Patents by Inventor Rajan Eadara
Rajan Eadara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9963588Abstract: An article is reinforced by applying to it a thermally curable composition of a resin mixture of 10% to 60% by weight of a diglycidyl ether of bisphenol-A, 5% to 25% by weight of an epoxy novolac, and 5% to 25% by weight of a reinforcement material comprising carbon fibers. Following application, the composition is cured. In some instances, at least a portion of the diglycidyl ether of bisphenol-A and/or the epoxy phenyl novolac resin may be adducted with an elastomer.Type: GrantFiled: April 30, 2015Date of Patent: May 8, 2018Assignee: Diversified Chemical Technologies, Inc.Inventors: Rajan Eadara, Biju Philip, Roy Jacob, Joribeth Joseff, Arnold Joseff
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Publication number: 20150322216Abstract: An article is reinforced by applying to it a thermally curable composition of a resin mixture of 10% to 60% by weight of a diglycidyl ether of bisphenol-A, 5% to 25% by weight of an epoxy novolac, and 5% to 25% by weight of a reinforcement material comprising carbon fibers. Following application, the composition is cured. In some instances, at least a portion of the diglycidyl ether of bisphenol-A and/or the epoxy phenyl novolac resin may be adducted with an elastomer.Type: ApplicationFiled: April 30, 2015Publication date: November 12, 2015Inventors: Rajan Eadara, Biju Philip, Roy Jacob, Joribeth Joseff, Arnold Joseff
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Publication number: 20090277716Abstract: A constrained layer, composite structure for damping acoustic vibrations includes an extensional layer comprised of a first polymeric material, and a constraining layer of a second polymeric material. The modulus of elasticity of the constraining layer is greater than that of the extensional layer. In use, the structure is disposed on the surface of an article in which acoustic vibrations are to be damped so that the extension layer overlies the surface. Also disclosed are methods for preparing the structure, including automated methods.Type: ApplicationFiled: June 10, 2009Publication date: November 12, 2009Inventors: Rajan Eadara, Roy Jacob, Anthony Konovaliv, Arnold Joseff, Biju Philip
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Patent number: 7448671Abstract: A two layer sound deadening material is formed from pumpable material applied through a pair of extrusion heads mounted on a single mount. A robot, used in high speed mass production automotive assembly lines, moves the door panel relative to the stationary extrusion heads to allow the simultaneous application of the two layers onto the interior side of the door. The first layer is formed of a thermosetting composition containing epoxy, rubber and a catalyst and adheres directly to the door panel. The second layer is formed of a thermosetting composition containing an epoxy resin, a thermo plastic copolymer and a curative which will adhere directly to the first layer due to similar chemical structures. The second layer is positioned such that the edges thereof are inside of the corresponding edges of the first layer to prevent read through transmission of noise from the body or door panel.Type: GrantFiled: December 21, 2004Date of Patent: November 11, 2008Assignee: Ford Global Technologies, LLCInventors: Craig Rackers, Jeff Crist, Dan Ondrus, Stephen Ludwig, Rajan Eadara, Kirsen Quan, Roy Jacob, Anthony Konovaliv
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Publication number: 20070141281Abstract: Thermal insulation is provided to a subsea pipeline by disposing a thermally insulating tape on the pipeline. The insulating tape has a layer of a syntactic foam composition disposed between layers of a thermoplastic polymer. The syntactic foam composition may be a curable composition, and this composition may be cured either before or after the tape is applied to the pipeline. Application of the tape may be made prior to the deployment of the pipeline in a subsea location or after the pipeline is disposed. The tape may be configured to include attachment features which aid in retaining the tape on the pipeline. Also disclosed are specific tape compositions for insulating subsea pipelines.Type: ApplicationFiled: November 30, 2006Publication date: June 21, 2007Inventors: Rajan Eadara, Arnold Joseff, Reuben Tandoh, Roy Jacobs, Joribeth Joseff, Jeven Joseff, Gaurav Chalana
