Abstract: An electronic module is disclosed. In one example, the electronic module includes a first substrate, a first dielectric layer on the first substrate, at least one electronic chip, which is mounted with a first main surface directly or indirectly on partial region of the first dielectric layer, a second substrate over a second main surface of the at least one electronic chip, and an electrical contacting for the electric contact of the at least one electronic chip through the first dielectric layer. The first adhesion layer on the first substrate extends over an area, which exceeds the first main surface.

Abstract: Electronic module, which comprises a first substrate, a first dielectric layer on the first substrate, at least one electronic chip, which is mounted with a first main surface directly or indirectly on partial region of the first dielectric layer, a second substrate over a second main surface of the at least one electronic chip, and an electrical contacting for the electric contact of the at least one electronic chip through the first dielectric layer, wherein the first adhesion layer on the first substrate extends over an area, which exceeds the first main surface.

Abstract: In an embodiment a method for manufacturing optoelectronic components includes providing a metal sheet, milling the metal sheet, structuring the metal sheet into a lead frame blank with the intermediate pieces, applying a plurality of semiconductor devices to the intermediate pieces and separating to form the components. Each components may include an optoelectronic semiconductor device including at least two electrical contact surfaces on an assembly side, a lead frame base and electrical connection surfaces for external electrical contacting of the semiconductor device, wherein each base comprises at least two metallic intermediate pieces, wherein each of the intermediate pieces is fastened directly to one of the contact surfaces, and wherein the intermediate pieces are each L-shaped or T-shaped.

Abstract: Electronic module, which comprises a first substrate, a first dielectric layer on the first substrate, at least one electronic chip, which is mounted with a first main surface directly or indirectly on partial region of the first dielectric layer, a second substrate over a second main surface of the at least one electronic chip, and an electrical contacting for the electric contact of the at least one electronic chip through the first dielectric layer, wherein the first adhesion layer on the first substrate extends over an area, which exceeds the first main surface.

Abstract: Electronic module, which comprises a first substrate, a first dielectric layer on the first substrate, at least one electronic chip, which is mounted with a first main surface directly or indirectly on partial region of the first dielectric layer, a second substrate over a second main surface of the at least one electronic chip, and an electrical contacting for the electric contact of the at least one electronic chip through the first dielectric layer, wherein the first adhesion layer on the first substrate extends over an area, which exceeds the first main surface.

Abstract: Electronic module, which comprises a first substrate, a first dielectric layer on the first substrate, at least one electronic chip, which is mounted with a first main surface directly or indirectly on partial region of the first dielectric layer, a second substrate over a second main surface of the at least one electronic chip, and an electrical contacting for the electric contact of the at least one electronic chip through the first dielectric layer, wherein the first adhesion layer on the first substrate extends over an area, which exceeds the first main surface.

Abstract: Electronic module (100), which comprises a first substrate (102), a first dielectric layer (104) on the first substrate (102), at least one electronic chip (106), which is mounted with a first main surface (108) directly or indirectly on partial region of the first dielectric layer (104), a second substrate (110) over a second main surface (114) of the at least one electronic chip (106), and an electrical contacting (116) for the electric contact of the at least one electronic chip (106) through the first dielectric layer (104), wherein the first adhesion layer (104) on the first substrate (102) extends over an area, which exceeds the first main surface (108).

Abstract: Electronic module (100), which comprises a first substrate (102), a first dielectric layer (104) on the first substrate (102), at least one electronic chip (106), which is mounted with a first main surface (108) directly or indirectly on partial region of the first dielectric layer (104), a second substrate (110) over a second main surface (114) of the at least one electronic chip (106), and an electrical contacting (116) for the electric contact of the at least one electronic chip (106) through the first dielectric layer (104), wherein the first adhesion layer (104) on the first substrate (102) extends over an area, which exceeds the first main surface (108).

Abstract: A chip package is provided. The chip package may include an electrically conductive carrier; at least one first chip including a first side and a second side opposite of the first side, with its second side being electrically contacted to the electrically conductive carrier; an insulating layer over at least a part of the electrically conductive carrier and over at least a part of the first side of the chip; at least one second chip arranged over the insulating layer and next to the first chip; encapsulating material over the first chip and the second chip; and electrical contacts which extend through the encapsulation material to at least one contact of the at least one first chip and to at least one contact of the at least one second chip.

