Patents by Inventor Rakesh Bhatia
Rakesh Bhatia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6472742Abstract: A heat dissipating element (e.g., a heat sink) is held in an initial position closer to a heat generating structure (e.g., a microprocessor) and in a subsequent position farther from the microprocessor. A thermal interface material (e.g., a thermal grease) spans the gap, but is not held under compression, between the heat sink and the microprocessor.Type: GrantFiled: September 30, 1999Date of Patent: October 29, 2002Assignee: Intel CorporationInventors: Rakesh Bhatia, Gregory A. James
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Patent number: 6459576Abstract: A heat generating component such as a microprocessor, in a small form factor, low profile electronic device such as a laptop computer is cooled by using an elongated hollow heat exchanger with a fan at one end of the heat exchanger. A heat pipe, having two ends, has one end thermally coupled to the heat exchanger and the other end thermally coupled to the heat generating component. A heat sink thermally coupled to the other end of the heat pipe, in thermal contact with the heat producing component may be used. In a laptop computer having a four vertically extending side walls including a front wall a back wall and two side walls where the heat generating component is a microprocessor, the heat exchanger can extends in a direction adjacent and parallel to one of the side walls, with an air outlet formed in one of said front and rear walls and an air inlet in the other of said front or rear walls or the side wall to which the heat exchanger is adjacent.Type: GrantFiled: October 29, 2001Date of Patent: October 1, 2002Assignee: Intel CorporationInventors: Rakesh Bhatia, Karen Regis
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Patent number: 6434001Abstract: A heat exchanger for a computing device and a docking station. The heat exchanger includes a first heat transfer element and a second heat transfer element. The first heat transfer element has a portion thermally coupled to an electronic component. The first and the second heat transfer element conformally engage each other yet are removable from each other.Type: GrantFiled: February 15, 2000Date of Patent: August 13, 2002Assignee: Intel CorporationInventor: Rakesh Bhatia
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Patent number: 6400565Abstract: An electronic package including a printed circuit substrate having a semiconductor device mounted thereon. A heat dissipating device is attached to the semiconductor device. A thermal interface member is mounted between the semiconductor device and the heat dissipating device. The thermal interface member includes a thermally conductive elastomeric pad and a layer of thermally conductive phase change material attached to a surface of the elastomeric pad. The elastomeric pad is engaged with a surface of the semiconductor device and the phase change material is engaged with a surface of the heat dissipating device. Heat transfer from the semiconductor device to the heat dissipating device is significantly increased. The heat dissipating device can be detached from the semiconductor device without destroying the thermal transfer member, allowing the thermal interface member to be reused with the heat dissipating device.Type: GrantFiled: April 21, 2000Date of Patent: June 4, 2002Assignee: Dell Products L.P.Inventors: Hasnain Shabbir, Rakesh Bhatia
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Patent number: 6365076Abstract: A technique for fabricating an improved electronic enclosure. The electronic enclosure is made of graphite fibers dispersed directionally (non-homogeneous) in an absolac/polycarbonate (ABS/PC) resin mix, which the composition is molded to form the plastic enclosure. The graphite concentration is highest along the interior surface of the enclosure to provide improved heat transfer, as well as adequate EMI/RFI shielding. However, the graphite concentration decrease along the thickness, wherein at the outer surface, the graphite concentration level is zero. The directional variation in the graphite loading allows high graphite loading at the interior surface of the enclosure, but retains lower loading at other regions along the thickness so that rigidity and impact resistance are retained for the enclosure.Type: GrantFiled: June 5, 2000Date of Patent: April 2, 2002Assignee: Intel CorporationInventor: Rakesh Bhatia
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Patent number: 6357515Abstract: A heat exchanger. The heat exchanger includes a first heat dissipation mechanism having a first heat dissipation capacity and a second heat dissipation having a second heat dissipation capacity. At least one heat transfer mechanism thermally couples the first heat dissipation mechanism and the second heat dissipation mechanism to a heat generating component. The heat transfer mechanism has a limited conductivity portion in the thermal path to either the first or the second heat dissipation mechanism.Type: GrantFiled: October 5, 2000Date of Patent: March 19, 2002Assignee: Intel CorporationInventor: Rakesh Bhatia
