp assembly includes a base including an electrical connector adapted to electrically engage a socket. A thermally conductive enclosure is coupled to the base, and a printed circuit board is disposed within the thermally conductive enclosure. The printed circuit board is operably electrically connected with the base and the electrical connector and thermally coupled to the enclosure. An LED is disposed on an exterior surface of the housing and electrically coupled to the printed circuit board. The thermally conductive enclosure is adapted to mechanically and thermally engage the socket to sink heat generated by the printed circuit board and the light source from the lamp assembly into the socket and an associated reflector.

Abstract: A lighting device for a vehicle. The lighting device has a PAR form fit, and includes a housing with a circumferential wall. The circumferential wall has an inner surface, an outer surface and an opening for light emission. The device includes a plurality of light emitting semiconductor devices. The plurality of light emitting semiconductor devices are mounted on a surface of a substrate such that the peak emitted light intensity direction of each one of the plurality of light emitting semiconductor devices is directed toward the central axis. A second surface of the substrate is in thermal contact with the inner surface of the circumferential wall. The device also includes a plurality of curved reflecting surfaces arranged between the plurality of light emitting semiconductor devices and the central axis, arranged to reflect light emitted by the plurality of light emitting semiconductor devices through the opening.

Abstract: A lighting device for a vehicle. The lighting device has a PAR form fit, and includes a housing with a circumferential wall. The circumferential wall has an inner surface, an outer surface and an opening for light emission. The device includes a plurality of light emitting semiconductor devices. The plurality of light emitting semiconductor devices are mounted on a surface of a substrate such that the peak emitted light intensity direction of each one of the plurality of light emitting semiconductor devices is directed toward the central axis. A second surface of the substrate is in thermal contact with the inner surface of the circumferential wall. The device also includes a plurality of curved reflecting surfaces arranged between the plurality of light emitting semiconductor devices and the central axis, arranged to reflect light emitted by the plurality of light emitting semiconductor devices through the opening.

Abstract: An LED panel includes a support having a first side, a second side opposite the first side, and a window that extends from the first side to the second side. An LED is affixed to the first side. A diverter affixed to the second side. The diverter includes an angled portion, wherein the angled portion extends over a window portion that is less than all of the window.

Abstract: A light emitting diode (LED) lamp assembly includes a base including an electrical connector adapted to electrically engage a socket. A thermally conductive enclosure is coupled to the base, and a printed circuit board is disposed within the thermally conductive enclosure. The printed circuit board is operably electrically connected with the base and the electrical connector and thermally coupled to the enclosure. An LED is disposed on an exterior surface of the housing and electrically coupled to the printed circuit board. The thermally conductive enclosure is adapted to mechanically and thermally engage the socket to sink heat generated by the printed circuit board and the light source from the lamp assembly into the socket and an associated reflector.

Abstract: An LED panel includes a support having a first side, a second side opposite the first side, and a window that extends from the first side to the second side. An LED is affixed to the first side. A diverter affixed to the second side. The diverter includes an angled portion, wherein the angled portion extends over a window portion that is less than all of the window.