Abstract: A cable structure having a stranded inner conductor and an insulating layer over the conductor is formed by feeding a tape of semiconducting material onto the wire as it enters an extruder head. The tape is not spirally wound on the conductor but rather is fed longitudinally along with the wire into the extruder head so as to dispose the tape about the wire and beneath the insulation layer extruded thereon. The product formed has a good concentricity and the tape element conforms generally to the stranded wire to provide a minimum thickness of the tape composition to permit the cable to function effectively at medium voltage. The tape employed is preferably a semiconducting tape which can serve to distribute the electrical stresses emanating from the conductor when it is at high voltage. The tape may be formed of a crosslinkable material and the outer insulation may also be crosslinkable.

Abstract: A compressed, multi-layered, concentric layer stranded cable electrical conductor with each succeeding overlying layer of strands helically wound in an alternately opposite direction, comprising the product of sequentially circumferentially compressing each succeeding overlying layer of cross lay strands to a regressively reduced state of consolidation.

Abstract: A method of manufacturing high voltage carrying electric power cable having a conductor insulated with a multilayered covering, and the cable product thereof. The cable construction includes a primary or dielectric insulating body of thermoset ethylene-propylene rubber and a thermoset jacket about the conductor, which is substantially free of corona-prone or ionization-prone voids and separations intermediate the layers. The method comprises forming and curing the ethylene-propylene rubber compound constituting the body of the primary or dielectric insulation around the conductor and then heat treating the thermoset-cured ethylene-propylene rubber insulation prior to applying subsequent components of the multilayered covering about the condutor, including an overlying semiconductive shielding layer and a protective enclosing jacket of heat-cured thermoset polymer.