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Patent number: 6352103Abstract: The invention consists of a modular apparatus for cooling an integrated circuit chip in a compact computer. The apparatus includes a heat collector assembly operatively connected to the chip, a heat exchange assembly and a heat pipe extending from the heat collector assembly to the heat exchange assembly. The heat exchange assembly includes a primary housing, a fan at one end of the housing, and a secondary housing at the opposite end of the primary housing. The secondary housing has a plurality of fins and the primary housing as a plenum chamber between the fins and the fan. The invention also comprises a high-performance notebook computer and cooling apparatus combination which includes a pivoted outer cover and a cooling system located along the pivoting axis of the outer cover.Type: GrantFiled: May 20, 1997Date of Patent: March 5, 2002Assignee: Intel CorporationInventors: Herman W. Chu, Rakesh Bhatia
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Publication number: 20020024795Abstract: A heat generating component such as a microprocessor, in a small form factor, low profile electronic device such as a laptop computer is cooled by using an elongated hollow heat exchanger with a fan at one end of the heat exchanger. A heat pipe, having two ends, has one end thermally coupled to the heat exchanger and the other end thermally coupled to the heat generating component. A heat sink thermally coupled to the other end of the heat pipe, in thermal contact with the heat producing component may be used. In a laptop computer having a four vertically extending side walls including a front wall a back wall and two side walls where the heat generating component is a microprocessor, the heat exchanger can extends in a direction adjacent and parallel to one of the side walls, with an air outlet formed in one of said front and rear walls and an air inlet in the other of said front or rear walls or the side wall to which the heat exchanger is adjacent.Type: ApplicationFiled: October 29, 2001Publication date: February 28, 2002Inventors: Rakesh Bhatia, Karen Regis
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Patent number: 6347036Abstract: An apparatus for mounting a heat generating computer component includes a base member having a frame mounted thereon. The frame includes a passage extending therethrough. A socket is mounted on the base member in the passage of the frame. The heat generating component is mounted on the socket. A heat extraction body is mounted on the heat generating component. A retaining member is movably attached to the base member. The retaining member is movable between an open position and a closed position with respect to the passage. A resilient member is resiliently engaged against the heat extraction body when the retaining member is in the closed position, urging the heat extraction body into contact with the heat generating component. Mechanical tolerances of the heat extraction body and the heat generating component are compensated for by captive, self-adjusting mounting hardware such that tolerance variability does not adversely affect heat transfer performance.Type: GrantFiled: March 29, 2000Date of Patent: February 12, 2002Assignee: Dell Products L.P.Inventors: Susan A. Yeager, Rakesh Bhatia
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Publication number: 20020012231Abstract: A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.Type: ApplicationFiled: December 29, 1999Publication date: January 31, 2002Inventors: RAKESH BHATIA, ERIC DISTEFANO
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Patent number: 6299408Abstract: A fan for a computing device. The fan includes a motor and a blade portion having a plurality of blades; however, the blade portion is located apart from the motor. A blade driving mechanism connects the motor to the blade such that the blade rotates when the motor is operating.Type: GrantFiled: November 19, 1999Date of Patent: October 9, 2001Assignee: Intel CorporationInventor: Rakesh Bhatia
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Patent number: 6288895Abstract: A heat generating component such as a microprocessor, in a small form factor, low profile electronic device such as a laptop computer is cooled by using an elongated hollow heat exchanger with a fan at one end of the heat exchanger. A heat pipe, having two ends, has one end thermally coupled to the heat exchanger and the other end thermally coupled to the heat generating component. A heat sink thermally coupled to the other end of the heat pipe, in thermal contact with the heat producing component may be used. In a laptop computer having a four vertically extending side walls including a front wall a back wall and two side walls where the heat generating component is a microprocessor, the heat exchanger can extends in a direction adjacent and parallel to one of the side walls, with an air outlet formed in one of said front and rear walls and an air inlet in the other of said front or rear walls or the side wall to which the heat exchanger is adjacent.Type: GrantFiled: February 23, 1998Date of Patent: September 11, 2001Assignee: Intel CorporationInventor: Rakesh Bhatia
