Patents by Inventor Rajwant Singh Sidhu

Rajwant Singh Sidhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of manufacturing a printed wiring board having copper wrap plated hole
    Patent number: 8510941
    Abstract: Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: August 20, 2013
    Assignee: DDI Global Corp.
    Inventor: Rajwant Singh Sidhu
  • MULTILAYER PRINTED WIRING BOARDS WITH HOLES REQUIRING COPPER WRAP PLATE
    Publication number: 20120144667
    Abstract: Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.
    Type: Application
    Filed: February 17, 2012
    Publication date: June 14, 2012
    Applicant: DDI GLOBAL CORP.
    Inventor: Rajwant Singh Sidhu
  • Method of manufacturing a multilayer printed wiring board with copper wrap plated hole
    Patent number: 8156645
    Abstract: Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: April 17, 2012
    Assignee: DDi Global Corp.
    Inventor: Rajwant Singh Sidhu
  • Multilayer printed wiring boards with holes requiring copper wrap plate
    Publication number: 20080302468
    Abstract: Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.
    Type: Application
    Filed: June 5, 2008
    Publication date: December 11, 2008
    Inventor: Rajwant Singh Sidhu