Patents by Inventor Ralph Hutton

Ralph Hutton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMALLY CONDUCTIVE ARAMID-BASED DIELECTRIC SUBSTRATES FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT CHIP PACKAGING
    Publication number: 20090142567
    Abstract: The present invention relates generally to fiber-based reinforced composite sheets comprising one or more woven or non-woven para-aramid or fiberglass fabrics, sheets, or papers, impregnated with a polymeric matrix, said polymeric matrix comprising at least one polymer and a thermally conductive filler component suitable for conducting heat, the sheet being useful as a thermally conductive printed circuit board substrate or as a component in a thermally conductive integrated circuit chip package.
    Type: Application
    Filed: November 5, 2008
    Publication date: June 4, 2009
    Applicant: E.I. du Pont de Nemours and Company
    Inventors: Kuppusamy Kanakarajan, Ralph Hutton, Christopher J. Milasincic