Patents by Inventor Rajasekaran Raja Swaminathan

Rajasekaran Raja Swaminathan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8915747
    Abstract: This disclosure relates generally to a connector assembly. Optionally, first conductive members form a first row. Second conductive members include a first subset forming a second row and a second subset forming a third row, the second and third rows being parallel and offset with respect to one another. Individual ones of the first and second conductive members are arranged to be coupled at a first end to a corresponding contact. At least one of the first and second subsets has a vertical displacement to form a common row of the second conductive members at a second end of the second conductive members. Individual ones of the first conductive members are arranged to be coupled proximate a second end of the first conductive members to the second end of a corresponding one of the second conductive members.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: December 23, 2014
    Assignee: Intel Corporation
    Inventors: Gaurav Chawla, Rajasekaran Raja Swaminathan, Donald T. Tran
  • Publication number: 20140268577
    Abstract: This disclosure relates generally to a chip package assembly arranged to be electrically coupled to a circuit board including a plurality of circuit board contacts. The chip package assembly may include a chip package including a first side and a second side, the second side including a first plurality of contacts arranged to be electrically coupled to the plurality of circuit board contacts and a second plurality of contacts arranged to be electrically coupled to a remote device via a connector assembly.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Inventors: Rajasekaran Raja Swaminathan, Donald T. Tran, Brent S. Stone, Ram Viswanath
  • Publication number: 20140273555
    Abstract: This disclosure relates generally to a connector assembly. Optionally, first conductive members form a first row. Second conductive members include a first subset forming a second row and a second subset forming a third row, the second and third rows being parallel and offset with respect to one another. Individual ones of the first and second conductive members are arranged to be coupled at a first end to a corresponding contact. At least one of the first and second subsets has a vertical displacement to form a common row of the second conductive members at a second end of the second conductive members. Individual ones of the first conductive members are arranged to be coupled proximate a second end of the first conductive members to the second end of a corresponding one of the second conductive members.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Inventors: Gaurav Chawla, Rajasekaran Raja Swaminathan, Donald T. Tran