Abstract: A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface. Contact elements are electrically connecting the carrier with the semiconductor sensor. A protective layer made of an inorganic material covers at least the active surface and the contact elements.

Abstract: A chip package is provided. The chip package may include an electrically conductive carrier; at least one first chip including a first side and a second side opposite of the first side, with its second side being electrically contacted to the electrically conductive carrier; an insulating layer over at least a part of the electrically conductive carrier and over at least a part of the first side of the chip; at least one second chip arranged over the insulating layer and next to the first chip; encapsulating material over the first chip and the second chip; and electrical contacts which extend through the encapsulation material to at least one contact of the at least one first chip and to at least one contact of the at least one second chip.

Abstract: A method of manufacturing a chip package is provided. The method may include electrically contacting at least one first chip, the first chip including a first side and a second side opposite the first side, with its second side to an electrically conductive carrier. An insulating layer is formed over at least a part of the electrically conductive carrier and over at least a part of the first side of the chip. At least one second chip is arranged over the insulating layer. An encapsulating material is formed over the first chip and the second chip. Electrical contacts are formed through the encapsulation material to at least one contact of the at least one first chip and to at least one contact of the at least one second chip.

Abstract: The semiconductor chip package comprises a carrier, a semiconductor chip comprising a first main face and a second main face opposite to the first main face, chip contact elements disposed on one or more of the first or second main faces of the semiconductor chip, an encapsulation layer covering the first main face of the semiconductor chip, the encapsulation layer comprising a first main face facing the carrier and a second main face remote from the carrier, first contact elements disposed on the second main face of the encapsulation layer, each one of the first contact elements being connected to one of the chip contact elements, and second contact elements disposed on the first main face of the encapsulation layer, each one of the second contact elements being connected to one of the chip contact elements.

Abstract: Electronic module (100), which comprises a first substrate (102), a first dielectric layer (104) on the first substrate (102), at least one electronic chip (106), which is mounted with a first main surface (108) directly or indirectly on partial region of the first dielectric layer (104), a second substrate (110) over a second main surface (114) of the at least one electronic chip (106), and an electrical contacting (116) for the electric contact of the at least one electronic chip (106) through the first dielectric layer (104), wherein the first adhesion layer (104) on the first substrate (102) extends over an area, which exceeds the first main surface (108).

Abstract: A method of manufacturing a chip package is provided. The method may include electrically contacting at least one first chip, the first chip including a first side and a second side opposite the first side, with its second side to an electrically conductive carrier. An insulating layer is formed over at least a part of the electrically conductive carrier and over at least a part of the first side of the chip. At least one second chip is arranged over the insulating layer. An encapsulating material is formed over the first chip and the second chip. Electrical contacts are formed through the encapsulation material to at least one contact of the at least one first chip and to at least one contact of the at least one second chip.

Abstract: A method of manufacturing a semiconductor device includes providing a transfer foil. A plurality of semiconductor chips is placed on and adhered to the transfer foil. The plurality of semiconductor chips adhered to the transfer foil is placed over a multi-device carrier. Heat is applied to laminate the transfer foil over the multi-device carrier, thereby accommodating the plurality of semiconductor chips between the laminated transfer foil and the multi-device carrier.

Abstract: A chip arrangement is provided, the chip arrangement including: a first chip carrier; a second chip carrier; a first chip electrically connected to the first chip carrier; a second chip disposed over the first chip carrier and electrically insulated from the first chip carrier; and a third chip electrically connected to the second chip carrier; wherein at least one of the first chip and the second chip is electrically connected to the third chip.

Abstract: The semiconductor chip package comprises a carrier, a semiconductor chip comprising a first main face and a second main face opposite to the first main face, chip contact elements disposed on one or more of the first or second main faces of the semiconductor chip, an encapsulation layer covering the first main face of the semiconductor chip, the encapsulation layer comprising a first main face facing the carrier and a second main face remote from the carrier, first contact elements disposed on the second main face of the encapsulation layer, each one of the first contact elements being connected to one of the chip contact elements, and second contact elements disposed on the first main face of the encapsulation layer, each one of the second contact elements being connected to one of the chip contact elements.

Abstract: A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface. Contact elements are electrically connecting the carrier with the semiconductor sensor. A protective layer made of an inorganic material covers at least the active surface and the contact elements.

Abstract: A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface. Contact elements are electrically connecting the carrier with the semiconductor sensor. A protective layer made of an inorganic material covers at least the active surface and the contact elements.