Abstract: A semiconductor die includes a substrate and an integrated circuit provided on the substrate and having contacts. An electrically conductive layer is provided on the integrated circuit and defines electrically conductive elements electrically connected to the contacts. Electrically conductive interconnects coupled with respective electrically conductive elements. The electrically conductive interconnects have at least one of different sizes or shapes from one another.

Abstract: Wafer level passive array packages and modules are described. In an embodiment, a module includes a circuit board, and a package mounted on the circuit board in which the package includes a plurality of passive components bonded to a bottom side of the die and a plurality of landing pads of the circuit board.

Abstract: Wafer level passive array packages, modules, and methods of fabrication are described. In an embodiment, a module includes a circuit board, and a package mounted on the circuit board in which the package includes a plurality of passive components bonded to a bottom side of the die and a plurality of landing pads of the circuit board.

Abstract: Implementations described herein disclose a malware sequence detection system for detecting presence of malware in a plurality of events. An implementation of the malware sequence detection includes receiving a sequence of a plurality of events, and detecting presence of a sequence of malware commands within the sequence of a plurality of events by dividing the sequence of plurality of events into a plurality of subsequences, performing sequential subsequence learning on one or more of the plurality of subsequences, and generating a probability of one or more of the plurality of subsequences being a malware based on the output of the sequential subsequence.

Abstract: A semiconductor die includes a substrate and an integrated circuit provided on the substrate and having contacts. An electrically conductive layer is provided on the integrated circuit and defines electrically conductive elements electrically connected to the contacts. Electrically conductive interconnects coupled with respective electrically conductive elements. The electrically conductive interconnects have at least one of different sizes or shapes from one another.

Abstract: Enhanced neural network architectures that enable the determination and employment of association-based or attention-based “interrelatedness” of various portions of the input data are provided. A method of employing an architecture includes receiving a first input data element, a second input element, and a third input element. A first interrelated metric that indicates a degree of interrelatedness between the first input data element and the second input data element is determined. A second interrelated metric is determined. The second interrelated metric indicates a degree of interrelatedness between the first input data element and the third input data element. An interrelated vector is generated based on the first interrelated metric and the second interrelated metric. The neural network is employed to generate an output vector that corresponds to the first input vector and is based on a combination of the first input vector and the interrelated vector.

Abstract: A semiconductor die includes a substrate and an integrated circuit provided on the substrate and having contacts. An electrically conductive layer is provided on the integrated circuit and defines electrically conductive elements electrically connected to the contacts. Electrically conductive interconnects coupled with respective electrically conductive elements. The electrically conductive interconnects have at least one of different sizes or shapes from one another.

Abstract: A semiconductor die includes a substrate and an integrated circuit provided on the substrate and having contacts. An electrically conductive layer is provided on the integrated circuit and defines electrically conductive elements electrically connected to the contacts. Electrically conductive interconnects coupled with respective electrically conductive elements. The electrically conductive interconnects have at least one of different sizes or shapes from one another.

Abstract: Enhanced neural network architectures that enable the determination and employment of association-based or attention-based “interrelatedness” of various portions of the input data are provided. A method of employing an architecture includes receiving a first input data element, a second input element, and a third input element. A first interrelated metric that indicates a degree of interrelatedness between the first input data element and the second input data element is determined. A second interrelated metric is determined. The second interrelated metric indicates a degree of interrelatedness between the first input data element and the third input data element. An interrelated vector is generated based on the first interrelated metric and the second interrelated metric. The neural network is employed to generate an output vector that corresponds to the first input vector and is based on a combination of the first input vector and the interrelated vector.

Abstract: Implementations described herein disclose a malware sequence detection system for detecting presence of malware in a plurality of events. An implementation of the malware sequence detection includes receiving a sequence of a plurality of events, and detecting presence of a sequence of malware commands within the sequence of a plurality of events by dividing the sequence of plurality of events into a plurality of subsequences, performing sequential subsequence learning on one or more of the plurality of subsequences, and generating a probability of one or more of the plurality of subsequences being a malware based on the output of the sequential subsequence.