Abstract: A printed circuit substrate interconnection is made between two printed circuit substrates. A first printed circuit substrate (10) is a laminate of at least two dielectric layers (12, 14), and has a first circuit pattern (16) disposed between the two layers. The circuit pattern terminates in one or more lands or pads (17) located near a vertical edge (13) of the layer. The second dielectric layer is laminated to the first layer, over the circuit pattern, so as to reveal the lands. A second printed circuit substrate (20) is a laminate of at least one dielectric layer (22), and has a second circuit pattern (26) terminating in one or more lands or pads (27) located near a vertical edge (23) of the layer, and in a pattern corresponding to the lands of the first circuit pattern.