Patents by Inventor Raita Nakanishi

Raita Nakanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230084290
    Abstract: An antenna device includes a printed circuit board including a circuit configured to determine a position based on a navigation signal, and a dipole antenna element mounted on the printed circuit board and configured to receive the navigation signal. Further, the antenna device includes an L-shaped parasitic antenna element, wherein the dipole antenna element and a long-side element of the L-shaped parasitic antenna element are placed parallel to each other but at a position not in line with each other, and an end of a short-side element of the L-shaped antenna element is placed in close proximity to an end of the dipole antenna element.
    Type: Application
    Filed: December 25, 2020
    Publication date: March 16, 2023
    Applicant: NEC Platforms, Ltd.
    Inventors: Shun HIRANO, Masato TSUCHIYA, Shinya YAMAMOTO, Raita NAKANISHI, Tomoyuki KUGE
  • Patent number: 7564129
    Abstract: A power semiconductor module according to the present invention includes: a planar base plate having a plurality of insulated substrates soldered on the top surface, the insulated substrates each having power semiconductor elements to be cooled mounted thereon; a plurality of radiation fins projecting from the bottom surface side of the base plate; and a peripheral wall projecting from the bottom surface side of the base plate so as to surround the radiation fins, the projecting length of the radiation fins is less than or equal to that of the peripheral wall, and the peripheral wall has end surfaces present in the same plane.
    Type: Grant
    Filed: March 24, 2008
    Date of Patent: July 21, 2009
    Assignee: Nichicon Corporation
    Inventors: Raita Nakanishi, Toshiaki Kawamura
  • Publication number: 20080237847
    Abstract: A power semiconductor module according to the present invention includes: a planar base plate having a plurality of insulated substrates soldered on the top surface, the insulated substrates each having power semiconductor elements to be cooled mounted thereon; a plurality of radiation fins projecting from the bottom surface side of the base plate; and a peripheral wall projecting from the bottom surface side of the base plate so as to surround the radiation fins, the projecting length of the radiation fins is less than or equal to that of the peripheral wall, and the peripheral wall has end surfaces present in the same plane.
    Type: Application
    Filed: March 24, 2008
    Publication date: October 2, 2008
    Applicant: Nichicon Corporation
    Inventors: Raita Nakanishi, Toshiaki Kawamura