Abstract: Base plate apparatus for mounting IGBT modules, the base plate apparatus includes a base plate with a mounting surface and an opposed surface. A tailored coefficient of thermal expansion interface layer is directly bonded to the mounting surface of the base plate and forms a mounting surface for mounting IGBT modules. The interface layer has a coefficient of thermal expansion ranging from approximately 4 ppm/° C. to approximately 12 ppm/° C.

Abstract: A vapor chamber structure includes a casing, a working fluid, and an improved wick layer. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. Therefore, the present invention can increase the backflow velocity of the working fluid and improve the boiling of the working fluid due to the match of the improved wick structure. Because the backflow velocity and boiling of the working fluid is increased, the heat-transmitting efficiency is increased.

Abstract: Apparatus for automatic environmental control includes an enclosed, zoned structure. A heating, ventilation and air conditioning (HVAC) system is incorporated into the structure. Each zone includes separate controls, separately-controlled air flow into and out of each zone, and separate intake, vent, damper, thermostat and humidistat for each zone. Temperature and humidity are separately controllable for each zone, and controller is in communication with HVAC system for controlling HVAC system and for controlling the damper for each zone, the controller having a map comprising a plurality of relative humidity and temperature combinations and one or more actions for automatic execution based on the combinations of temperature and humidity. A temperature sensor, a relative humidity sensor are included in each zone, and an indicator array/interface panel is in communication with the controller.

Abstract: A non-linear fin heat sink is provided for dissipating/removing heat uniformly from a device, where the heat generation is non-uniform over that device, while also providing a small and relatively lightweight heat sink. The heat sink has extended surface protrusions that are optimally shaped in recognition of convective heat transfer, conductive heat transfer, and flow resistance allowing the heat sink to offset the temperature rise of a coolant media and provide enhanced cooling for the coolant temperature, deliver optimized cooling efficiency per the local physical properties of the coolant media, be used with a fluid for effectuating heat transfer; either liquid coolant, gas coolant or a combination thereof. Furthermore the heat sink features turbulence enhancement of the coolant stream by a pin array through which coolant stream passes, such fin array featuring a non-linear shape, spacing, and height pattern to provide optimal cooling while simultaneously reducing volume and flow resistance.

Abstract: A vapor chamber structure includes a casing, a working fluid, a wick layer, a plurality of structure strengthening bodies, and a plurality of backflow accelerating bodies. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. The structure strengthening bodies are respectively arranged in the airtight vacuum chamber for supporting the casing. The backflow accelerating bodies are respectively arranged in the airtight vacuum chamber for increasing the backflow velocity of the working fluid. Therefore, the present invention can maintain the completeness of the vapor chamber structure and increase the backflow velocity of the working fluid due to the match of the structure strengthening bodies and backflow accelerating bodies. Because the backflow velocity of the working fluid is increased, the heat-transmitting efficiency is increased.

Abstract: A vapor chamber structure includes a casing, a working fluid, and an improved wick layer. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. Therefore, the present invention can increase the backflow velocity of the working fluid and improve the boiling of the working fluid due to the match of the improved wick structure. Because the backflow velocity and boiling of the working fluid is increased, the heat-transmitting efficiency is increased.

Abstract: An apparatus for monitoring environmental conditions favorable for mold, mildew and fungus growth includes a microprocessor having a data map, a temperature sensor attached to the microprocessor, a relative humidity sensor attached to the microprocessor, an indicator array attached to the microprocessor, and a power supply attached to the microprocessor. The indicator array may be a single warning light or an array with a plurality of warning lights. The indicator array may also be an audio speaker. The indicator array may also include a message display for digitally displaying one or more ambient condition.

Abstract: An apparatus for monitoring environmental conditions favorable for mold, mildew and fungus growth includes a microprocessor having a data map, a temperature sensor attached to the microprocessor, a relative humidity sensor attached to the microprocessor, an indicator array attached to the microprocessor, and a power supply attached to the microprocessor. The map has a plurality of relative humidity and temperature combinations and one or more suggested actions, for the user, based on the combinations. The indicator array may be a single warning light or an array with a plurality of warning lights. The indicator array may also be a text display or an audio speaker for displaying one or more ambient conditions or suggested actions. Barometric pressure data may also be included with the map for more comprehensive suggestions for action.

Abstract: An apparatus for monitoring environmental conditions favorable for mold, mildew and fungus growth includes a microprocessor having a data map, a temperature sensor attached to the microprocessor, a relative humidity sensor attached to the microprocessor, an indicator array attached to the microprocessor, and a power supply attached to the microprocessor. The map has a plurality of relative humidity and temperature combinations and one or more suggested actions, for the user, based on the combinations. The indicator array may be a single warning light or an array with a plurality of warning lights. The indicator array may also be a text display or an audio speaker for displaying one or more ambient conditions or suggested actions. Barometric pressure data may also be included with the map for more comprehensive suggestions for action.

