Abstract: Disclosed is a clip for fastening a first element to a second element, the clip having a head and a tip and a first side and a second side, wherein the first side extends from the head toward the tip and the second side extends from the head toward the tip. A first sidewall extends from the first side toward the second side and a second sidewall extends from the second side toward the first side, the clip having a latching projection projecting in a latching direction and having a latching face facing the latching direction. The latching face is arranged in a plane which is not parallel to the first sidewall and/or not parallel to the second sidewall. The clip further includes a latching receptacle.

Abstract: Disclosed is a clip for fastening a first element to a second element, the clip having a head and a tip and a first side and a second side, wherein the first side extends from the head toward the tip and the second side extends from the head toward the tip. A first sidewall extends from the first side toward the second side and a second sidewall extends from the second side toward the first side, the clip having a latching projection projecting in a latching direction and having a latching face facing the latching direction. The latching face is arranged in a plane which is not parallel to the first sidewall and/or not parallel to the second sidewall. The clip further includes a latching receptacle.

Abstract: A method for producing a smartcard body for receiving a semiconductor chip includes forming at least one lead frame of the smartcard body in a carrier material connected by at least one material strip. Surrounding the at least one lead frame is an electrically insulating casing having a cavity for receiving the semiconductor chip. Either before or during the forming of the casing, the at least one material strip is separated or severed, so that the material strip is separated into a first strip part connected with the carrier material and a second strip part connected with the lead frame forming an interspace there between. When forming the casing at least a portion of the first strip part as well as at least a portion of the second strip part of the at least one material strip is comprised by the casing.

Abstract: A method for producing a smartcard body for receiving a semiconductor chip includes forming at least one lead frame of the smartcard body in a carrier material connected by at least one material strip. Surrounding the at least one lead frame is an electrically insulating casing having a cavity for receiving the semiconductor chip. Either before or during the forming of the casing, the at least one material strip is separated or severed, so that the material strip is separated into a first strip part connected with the carrier material and a second strip part connected with the lead frame forming an interspace there between. When forming the casing at least a portion of the first strip part as well as at least a portion of the second strip part of the at least one material strip is comprised by the casing.