Patents by Inventor Rajashree Raji Baskaran

Rajashree Raji Baskaran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11366431
    Abstract: A multi-function input interface for an electronic device. The multi-function input interface including a conductive portion to transceive a signal through the input interface. The input interface includes a positional element to detect a user input to the input interface.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: June 21, 2022
    Assignee: Intel Corporation
    Inventors: Aycan Erentok, Rajashree Raji Baskaran
  • Patent number: 10462578
    Abstract: A piezoelectric contact microphone with a mechanical vibration conduction interface provides an improved mobile electronic device microphone. In an embodiment, the mechanical vibration conduction interface is placed on a bone structure and conducts vibration from the bone structure to the piezoelectric contact microphone. Because of the direct contact, this use of piezoelectric contact microphone reduces or eliminates interferences effects due to wind and other airflow over the microphone. The mechanical vibration conduction interface materials and structure are selected to provide effective transmission of vibration from the bone structure to the piezoelectric element within the piezoelectric contact microphone. This piezoelectric contact microphone enables mobile electronic devices to provide improved voice communication, voice transcription, and voice command recognition in the presence of wind noise and other noise.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: October 29, 2019
    Assignee: Intel Corporation
    Inventors: Kevin R. Hoskins, Arun P. Jose, David Harkness, Georgios C. Dogiamis, Rajashree Raji Baskaran
  • Publication number: 20180324530
    Abstract: A piezoelectric contact microphone with a mechanical vibration conduction interface provides an improved mobile electronic device microphone. In an embodiment, the mechanical vibration conduction interface is placed on a bone structure and conducts vibration from the bone structure to the piezoelectric contact microphone. Because of the direct contact, this use of piezoelectric contact microphone reduces or eliminates interferences effects due to wind and other airflow over the microphone. The mechanical vibration conduction interface materials and structure are selected to provide effective transmission of vibration from the bone structure to the piezoelectric element within the piezoelectric contact microphone. This piezoelectric contact microphone enables mobile electronic devices to provide improved voice communication, voice transcription, and voice command recognition in the presence of wind noise and other noise.
    Type: Application
    Filed: May 8, 2017
    Publication date: November 8, 2018
    Inventors: Kevin R. Hoskins, Arun P. Jose, David Harkness, Georgios C. Dogiamis, Rajashree Raji Baskaran
  • Patent number: 10099307
    Abstract: A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: October 16, 2018
    Assignee: Intel Corporation
    Inventors: Ting Zhong, Rajashree Raji Baskaran, Aleksandar Aleksov
  • Publication number: 20180088724
    Abstract: A multi-function input interface for an electronic device. The multi-function input interface including a conductive portion to transceive a signal through the input interface. The input interface includes a positional element to detect a user input to the input interface.
    Type: Application
    Filed: September 29, 2016
    Publication date: March 29, 2018
    Inventors: Aycan Erentok, Rajashree Raji Baskaran
  • Publication number: 20170361390
    Abstract: A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.
    Type: Application
    Filed: August 14, 2017
    Publication date: December 21, 2017
    Inventors: Ting Zhong, Rajashree Raji Baskaran, Aleksandar Aleksov
  • Patent number: 9731369
    Abstract: A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: August 15, 2017
    Assignee: Intel Corporation
    Inventors: Ting Zhong, Rajashree Raji Baskaran, Aleksandar Aleks Aleksov
  • Publication number: 20140263588
    Abstract: A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Inventors: Ting Zhong, Rajashree Raji Baskaran, Aleksandar Aleks Aleksov