Abstract: One example discloses an on-chip shielded device, including: a planar structure including a substrate and a passivation layer; an electrical component formed within the substrate and coupled to an input signal path and an output signal path; a first shielding element positioned above the electrical component and the passivation layer; and a second shielding element positioned above the electrical component, the passivation layer and the first shielding element.

Abstract: An RF package assembly includes a stacked package-on-package arrangement of a first substrate and a second substrate. Each of the first and second substrates include RF signal pads and ground pads. An interface region between the stacked substrates couples the RF signal pads and ground pads of the first substrate to corresponding pads of the second substrate. The interface region includes galvanic connection regions providing a galvanic connection between the each of the first substrate ground pads and each of the corresponding second substrate ground pads. The interface region includes dielectric regions between each of the first substrate RF signal pads and the corresponding second substrate RF signal pads so that RF signals transmitted between the two substrates are capacitively coupled.

Abstract: A flip chip device includes a substrate, an integrated circuit device, a mold compound, and a via. The substrate has a top side and a bottom side. The integrated circuit device is affixed to the bottom side of the substrate. The mold compound is affixed to the bottom side of the substrate. The via is affixed to the bottom side of the substrate. The via passes through the mold compound and is exposed at a bottom side of the mold compound. The via is coupled to a terminal of the integrated circuit device.

Abstract: A semiconductor device may include an antenna array and a grounding assembly configured to at least partially electrically shield the antenna array. The grounding assembly may include a first grounding layer comprising a first plurality of openings and a second grounding layer comprising a second plurality of openings. The second grounding layer may at least partially occlude the first plurality of openings of the first grounding layer when viewed from above the antenna array.

Abstract: An integrated circuit comprising a package, phased antenna array and die. The die comprises a plurality of unit cells, wherein each unit cell is divided into quadrants. Each quadrant comprises a receiver terminal located on a first axis, and a transmitter terminal located on a second axis, wherein the first axis is orthogonal to the second axis, and there is mirror symmetry between the nearest neighbour quadrants in the unit cell. The package comprises a plurality of pairs of feed lines, each pair of feed lines comprising a receiver feed line and a transmitter feed line. The receiver feed line is connected to one of the receiver terminals and the transmitter feed line is connected to the transmitter terminal in the same die quadrant. The receiver feed line is orthogonal to the transmitter feed line. Each antenna element is coupled to a respective pair of feed lines.

Abstract: A semiconductor device comprising a substrate, a first integrated circuit package mounted on the substrate, the first integrated circuit package comprising a first antenna sub-array having a uniform pitch, and a second integrated circuit package mounted on the substrate, the second integrated circuit package comprising a second antenna sub-array having a uniform pitch. The second integrated circuit package is mounted adjacent to the first integrated circuit package to form a multi-package module having an antenna array formed of the first antenna sub-array and the second antenna sub-array, wherein the antenna array has a uniform pitch. Also provided is a method of manufacturing a multi-package module and a method of providing package-to-package grounding.

Abstract: Improved light emission in OLEDs The invention relates to an organic light-emitting diode (OLED) system comprising a multi-layered structure having a semiconducting organic layer (12) sandwiched between first and second electrodes (3a, 3b); further comprising a barrier layer (6) interposed between the semiconducting organic layer and a polymer substrate (1) having formed an random nanopillar structure thereon having a pillar height dimension between 50 and 1000 nanometer and a pitch in a range of 50-1000 nanometer.

Abstract: A method is provided for assembly of a micro-electronic component, in which a conductive die bonding material is used. This material includes a conductive thermosettable resin material or flux based solder and a dynamic release layer adjacent to the conductive thermoplastic material die bonding material layer A laser beam is impinged on the dynamic release layer, adjacent to the die bonding material layer, in such a way that the dynamic release layer is activated to direct conductive die bonding material matter towards the pad structure to be treated, to cover a selected part of the pad structure with a transferred conductive die bonding material. The laser beam is restricted in timing and energy, in such a way that the die bonding material matter remains thermosetting. Accordingly, adhesive matter can be transferred while preventing that the adhesive is rendered ineffective by thermal overexposure in the transferring process.

Abstract: The present disclosure relates to an arrangement for providing information about a flow rate of a fluid, comprising: a fluid inlet opening, at least one flow channel, and at least one porous zone located above the at least one flow channel, wherein the surface size and position of the at least one porous zone relative to the fluid inlet opening defines the evaporation rate of a fluid, arranged such that when a fluid is injected through the fluid inlet opening the fluid flows via hydraulic pressure through the at least one flow channel and then through the respective at least one porous zone.

Abstract: The present disclosure relates to an arrangement for providing information about a flow rate of a fluid, comprising: a fluid inlet opening, at least one flow channel, and at least one porous zone located above the at least one flow channel, wherein the surface size and position of the at least one porous zone relative to the fluid inlet opening defines the evaporation rate of a fluid, arranged such that when a fluid is injected through the fluid inlet opening the fluid flows via hydraulic pressure through the at least one flow channel and then through the respective at least one porous zone.

Abstract: A method is presented for providing a carrier (CR) with an embedded patterned metal structure (EMM). The carrier at least includes a polymer foil (FS). The method comprise the steps of providing a carrier (CR) having a first side (S1) with an initial embedded patterned metal structure (EM). The carrier is then irradiated at a second side (S2) opposite the first side with a radiation beam (BM) that is at least partially transmitted through the carrier (CR) and at least partially absorbed by the initial embedded patterned metal structure (EM), therewith locally heating the initial embedded patterned metal structure and causing a removal of metal (DB) from the initial embedded patterned metal structure.

Abstract: A method is provided for assembly of a micro-electronic component comprising the steps of: providing a conductive die bonding material comprising of a conductive thermosettable resin material or flux based solder and a dynamic release layer adjacent to the conductive thermoplastic material die bonding material layer; and impinging a laser beam on the dynamic release layer adjacent to the die bonding material layer; in such a way that the dynamic release layer is activated to direct conductive die bonding material matter towards the pad structure to be treated to cover a selected part of the pad structure with a transferred conductive die bonding material; and wherein the laser beam is restricted in timing and energy, in such a way that the die bonding material matter remains thermosetting. Accordingly adhesive matter can be transferred while preventing that the adhesive is rendered ineffective by thermal overexposure in the transferring process.