Abstract: Embodiments are related generally to conductive interconnects formed on substrates, and more particularly to a glass ceramic, or glass-ceramic substrate having copper interconnects disposed thereon.

Abstract: A method for producing a conductive through-via, including applying a seed layer on a surface of a first substrate, and forming a surface modification layer on at least one of the seed layer and a second substrate. Next, the second substrate is bonded to the first substrate with the surface modification layer to form an assembly. A conductive release layer is formed in the at least one through-via by placing a conductive release material into the at least one through-via. The conductive release layer is present on the seed layer and in the at least one through-via. A conductive metal material is applied to the at least one through-via, and the second substrate is removed from the assembly after applying the conductive metal material to the at least one through via.

Abstract: A thin film transistor (TFT) liquid crystal display (LCD) comprises a plurality of image pixels demarcated between an overlying liquid crystal display layer and an underlying glass substrate. Each image pixel comprises a dedicated top-gate TFT disposed over the glass substrate. Each top-gate thin film transistor comprises a process sensitive semiconductor layer disposed over the glass substrate, and a source electrode and a drain electrode disposed over the process sensitive semiconductor layer. The process sensitive semiconductor layer forms a process sensitive semiconductor active layer between the source electrode and the drain electrode and an active layer protection film is disposed over the process sensitive semiconductor active layer. A gate dielectric layer is disposed over the active layer protection film between the source electrode and the drain electrode and a gate electrode is disposed over the gate dielectric layer.

Abstract: Display tiles comprising pixel elements on a first surface of a substrate connected by an electrode, a driver located opposite the first surface, and a connector wrapped around an edge surface of the substrate connecting the driver to the pixel elements. Displays comprised of display tiles and methods of manufacturing display tiles and displays are also disclosed.

Abstract: A method of forming an article, comprising: forming an adhesion layer comprising MnOx on a glass, glass-ceramic or ceramic wafer; calcining the adhesion layer such that a first portion of the MnOx of the adhesion layer is chemically bonded to the wafer; depositing a metal layer on the adhesion layer; and processing the metal layer and the adhesion layer such that a portion of the MnOx of the adhesion layer is chemically bonded to the metal layer.

Abstract: Embodiments are related to substrates having one or more well structures each exhibiting substantially vertical sidewalls and substantially planar bottoms.

Abstract: According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 ?m at the first major surface.

Abstract: In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnOx) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.

Abstract: A polar elastomer dielectric layer is formed on a substrate by dynamically dispensing a solution containing the polar elastomer on the substrate and curing it at an elevated temperature. The polar elastomer can include poly(vinylidene fluoride-co-hexa-fluoropropylene) (e-PVDF-HFP). They dynamic dispensing process can include spinning the substrate at a first speed, depositing the polar elastomer solution on the substrate, and spinning the substrate at a second speed.

Abstract: A method for producing a conductive through-via, including applying a seed layer on a surface of a first substrate, and forming a surface modification layer on at least one of the seed layer and a second substrate. Next, the second substrate is bonded to the first substrate with the surface modification layer to form an assembly. A conductive release layer is formed in the at least one through-via by placing a conductive release material into the at least one through-via. The conductive release layer is present on the seed layer and in the at least one through-via. A conductive metal material is applied to the at least one through-via, and the second substrate is removed from the assembly after applying the conductive metal material to the at least one through via.

Abstract: Methods of plating a metal on a substrate including coating a nanoporous metal-oxide layer on a surface of the substrate prior to metal plating. Methods may include coating a surface of the substrate with a slurry including colloidal metal-oxide precursor particles and aluminum oxide particles. After coating, the slurry may be calcinated on the surface of the substrate to form a nanoporous metal-oxide layer on the surface. Then, a metallic film may be plated on the nanoporous metal-oxide layer. The metallic film may be plated by an electroless plating method and/or an electroplating method. Articles, such as electronic interposers, may be made using the methods of plating a metal described herein.

Abstract: An article including a glass or glass ceramic substrate, a noble metal layer, an adhesion promoting layer positioned between and bonded to the substrate and the noble metal layer, and a conductive metal layer positioned on and bonded to the noble metal layer. The adhesion promoting layer includes a siloxy group bonded with the substrate and a thiol group bonded to the noble metal layer. A method for manufacturing an article including applying an adhesion promoting layer comprising mercaptosilane to at least a portion of a glass or glass ceramic substrate, wherein siloxane bonds are formed between the mercaptosilane and the substrate, applying a noble metal layer to the adhesion promoting layer, the noble metal layer bonds with a thiol present in the mercaptosilane, thermally treating the noble metal layer, and applying a conductive metal layer to the noble metal layer.

Abstract: A method for bonding a conductive metal to an oxide substrate includes applying a porous coating to a surface of the oxide substrate, the porous coating including a porous oxide and catalyst nanoparticles dispersed therein, and depositing a conductive metal onto the porous coating. A portion of the conductive metal may be deposited within the pores of the porous coating to couple the conductive metal to the porous coating. Articles are also disclosed that include the oxide substrate, the porous coating coupled to a surface of the oxide substrate, and the conductive metal coupled to the porous coating. The porous coating may include a porous oxide and catalyst nanoparticles dispersed within the metal oxide. A portion of the conductive metal may be deposited within the pores of the porous coating to interlock the conductive metal to the porous coating.

Abstract: In some embodiments, a method comprises leaching a surface of a glass or glass ceramic substrate to form a leached layer. The glass or glass ceramic substrate comprises a multi-component material. The material has a bulk composition, in mol % on an oxide basis: 51% to 90% SiO2; 10% to 49% total of minority components ROx. Leaching comprises selectively removing components ROx of the glass or glass ceramic substrate preferentially to removal of SiO2. In the leached layer, the ROx concentration is 50% or less than the ROx concentration of the bulk composition.

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.

Abstract: An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10?8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of ?40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10?8 atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.

Abstract: A dehydration system is provided. The dehydration system includes an absorber configured to produce a dry gas and a rich solvent from a wet gas and from a pure solvent and a flash drum coupled in flow communication with the absorber for receiving the rich solvent discharged from the absorber. The flash drum is configured to produce flash gas from the rich solvent. The dehydration further includes a reboiler configured to produce a semi-lean solvent from the rich solvent and an inert gas system configured to strip the semi-lean solvent using at least the flash gas to produce the pure solvent.

Abstract: A dehydration system is provided. The dehydration system includes an absorber configured to produce a dry gas and a rich solvent from a wet gas and from a pure solvent and a flash drum coupled in flow communication with the absorber for receiving the rich solvent discharged from the absorber. The flash drum is configured to produce flash gas from the rich solvent. The dehydration further includes a reboiler configured to produce a semi-lean solvent from the rich solvent and an inert gas system configured to strip the semi-lean solvent using at least the flash gas to produce the pure solvent.