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Publication number: 20060054385Abstract: A two layer sound deadening material is formed from pumpable material applied through a pair of extrusion heads mounted on a single mount. A robot, used in high speed mass production automotive assembly lines, moves the door panel relative to the stationary extrusion heads to allow the simultaneous application of the two layers onto the interior side of the door. The first layer is formed of a thermosetting composition containing epoxy, rubber and a catalyst and adheres directly to the door panel. The second layer is formed of a thermosetting composition containing an epoxy resin, a thermo plastic copolymer and a curative which will adhere directly to the first layer due to similar chemical structures. The second layer is positioned such that the edges thereof are inside of the corresponding edges of the first layer to prevent read through transmission of noise from the body or door panel.Type: ApplicationFiled: December 21, 2004Publication date: March 16, 2006Inventors: Craig Rackers, Jeff Crist, Dan Ondrus, Stephen Ludwig, Rajan Eadara, Kirsen Quan, Roy Jacob, Anthony Konovaliv
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Publication number: 20060040096Abstract: A constrained layer, composite structure for damping acoustic vibrations includes an extensional layer comprised of a first polymeric material, and a constraining layer of a second polymeric material. The modulus of elasticity of the constraining layer is greater than that of the extensional layer. In use, the structure is disposed on the surface of an article in which acoustic vibrations are to be damped so that the extension layer overlies the surface. Also disclosed are methods for preparing the structure, including automated methods.Type: ApplicationFiled: August 18, 2005Publication date: February 23, 2006Inventors: Rajan Eadara, Roy Jacob, Anthony Konovaliv, Arnold Joseff, Biju Philip
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Patent number: 6861464Abstract: A two component, curable hot melt adhesive system includes a first hot melt adhesive formulation which has a softening temperature greater than room temperature and which includes a first component of a curable adhesive therein. The system includes a second hot melt adhesive formulation which has a softening temperature which is greater than room temperature and which includes a second component of a curable adhesive therein. The second component is reactive with the first component to provide a cured adhesive bond. In use, the two formulations are heated to a temperature above their softening temperature and are contacted so as to cause mixing. The mixture cools to provide a thermoplastic bond which subsequently cures to provide a permanent adhesive bond. While the first and the second component individually perform as hot melt adhesives, combining the first and the second gives enhanced adhesive performance in extended temperature ranges.Type: GrantFiled: July 19, 2002Date of Patent: March 1, 2005Assignee: Diversified Chemical Technologies, Inc.Inventors: Rajan Eadara, Mooil Chung, David Wen-Lung Chang, Sunny K. George, Patrick A. Ohaka, Joribeth E. Joseff, Yushin Ahn
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Patent number: 6734263Abstract: The present invention provides a polymeric material and a process for making the polymeric material. The polymeric material has adhesive and noise abatement properties over a broad temperature range. Further, the material is chip and corrosion resistant and provides metal panel reinforcement.Type: GrantFiled: April 19, 2002Date of Patent: May 11, 2004Assignee: Diversified Chemical Technologies, Inc.Inventors: Rajan Eadara, Roy P. Jacob, Yushin Ahn, Biju Philip, Jori Joseff
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Publication number: 20040014866Abstract: A two component, curable hot melt adhesive system includes a first hot melt adhesive formulation which has a softening temperature greater than room temperature and which includes a first component of a curable adhesive therein. The system includes a second hot melt adhesive formulation which has a softening temperature which is greater than room temperature and which includes a second component of a curable adhesive therein. The second component is reactive with the first component to provide a cured adhesive bond. In use, the two formulations are heated to a temperature above their softening temperature and are contacted so as to cause mixing. The mixture cools to provide a thermoplastic bond which subsequently cures to provide a permanent adhesive bond. While the first and the second component individually perform as hot melt adhesives, combining the first and the second gives enhanced adhesive performance in extended temperature ranges.Type: ApplicationFiled: July 19, 2002Publication date: January 22, 2004Inventors: Rajan Eadara, Mooil Chung, David Wen-Lung Chang, Sunny K. George, Patrick A. Ohaka, Joribeth E. Joseff, Yushin Ahn
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Publication number: 20030119987Abstract: The present invention provides a polymeric material and a process for making the polymeric material. The polymeric material has adhesive and noise abatement properties over a broad temperature range. Further, the material is chip and corrosion resistant and provides metal panel reinforcement.Type: ApplicationFiled: April 19, 2002Publication date: June 26, 2003Applicant: Diversified Chemical Technologies, Inc.Inventors: Rajan Eadara, Roy P. Jacob, Yushin Ahn, Biju Philip, Jori Joseff
