Abstract: A method and device are for monitoring electric components in a pick-and-place device for substrates. The underside of a pick-up is monitored by an optical scanner during the pick-up phase and during the placing phase of a component. A lift drive for the pick-up is provided with a position sensor that is linked with a control device. The scanner emits and receives a scanning beam oriented transversally to the direction of lift and is likewise coupled with the control device, thereby allowing monitoring of the underside of the pick-up in a direct time-related manner with the picking and placing of the component. The various lift positions are saved and compared when a threshold value of the received scanning beam is exceeded so that the inventive device also allows for a monitoring of the height of the component.

Abstract: A placing device and a method for placing objects onto substrates are suited for obtaining both very small as well as very large placement forces of the object exerted on the substrate. To this end, a gripper, by way of which the object can be picked up, is pretensioned with regard to a holder in a direction of placement. The pretensioning ensues via a first coupling element provided on the holder and via a second coupling element provided on the gripper. An electrical and/or magnetic field is generated between the first and the second coupling element and effects an action of force between the holder and the gripper. This enables a predetermined placement force to be attained when using the gripper to place the object.

Abstract: Substrates are supported by height-adjustable supporting pins in automated equipping units. The supporting pins are composed of a tip and a foot part that is spring-borne relative to the tip. When the supporting pins are placed against an underside of the substrate, the supporting pins individually adapt to the contour of the underside of the substrate. The height position of the supporting pins is subsequently fixed. As a result, substrates having position and surface variations can be protected against sagging upon placement of components on the substrates during an automated equipping process.

Abstract: A pressure control means comprising a jet pump (1) whose pressure state in a branch flow duct (4) may be changed by means of a choke (6), which influences the spent air flow from the jet pump (1). This renders possible a rapid and stepless variation of the pressure state in the branch flow duct (4).

Abstract: The invention relates to a method and to a device for monitoring electric components in a pick and place device for substrates. The underside of a pick-up (2) is monitored by an optical scanning means (7) during the pick-up phase and during the placing phase of a component (10). A lift drive (3) for the pick-up (2) is provided with a position sensor (5) that is linked with a control device (6). The scanning means (7) emits and receives a scanning beam (22) oriented transversally to the direction of lift and is likewise coupled with the control device (6), thereby allowing to monitor the underside of the pick-up (2) in a direct time-related manner with the picking and placing of the component (10). The various lift positions are saved and compared when a threshold value of the received scanning beam (22) is exceeded so that the inventive device also allows for a monitoring of the height of the component.

Abstract: A pressure control means comprising a jet pump (1) whose pressure state in a branch flow duct (4) may be changed by means of a choke (6), which influences the spent air flow from the jet pump (1). This renders possible a rapid and stepless variation of the pressure state in the branch flow duct (4).

Abstract: A placement force sensor for pick-and-place devices for picking and placing components onto substrates includes a component gripper arranged on a holder. A force sensor is further arranged between the holder and the component gripper), so that the placement force with which the component is placed onto the substrate can be sensed directly by the force sensor. Very small moving masses achieve high measuring accuracy and reliability of the placement force sensor. The provision of a spring in the flux of force between the component gripper and the holder allows the accuracy to be increased even further.