Abstract: The present disclosure provides in vitro methods for identifying the presence or absence of haemoglobin S (HbS) or haemoglobin C (HbC) in a blood sample, kits and devices thereof. The inventors have found that HbS shows a substantial decrease in absorption under deoxygenated conditions compared to oxygenated conditions. The inventors expect HbC to show a similar decrease in absorption under deoxygenated conditions compared to oxygenated conditions. The methods, kits and devices of the disclosure employ this decrease in absorption under deoxygenated conditions to identify the presence or absence of HbS or HbC in a blood sample. The methods, kits and devices of the present disclosure are simple, low cost, and provide a rapid way to identify the presence or absence of HbS or HbC in a blood sample in a point-of-care setting.

Abstract: In one embodiment, a real-time data analysis system 160 may efficiently alert a service technician 170 about any service outages for a network service 120. The real-time data analysis system 160 may process a service signal 410 from an application interacting with a network service 120. The real-time data analysis system 160 may determine that the service signal 410 crosses a failure threshold 430 indicating an emergency event. The real-time data analysis system 160 may send an emergency alert about the emergency event.

Abstract: A semiconductor component includes a semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501) having first and second surfaces opposite each other, a semiconductor device (301) in the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501), and a flexible substrate (120, 401, 510, 610, 710, 1000, 1050, 1300, 1401, 1510, 1520) packaging the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501).

Abstract: A method of manufacturing a semiconductor component includes applying an encapsulant (211) to a wafer (210, 430), degassing the encapsulant (211), and separating the wafer (210, 430) into a plurality of semiconductor components. Manufactured in this manner, the encapsulant (211) of the semiconductor component is substantially devoid of air bubbles and voids.

Abstract: An encapsulant (17) is applied to a semiconductor wafer (16). The bottom surface (28) of the wafer (16) is held substantially planar while curing the encapsulant (17). The bottom surface (28) is held against a substantially planar support plate (12) to facilitate holding the wafer (16) substantially planar. A polisher plate (18) is pressed against the encapsulant (17) to assist ensuring that the encapsulant has a substantially smooth surface and substantially uniform thickness.