Patents by Inventor Ralph Paetzold

Ralph Paetzold has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090267502
    Abstract: A lighting device is disclosed, having a first light output side, a second light output side, and an organic layer stack, disposed between the first and second light output sides, wherein during operation of the lighting device, light with different light properties emerges though the first and the second light output sides.
    Type: Application
    Filed: August 28, 2007
    Publication date: October 29, 2009
    Inventors: Karsten Diekmann, Ralph Paetzold, Wiebke Sarfert
  • Patent number: 7586265
    Abstract: An illumination device is described that includes a light source that is an organic light-emitting diode and a control device capable of adjusting the current through the organic light-emitting diode, which increases current as the electric resistance of the organic light-emitting diode increases.
    Type: Grant
    Filed: February 21, 2007
    Date of Patent: September 8, 2009
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Karsten Heuser, Arvid Hunze, Ralph Paetzold
  • Patent number: 7535017
    Abstract: The invention discloses a flexible multilayer packaging material for protecting articles that are sensitive to moisture and oxidizing agents. The packaging material has at least one active polymeric barrier layer that is able to bind the moisture and oxidizing agents and at least one ceramic barrier layer. The combination of the active polymeric barrier layer and the ceramic barrier layer significantly enhances the barrier abilities of the multilayer packaging material.
    Type: Grant
    Filed: April 2, 2004
    Date of Patent: May 19, 2009
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Georg Wittmann, Debora Henseler, Karsten Heuser, Ralph Paetzold
  • Publication number: 20080100211
    Abstract: An organic light-emitting diode includes an organic light-emitting layer located between a transparent electrode and one other electrode on a substrate. In some embodiments at least one of the transparent electrode and the other electrode has two layers. The two layers include a structured layer, which is a charge carrier injection layer, and a conductive second layer into which the first layer is embedded. In some embodiments the organic light-emitting layer includes a structured charge carrier blocking layer.
    Type: Application
    Filed: October 24, 2007
    Publication date: May 1, 2008
    Inventors: Markus Klein, Ralph Paetzold, Wiebke Sarfert
  • Publication number: 20080057260
    Abstract: An encapsulation for an organic electronic component, characterized in that the component, encapsulated in a dimensionally stable capsule, is at least partially covered with a protective film.
    Type: Application
    Filed: April 13, 2005
    Publication date: March 6, 2008
    Inventors: Dirk Buchhauser, Debora Henseler, Karsten Heuser, Arvid Hunze, Ralph Paetzold, Wiebke Sarfert, Carsten Tschamber
  • Publication number: 20070194719
    Abstract: An illumination device is described that includes a light source that is an organic light-emitting diode and a control device capable of adjusting the current through the organic light-emitting diode, which increases current as the electric resistance of the organic light-emitting diode increases.
    Type: Application
    Filed: February 21, 2007
    Publication date: August 23, 2007
    Inventors: Karsten Heuser, Arvid Hunze, Ralph Paetzold
  • Patent number: 7141925
    Abstract: A planar electronic component has a functional layer with an optoelectronic or a circuit configuration between a substrate layer and a covering layer. A sealing frame or sealing ring is disposed between the substrate layer and the covering layer and connected to them by an integral joint surrounding the functional layer. The seal very largely protects the functional layer against hazardous external influences, in particular against moisture and oxygen. A mechanical connector, whose adhesive characteristics are matched to the materials of the covering layer and of the substrate, is provided in addition to the sealing ring. The connector fixes the substrate and covering layers mechanically with respect to one another, and may reduce the risk of partial or complete detachment in the event of deformation of the electronic component, in particular as a result of thermal expansion and/or mechanical loading.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: November 28, 2006
    Assignee: Osram OPTO Semiconductors GmbH
    Inventors: Georg Wittmann, Jan Birnstock, Ralph Pätzold, Karsten Heuser, Debora Henseler
  • Publication number: 20050147521
    Abstract: A metal cathode layer manufactured from a low-melting alloy for an electronic component is described.
    Type: Application
    Filed: March 2, 2005
    Publication date: July 7, 2005
    Inventors: Jan Birnstock, Debora Henseler, Karsten Heuser, Ralph Paetzold, Georg Wittmann
  • Publication number: 20050136625
    Abstract: Techniques for fabricating devices including an ultra-thin glass and such devices are described. An ultra-thin glass substrate having a thickness less than or equal to 200 microns is fixed to a first mechanically stable support such that the substrate can be removed from the support without damaging the substrate. A device is formed on the ultra-thin glass substrate. The first mechanically stable support is removed from the ultra-thin glass substrate.
    Type: Application
    Filed: January 14, 2005
    Publication date: June 23, 2005
    Inventors: Debora Henseler, Karsten Heuser, Georg Wittmann, Ralph Paetzold
  • Publication number: 20040238846
    Abstract: The invention discloses an organic electronic device including a substrate, an functional areahaving active elements and topographical steps, an active polymeric barrier layer on the functional area, which is able to bind the moisture and oxidizing agents and which planarizes the topographical steps of the functional area. A cap encapsulates the organic functional area and the active polymeric barrier layer.
    Type: Application
    Filed: March 4, 2004
    Publication date: December 2, 2004
    Inventors: Georg Wittmann, Debora Henseler, Karsten Heuser, Ralph Paetzold
  • Publication number: 20040239241
    Abstract: The invention discloses a flexible multilayer packaging material for protecting articles that are sensitive to moisture and oxidizing agents. The packaging material has at least one active polymeric barrier layer that is able to bind the moisture and oxidizing agents and at least one ceramic barrier layer. The combination of the active polymeric barrier layer and the ceramic barrier layer significantly enhances the barrier abilities of the multilayer packaging material.
    Type: Application
    Filed: April 2, 2004
    Publication date: December 2, 2004
    Inventors: Georg Wittmann, Debora Henseler, Karsten Heuser, Ralph paetzold
  • Publication number: 20040197489
    Abstract: Forming an arrangement of two ceramic barrier layers (5, 10) on a polymeric substrate (1) includes the steps of applying a first ceramic barrier layer (5) on the substrate (1). The surface (5A) of the first barrier layer (5) is modified to introduce new nucleation sites on the surface of the first layer. A second ceramic barrier layer (10) is formed on the first barrier layer (5) using the new nucleation sites. The second ceramic barrier layer is deposited with independent nucleation sites such that a barrier stack of enhanced quality is formed.
    Type: Application
    Filed: March 10, 2004
    Publication date: October 7, 2004
    Inventors: Karsten Heuser, Georg Wittmann, Guenter Gieres, Ralph Paetzold, Debora Henseler