Patents by Inventor Rainer Patzelt

Rainer Patzelt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Expandable circuit carrier
    Patent number: 8654536
    Abstract: The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor. The present invention further relates to an expandable circuit carrier which can be produced by the method.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: February 18, 2014
    Assignee: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
    Inventors: Andreas Ostmann, Manuel Seckel, Thomas Löher, Dionysios Manessis, Rainer Patzelt
  • Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate
    Patent number: 8042724
    Abstract: A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The microelectronic component has an electrical contact face that is accessible on a surface of the microelectronic component. An electrically conducting bump is applied to the electrical contact face of the microelectronic component. A metal foil or metal coat is applied via a coating of an insulating binder to the surface of the circuit board under an action of pressure and/or heat so that the electrically conducting bump penetrates the coating of the insulating binder to make the electrical connection between the metal foil or metal coat and the electrical contact face.
    Type: Grant
    Filed: August 6, 2007
    Date of Patent: October 25, 2011
    Assignees: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V., Technische Universitaet Berlin
    Inventors: Andreas Ostmann, Alexander Neumann, Dionysios Manessis, Rainer Patzelt
  • Method for the production of expandable circuit carrier and expandable circuit carrier
    Publication number: 20080257589
    Abstract: The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor. The present invention further relates to an expandable circuit carrier which can be produced by the method.
    Type: Application
    Filed: November 15, 2007
    Publication date: October 23, 2008
    Inventors: Andreas Ostmann, Manuel Seckel, Thomas Loher, Dionysios Manessis, Rainer Patzelt
  • Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate
    Publication number: 20080061115
    Abstract: A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The microelectronic component has an electrical contact face that is accessible on a surface of the microelectronic component. An electrically conducting bump is applied to the electrical contact face of the microelectronic component. A metal foil or metal coat is applied via a coating of an insulating binder to the surface of the circuit board under an action of pressure and/or heat so that the electrically conducting bump penetrates the coating of the insulating binder to make the electrical connection between the metal foil or metal coat and the electrical contact face.
    Type: Application
    Filed: August 6, 2007
    Publication date: March 13, 2008
    Inventors: Andreas Ostmann, Alexander Neumann, Dionysios Manessis, Rainer Patzelt