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Patent number: 6210517Abstract: A radiation curable precursor coating composition for the preparation of a non-blocking, heat activatable adhesive includes a curable acrylic material, a curable elastomeric material, and a hydrocarbon tackifier material having a softening temperature ranging from approximately 50° C. to approximately 200° C., wherein when the acrylic material and the elastomeric material are cured, the coating composition is non-blocking at room temperature, but when the coating composition is heated to a temperature above both the softening temperature of the hydrocarbon tackifier and the Tg of the coating composition, the coating composition becomes adhesive.Type: GrantFiled: April 13, 1999Date of Patent: April 3, 2001Assignee: Diversified Chemical Technologies, Inc.Inventors: Rajan Eadara, Mooil Chung, David Wen-Lung Chang, Weichen Chi
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Patent number: 5859096Abstract: The present invention pertains to a one component curable epoxy resin composition which is storage-stable at ambient temperature and which maintains a post-cured high glass transition temperature (Tg) of above 130.degree. C. and a low coefficient of thermal expansion (CTE) of less than 1.76.times.10.sup.-5 cm/cm/.degree.C. over a temperature range of -30.degree. to 125.degree. C., and thus finds practical utility in tooling applications. The epoxy resin composition comprises an epoxy resin or mixture thereof, a multifunctional epoxy resin diluent, a boron trichloride amine complex, and at least one filler selected from the group consisting of a silica or a silicate. The invention also relates to the cured product.Type: GrantFiled: March 19, 1997Date of Patent: January 12, 1999Assignee: Ciba Specialty Chemicals CorporationInventors: James Edward Hoge, Teruko Uchimi Miyazaki, Rajan Eadara
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Patent number: 5198065Abstract: The present invention relates to a creosote resistant epoxy adhesive system comprising(A) a low viscosity primer comprising(a) a resin component comprising diglycidyl ether of Bisphenol A, diglycidyl ether of butanediol, and epoxy silane; and(b) a hardener component comprising an aliphatic amine; and(B) an adhesive component comprising(a) a resin component comprising diglycidyl ether of Bisphenol A, a diluent, a filler, and epoxy silane; and(b) a hardener component comprising a combination of (i) an aliphatic or aromatic amine and (ii) a polyamide or an adducted amine with diglycidyl ether of Bisphenol, and a fillerand wherein a flexibilizer is present in either component (a) or component (b) of said adhesive component.Type: GrantFiled: February 25, 1991Date of Patent: March 30, 1993Assignee: Ciba-Geigy CorporationInventor: Rajan Eadara
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Patent number: 5169890Abstract: The present invention relates to a thermoplastic hot melt adhesive comprising(a) a block copolymer, said block copolymer being prepared utilizing a bromide based coupling agent, said block copolymer comprising at least two monoalkenyl arene polymer end blocks A and at least one elastomeric conjugated diene polymer mid block B, and said block copolymer having about 8 to about 65 percent by weight of said monoalkenyl arene polymer block content, each polymer block A having an average molecular weight of between about 5,000 and about 125,000, and each polymer block B having an average molecular weight of between about 10,000 and about 300,000,(b) a polyisobutylene rubber,(c) a partially cross-linked polyisobutylene rubber(d) a compatible tackifying resin,(e) a phenolic antioxidant,(f) a non-reactive phenolic resin,(g) a fluorocarbon surface active agent, and(h) a petroleum derived wax.Type: GrantFiled: October 11, 1991Date of Patent: December 8, 1992Assignee: Ciba-Geigy CorporationInventors: Rajan Eadara, Julie Szymborski, Irvin Jackson
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Patent number: 4992489Abstract: Epoxy resin systems readily available for curing by the application of an induction heat energy source comprising a silica-filled, low viscosity epoxy resin in combination with an iron oxide or a steel powder.Type: GrantFiled: March 1, 1990Date of Patent: February 12, 1991Assignee: Ciba-Geigy CorporationInventors: Rajan Eadara, Robert F. Armbruster
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Patent number: 4894431Abstract: Curing systems for epoxy resins comprising an aliphatic or cycloaliphatic amine in combination with anhydrous methane sulfonic acid as an accelerator for the curing reaction.Type: GrantFiled: May 23, 1988Date of Patent: January 16, 1990Assignee: Ciba-Geigy CorporationInventors: Robert F. Armbruster, Rajan Eadara, William L. Miller