Patents by Inventor Rainer Kurtz

Rainer Kurtz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10010958
    Abstract: A soldering module for a soldering system for selective wave soldering, having at least one first and one second solder pot, wherein the solder pots are displaceable along an x-axis by means of an x-axis drive, along a y-axis by means of a y-axis drive, and along a z-axis by means of a z-axis drive, wherein the axes are all arranged orthogonally in relation to each other; wherein two y-axis drives and two moving devices are provided on which the solder pots are displaceable along the y-axis by means of the y-axis drives; wherein a first moving device is associated with the first solder pot, and wherein a second moving device which is different from the first moving device is associated with the second solder pot.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: July 3, 2018
    Assignee: ERSA GmbH
    Inventors: Rainer Kurtz, Michael Schaefer
  • Publication number: 20170189981
    Abstract: A soldering module for a soldering system for selective wave soldering, having at least one first and one second solder pot, wherein the solder pots are displaceable along an x-axis by means of an x-axis drive, along a y-axis by means of a y-axis drive, and along a z-axis by means of a z-axis drive, wherein the axes are all arranged orthogonally in relation to each other; wherein two y-axis drives and two moving devices are provided on which the solder pots are displaceable along the y-axis by means of the y-axis drives; wherein a first moving device is associated with the first solder pot, and wherein a second moving device which is different from the first moving device is associated with the second solder pot.
    Type: Application
    Filed: September 30, 2016
    Publication date: July 6, 2017
    Inventors: Rainer KURTZ, Michael Schaefer
  • Patent number: 8156649
    Abstract: A gas turbine engine hot gas component repair method for defects that do not extend through the thickness of the component is provided. First defects are removed by machining a cavity in the surface of a component. Coupons, fittable within the cavities are manufactured, are for example coated with brazing medium on an inner surface and then joined to the component by joining means such as laser metal forming. The joint holds the coupon during later heat treatment, thereby eliminating a need for holding aids. Before heat treatment, a further brazing medium can be applied to the surface of the coupon overlapping onto the component. A single heat treatment, brazing the coupon to the component and, brazing the brazing medium to the outer surface of the coupon can, then be used to complete the repair.
    Type: Grant
    Filed: April 8, 2009
    Date of Patent: April 17, 2012
    Assignee: Alstom Technology Ltd
    Inventors: Simone Hövel, Alexander Stankowski, Günter Ambrosy, Matthias Hoebel, Alexander Schnell, Hans Bissig, Rainer Kurtz
  • Publication number: 20090255117
    Abstract: A gas turbine engine hot gas component repair method for defects that do not extend through the thickness of the component is provided. First defects are removed by machining a cavity in the surface of a component. Coupons, fittable within the cavities are manufactured, are for example coated with brazing medium on an inner surface and then joined to the component by joining means such as laser metal forming. The joint holds the coupon during later heat treatment, thereby eliminating a need for holding aids. Before heat treatment, a further brazing medium can be applied to the surface of the coupon overlapping onto the component. A single heat treatment, brazing the coupon to the component and, brazing the brazing medium to the outer surface of the coupon can, then be used to complete the repair.
    Type: Application
    Filed: April 8, 2009
    Publication date: October 15, 2009
    Applicant: ALSTOM Technology Ltd.
    Inventors: Simone Hovel, Alexander Stankowski, Gunter Ambrosy, Matthias Hoebel, Alexander Schnell, Hans Bissig, Rainer Kurtz
  • Publication number: 20080283308
    Abstract: The invention pertains to a device for determining the relative position in the X-Y plane between two essentially flat elements that are spaced apart in the Z-direction and are essentially arranged on top of one another, wherein said device features at least one optical sensor that is arranged between the elements and is able to sense at least two points of the mutually facing surfaces of the elements, as well as an evaluation unit, in which the images of the points can be evaluated with respect to their relative position in the X-Y plane. In this case, the optical sensor features at least one line sensor that can be displaced relative to the two elements in such a way that the mutually facing surfaces of the elements can be optically scanned at least in sections in the manner of a scanner.
    Type: Application
    Filed: August 11, 2006
    Publication date: November 20, 2008
    Inventors: Rainer Kurtz, Mark Cannon, Wolfram Hubsch, Harald Grumm
  • Patent number: 6524100
    Abstract: A facility for the thermal treatment of workpieces has a processing or heating chamber and at least one transport device, extending essentially completely through the processing or heating chamber, with which the workpieces to be treated can be transported through the processing or heating chamber. At least two processing or heating levels are hereby located on top of one another in the processing or heating chamber, with each processing or heating level having at least one separate transport device. This type of facility can preferably be used as a soldering facility, particularly a reflow soldering facility, or as a facility for the hardening or drying of plastics or adhesives.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: February 25, 2003
    Assignee: ERSA GmbH
    Inventors: Rainer Kurtz, Bernd Schenker, Richard Kressmann
  • Publication number: 20020001787
    Abstract: A facility for the thermal treatment of workpieces has a processing or heating chamber and at least one transport device, extending essentially completely through the processing or heating chamber, with which the workpieces to be treated can be transported through the processing or heating chamber. At least two processing or heating levels are hereby located on top of one another in the processing or heating chamber, with each processing or heating level having at least one separate transport device. This type of facility can preferably be used as a soldering facility, particularly a reflow soldering facility, or as a facility for the hardening or drying of plastics or adhesives.
    Type: Application
    Filed: June 28, 2001
    Publication date: January 3, 2002
    Inventors: Rainer Kurtz, Bernd Schenker, Richard Kressmann