Abstract: Disclosed is an apparatus for electrically contacting a control/evaluation electronics of a field device of automation technology with an external energy supply and/or a controller, wherein the control/evaluation electronics of the field device is arranged on a circuit card, wherein at least one terminal box is provided, in which a plurality of adjoining electrical connection terminals are provided, wherein the electrical connection terminals serve, in each case, for accommodating an electrical connecting element, wherein the electrical connecting elements are connected mechanically and electrically with the circuit card, in each case, via a solder pad, and wherein there are provided between each two solder pads vacancies in the circuit card, which are so embodied that the length of the leakage preventing distance between the solder pads satisfies a predetermined ignition protection type.

Abstract: A device for detachably fastening a sensor for determining and/or monitoring at least one process variable of a medium to a single-use container, wherein there is a connection between the device and a wall of the single-use container, comprises a fastening unit for detachably fastening the sensor to the single-use container. Disclosed also is a single-use container having a device according to the invention.

Abstract: Disclosed is an apparatus for electrically contacting a control/evaluation electronics of a field device of automation technology with an external energy supply and/or a controller, wherein the control/evaluation electronics of the field device is arranged on a circuit card, wherein at least one terminal box is provided, in which a plurality of adjoining electrical connection terminals are provided, wherein the electrical connection terminals serve, in each case, for accommodating an electrical connecting element, wherein the electrical connecting elements are connected mechanically and electrically with the circuit card, in each case, via a solder pad, and wherein there are provided between each two solder pads vacancies in the circuit card, which are so embodied that the length of the leakage preventing distance between the solder pads satisfies a predetermined ignition protection type.

Abstract: The present disclosure relates to an explosion resistant electronic module having a high-speed interface and a method for electronic contacting of such electronic module via such interface. The electronic module includes an electronic component, an electrical contact area for electrical contacting the electronic component and an encapsulation, which encapsulates at least the electrical contact area. The encapsulation is embodied such that the contact area is contactable through the encapsulation by an electrical contact pin, wherein the encapsulation is filled at least in a portion with a self-healing gelatinous potting compound, which enables the encapsulation to be re-sealed after removal of the contact pin.

Abstract: The application discloses an apparatus and a method for determining and/or monitoring at least one predefined filling level of a medium in a container at least with a sensor unit and an electronic unit, wherein the electronic unit is configured to apply an excitation signal to the sensor unit and to receive a reception signal from the sensor unit, and wherein the electronic unit comprises at least one first computing unit which is configured to determine at least the predefined filling level from the reception signal in a normal operating mode, a second computing unit which is configured to make a statement relating to the state of the sensor unit in a diagnostic operating mode, at least one buffer which is configured to store the at least one statement relating to the state of the sensor unit and is electrically connected to the first computing unit and to the second computing unit, and at least one switching element which can be used to switch back and forth between the normal operating mode and the diagnos

Abstract: The present disclosure relates to an explosion resistant electronic module having a high-speed interface and a method for electronic contacting of such electronic module via such interface. The electronic module includes an electronic component, an electrical contact area for electrical contacting the electronic component and an encapsulation, which encapsulates at least the electrical contact area. The encapsulation is embodied such that the contact area is contactable through the encapsulation by an electrical contact pin, wherein the encapsulation is filled at least in a portion with a self-healing gelatinous potting compound, which enables the encapsulation to be re-sealed after removal of the contact pin.

Abstract: The application discloses an apparatus and a method for determining and/or monitoring at least one predefined filling level of a medium in a container at least with a sensor unit and an electronic unit, wherein the electronic unit is configured to apply an excitation signal to the sensor unit and to receive a reception signal from the sensor unit, and wherein the electronic unit comprises at least one first computing unit which is configured to determine at least the predefined filling level from the reception signal in a normal operating mode, a second computing unit which is configured to make a statement relating to the state of the sensor unit in a diagnostic operating mode, at least one buffer which is configured to store the at least one statement relating to the state of the sensor unit and is electrically connected to the first computing unit and to the second computing unit, and at least one switching element which can be used to switch back and forth between the normal operating mode and the diagnos

Abstract: A measuring device having at least one corrosion resistant, process-facing surface, wherein at least one joint between a component of an electrically conductive material and a component of an electrically insulating material is sealed with a sealing structure, and wherein the process-facing surface is provided with a coating in such a manner that at least the sealing structure, a transitional region between the conductive component and the sealing structure and a transitional region between the insulating component and the sealing structure are covered by the coating.