Patents by Inventor Rajinder Singh Rai

Rajinder Singh Rai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6059952
    Abstract: Methods for forming pastes of powder particles coated with an electrically conductive coating are described. The powder particles, with or without an optional first conductive coating layer applied to their surface, are placed in contact with a cathode surface and immersed in an electroplating solution. An anode covered with a nonconducting but ion-permeable membrane is immersed in the solution in close proximity to the cathode. Agitation to move and gently tumble the powder over the cathode surface is provided. The powder particles are plated with a metal or metal alloy coating by biasing the anode with a positive voltage relative to the cathode. The coated powder is removed, rinsed and dried. The powder is added to a polymer material to form a paste which is heated to fuse the powder coating surfaces to form a network of interconnected particles and is further heated to cure the polymer.
    Type: Grant
    Filed: July 7, 1998
    Date of Patent: May 9, 2000
    Assignee: International Business Machines Corporation
    Inventors: Sung Kwon Kang, Sampath Purushothaman, Rajinder Singh Rai