Patents by Inventor Raj Sekar SETHU

Raj Sekar SETHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Relating to passivation layers
    Patent number: 11929296
    Abstract: A method of forming a semiconductor device, the method including the steps of providing a metal component having a top surface, and providing a passivation layer over the metal component such that an outer layer of the passivation layer is substantially planar and does not extend below the top surface of the metal component.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: March 12, 2024
    Assignee: X-FAB SARAWAK SDN. BHD.
    Inventors: Raj Sekar Sethu, Peng Yang, Kumar Sambhawam
  • RELATING TO PASSIVATION LAYERS
    Publication number: 20220336308
    Abstract: A method of forming a semiconductor device, the method including the steps of providing a metal component having a top surface, and providing a passivation layer over the metal component such that an outer layer of the passivation layer is substantially planar and does not extend below the top surface of the metal component.
    Type: Application
    Filed: July 5, 2022
    Publication date: October 20, 2022
    Applicant: X-FAB Sarawak Sdn. Bhd.
    Inventors: Raj Sekar SETHU, Peng YANG, Kumar SAMBHAWAM
  • Relating to passivation layers
    Patent number: 11469151
    Abstract: A semiconductor device includes a metal component covered by a passivation layer, wherein the metal component has a top surface and the passivation layer includes an outer layer which is substantially planar. The outer layer of the passivation layer does not extend below the top surface of the metal component.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: October 11, 2022
    Assignee: X-FAB SARAWAK SDN. BHD.
    Inventors: Raj Sekar Sethu, Peng Yang, Kumar Sambhawam
  • RELATING TO PASSIVATION LAYERS
    Publication number: 20200111718
    Abstract: A semiconductor device includes a metal component covered by a passivation layer, wherein the metal component has a top surface and the passivation layer includes an outer layer which is substantially planar. The outer layer of the passivation layer does not extend below the top surface of the metal component.
    Type: Application
    Filed: September 30, 2019
    Publication date: April 9, 2020
    Applicant: X-FAB Sarawak Sdn. Bhd.
    Inventors: Raj Sekar SETHU, Peng YANG, Kumar SAMBHAWAM