Abstract: A vertical power semiconductor device includes a silicon carbide (SiC) semiconductor body having a first surface and a second surface opposite to each other along a vertical direction. The SiC semiconductor body includes at least one SiC semiconductor layer on a SiC semiconductor substrate. A pn junction is formed in the at least one SiC semiconductor layer. A first load electrode is arranged over the first surface. The vertical power semiconductor device further includes a plurality of first trenches extending into the SiC semiconductor substrate from the second surface. A second load electrode is arranged over the second surface. The second load electrode is electrically connected to the SiC semiconductor substrate via one or more sidewalls of the plurality of first trenches.

Abstract: A field effect transistor (FET) is proposed. The FET includes a transistor cell area in a silicon carbide (SiC) semiconductor body. An edge termination area surrounds the transistor cell area. A source contact is arranged over a first surface of the SiC semiconductor body. A drain contact is arranged on a second surface of the SiC semiconductor body. The FET further includes a drift region of a first conductivity type between the first surface and the second surface. Along a lateral direction, a net doping concentration in the drift region is larger in the transistor cell area than in the edge termination area.

Abstract: Methods and devices for producing a casting mold for sand casting are disclosed. In one embodiment, a method for producing a compacted mold for casting molten material may include positioning a model or pattern in a flask; filling the flask with compactable sand; and compacting the compactable sand around the model or pattern so as to form a compacted mold or compacted mold component suitable for casting. The compacting of the molding sand takes place in zones or regions smaller than a lateral extension of the flask based on a contour or a dimension of the model or pattern.

Abstract: The method according to claim 1, wherein sand is replenished at areas where the pattern or model hat a small height, requiring more sand volume to be compacted there.

Abstract: A method is described for producing an electrical connection between a plug element and a printed circuit board. A plug end of the at least one plug element is inserted in an opening extending through the printed circuit board. A solder, preferably in the form of solder paste, is applied essentially from above to at least parts of the opening or the area surrounding the opening. The connection between the board and the plug end is achieved by melting the solder. Prior to melting of the solder and/or application of the solder, the plug end is introduced into the opening in the printed circuit board essentially from below, and is held therein by a retaining arrangement such that during melting the solder enters the opening from above and contacts the plug end.

Abstract: A housing with an electrical circuit accommodated therein, in particular for use in a motor vehicle, includes a top housing part and a bottom housing part, at least one printed circuit board that is separated at least in part from the bottom housing part and has at least one electrical component, and at least one plug element that extends through the bottom housing part and has a plug end that extends into and/or through the printed circuit board from the side of the latter that faces the bottom housing part and is electrically contacted in the area of the printed circuit board. The at least one plug element has at least one support element that extends from the plug element in the space between the bottom housing part and the printed circuit board in such a way that a section of it rests against the side of the bottom housing part facing the printed circuit board.

Abstract: A method is described for producing an electrical connection between a plug element and a printed circuit board. A plug end of the at least one plug element is inserted in an opening extending through the printed circuit board. A solder, preferably in the form of solder paste, is applied essentially from above to at least parts of the opening or the area surrounding the opening. The connection between the board and the plug end is achieved by melting the solder. Prior to melting of the solder and/or application of the solder, the plug end is introduced into the opening in the printed circuit board essentially from below, and is held therein by a retaining arrangement such that during melting the solder enters the opening from above and contacts the plug end.

Abstract: A housing with an electrical circuit accommodated therein, in particular for use in a motor vehicle, includes a top housing part and a bottom housing part, at least one printed circuit board that is separated at least in part from the bottom housing part and has at least one electrical component, and at least one plug element that extends through the bottom housing part and has a plug end that extends into and/or through the printed circuit board from the side of the latter that faces the bottom housing part and is electrically contacted in the area of the printed circuit board. The at least one plug element has at least one support element that extends from the plug element in the space between the bottom housing part and the printed circuit board in such a way that a section of it rests against the side of the bottom housing part facing the printed circuit board.

Abstract: A radiation-sensitive mixture which contains(A) a polymer comprised of repeat units represented by the formula ##STR1## where R is a hydrogen or a halogen atom, a cyanide group or an alkyl group of 1-4 carbon atoms,R.sup.1, R.sup.2 are identical or different, and eachand R.sup.3 denotes a hydrogen or a halogen atom, an alkyl group, an alkoxy group, an alkoxycarbonyl group, an acyl group, an aryloxy group, an aroyl group or aralkyl group,R.sup.4 is a hydrogen atom or a divalent organic group which is linked to another unit represented by formula (I),X denotes an oxygen atom or one of the groups NR.sup.8, OCH.sub.2 CHOHCH.sub.2 OCO, OCH.sub.2 CH.sub.2 O and OCH.sub.2 CH.sub.2 OCO, where R.sup.