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Patent number: 6262892Abstract: A fan for a computing device. The fan includes a motor and a blade portion having a plurality of blades; however, the blade portion is located apart from the motor. A blade driving mechanism connects the motor to the blade such that the blade rotates when the motor is operating.Type: GrantFiled: November 19, 1999Date of Patent: July 17, 2001Assignee: Intel CorporationInventor: Rakesh Bhatia
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Patent number: 6215657Abstract: A computer keyboard having an integral heat pipe.Type: GrantFiled: May 9, 1997Date of Patent: April 10, 2001Assignee: Intel CorporationInventor: Rakesh Bhatia
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Patent number: 6209626Abstract: A heat pipe with pumping capabilities and use thereof in cooling a device. One embodiment of the heat pipe has an internal pumping mechanism that provides an enhanced capillary flow within a chamber of the heat pipe.Type: GrantFiled: January 11, 1999Date of Patent: April 3, 2001Assignee: Intel CorporationInventor: Rakesh Bhatia
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Patent number: 6205022Abstract: To manage heat in a computer environment or the like, a base plate and/or a input/output (I/O) plate includes an integrated heat pipe. For example, the base plate, located between a bottom surface of a laptop computer chassis and a printed circuit board (PCB) or motherboard would include a heat-pipe network that draws heat away from the heat generating components of the PCB (e.g., a processor) and distributes the heat over the base plate. The I/O plate may also serve the same purpose, located at an end of the PCB. The base plate heat pipe and I/O plate heat pipe are thermally coupled together or are of a unitary design so as to distribute the heat generated in the laptop computer over a larger area achieving a relatively low-temperature isothermal design.Type: GrantFiled: August 27, 1997Date of Patent: March 20, 2001Assignee: Intel CorporationInventors: Rakesh Bhatia, Robert D. Padilla
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Patent number: 6181555Abstract: A computer system, such as a notebook computer, that includes a lid having integrated circuit components that require heat dissipation while protecting the screen display of the lid.Type: GrantFiled: February 4, 1999Date of Patent: January 30, 2001Assignee: Intel CorporationInventors: Kevin Haley, Michael O'Connor, Rakesh Bhatia
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Patent number: 6157538Abstract: A system includes a housing, a support structure (e.g., a circuit board), and an electronic device mounted on the support structure. A heat dissipation apparatus is thermally coupled to the electronic device and the housing to direct heat from the electronic device into the housing. The heat dissipation apparatus may include layers of thermally conductive members coupled between the electronic device and the housing. In addition, the heat dissipation apparatus may be thermally coupled to the support structure to direct heat from the electronic device to the support structure.Type: GrantFiled: December 7, 1998Date of Patent: December 5, 2000Assignee: Intel CorporationInventors: Ihab A. Ali, James Hermerding, Rakesh Bhatia
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Patent number: 6147301Abstract: A technique for fabricating an improved electronic enclosure. The electronic enclosure is made of graphite fibers dispersed directionally (non-homogeneous) in an absolac/polycarbonate (ABS/PC) resin mix, of which the composition is molded to form the the plastic enclosure. The graphite concentration is highest along the interior surface of the enclosure to provide improved heat transfer, as well as adequate EMI/RFI shielding. However, the graphite concentration decrease along the thickness, wherein at the outer surface, the graphite concentration level is zero. The directional variation in the graphite loading allows high graphite loading at the interior surface of the enclosure, but retains lower loading at other regions along the thickness so that rigidity and impact resistance are retained for the enclosure.Type: GrantFiled: June 4, 1998Date of Patent: November 14, 2000Assignee: Intel CorporationInventor: Rakesh Bhatia
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Patent number: 6118654Abstract: A heat exchanger for a computing device and a docking station. The heat exchanger includes a first heat transfer element and a second heat transfer element. The first heat transfer element has a portion thermally coupled to an electronic component. The first and the second heat transfer element conformally engage each other yet are removable from each other.Type: GrantFiled: April 22, 1997Date of Patent: September 12, 2000Assignee: Intel CorporationInventor: Rakesh Bhatia