Abstract: An apparatus for monitoring environmental conditions favorable for mold, mildew and fungus growth includes a microprocessor having a data map, a temperature sensor attached to the microprocessor, a relative humidity sensor attached to the microprocessor, an indicator array attached to the microprocessor, and a power supply attached to the microprocessor. The indicator array may be a single warning light or an array with a plurality of warning lights. The indicator array may also be an audio speaker. The indicator array may also include a message display for digitally displaying one or more ambient condition.

Abstract: A structure or enclosure with a solar energy absorbing system, arranged so that at least one wall faces the sun and at least one wall is shaded. The structure has a thermal switch between the solar energy absorbing unit and a solar energy storage unit. The structure has a thermal switch between the solar energy storage unit and the interior. The structure has a thermal switch between the shaded wall of the structure and a heat dissipating heat sink. The thermal switch between the solar energy absorbing unit and the solar energy storage unit is modular and is replaceable with other thermal switches having different temperature set points. The thermal switches control the temperature of the interior of the structure in varying climates and sunlight conditions to within a desirable and limited range.

Abstract: An enclosure for electronic equipment is constructed to orient a plurality of circuit boards in series of parallel slots with air-flow channels therebetween. Cooling air is delivered at constant pressure to inlet ends of each of the channels. Each channel is provided with a thermally sensitive air-flow restrictor at its outlet end. Each air-flow channel is thus provided with independent air temperature control. As a result, each circuit board slot can be utilized for a board with varying heat generating and air resistance characteristics. Each board is cooled properly irrespective of its power usage or shape. Additionally, the enclosures can be relocated to different environments having a wide range of ambient temperatures without adversely effecting the operational characteristics of components on the circuit boards.

Abstract: A thermosyphon-powered jet-impingement cooling device delivering superior thermal energy dissipation for compact heat sources such as electronic devices. Thermal energy from a heat source travels through the heat source/heat spreader plate interface to the heat spreader plate and heat spreader plate extended surface. Thermal energy is transferred by convection to a single or two-phase coolant media. The heated and/or boiling, less dense coolant begins to expand and rise. The rising coolant or vapor approaches a cold plate and velocity slows due to the greater cross-sectional flow area. The coolant heat energy is released by convection or condensation to the heat dissipation/fluid interface surface, and is then conducted through the cold plate, across the cold plate/heat dissipating device thermal interface, and then to the heat dissipating device. As the cooled media contracts and/or condenses to form droplets, the coolant or droplets begin to fall.

Abstract: A fastener temporarily attaches articles through aligned apertures in the articles including a nut plate allowing the articles to be assembled by one assembler. The fastener has a flange, a cylindrical sleeve, and a solid pin. The flange ensures that the fastener does not pass completely through the aligned apertures. The sleeve supports articles and couples with the flange on one end of the sleeve and the solid pin on the other end of the sleeve. The solid pin can support a nut plate and further engages the threads in the nut plate through friction. The juncture between the sleeve and the solid pin is formed to allow the pin to break away from the cylindrical sleeve when pressure is applied. A screw or other threaded fastener is inserted through the cylindrical sleeve and pressed against the solid pin. Once the solid pin breaks away, the threads on the screw engage with the corresponding threads on the nut plate.

Abstract: An electrical wetness sensor powered by the electrogalvanic action of an anode, a cathode and an electrolyte. In the preferred embodiment the electrolyte is urine and the device is used to warn of incontinence. This device contains the following features: sensitivity to wetness; electrical battery-less operation; hermetic and permanent sealing; no-maintenance operation; portability, inexpensiveness, and disposableness. The alarm unit may be configured to produce a visual and/or audible signal. In the preferred embodiment the alarm unit transmits a signal to a remote FM radio receiver or dedicated device to announce incontinence. Incontinence is announced by a tone, visual signal, silencing of the radio station the receiver is tuned to, or activation of a microphone within the alarm unit to allow remote listening. Any or all of these indications may be designed into the device and are discussed.

Abstract: A strongly adherent laminate with enhanced thermal conductivity and high dielectric strength. The preferred embodiment includes an aluminum-surfaced substrate, a copper layer adjacent the aluminum oxide layer, and optionally, a tin/silver layer adjacent the copper deposition layer, forming a base substrate laminate for mounting a multilayer wiring board laminate to has been discovered. Another embodiment includes a metallic-surfaced substrate, an adjacent vapor-deposited dielectric layer, a metallic conductor layer adjacent the dielectric layer, and optionally, a solder layer adjacent the metallic conductor layer. Surprisingly, such construction has been demonstrated to have a self-healing dielectric whereby dielectric breakdown strength is maintained in repeated tests. Such laminates will find utility in the electronics industry in the fabrication of printed circuit boards and afford a combination of high adhesion, thermal conductivity, and dielectric strength heretofore unknown in the industry.

Abstract: A thermosyphon-powered jet-impingement cooling device delivering superior thermal energy dissipation for compact heat sources such as electronic devices. Thermal energy from a heat source travels through the heat source/heat spreader plate interface to the heat spreader plate and heat spreader plate extended surface. Thermal energy is transferred by convection to a single or two-phase coolant media. The heated and/or boiling, less dense coolant begins to expand and rise. The rising coolant or vapor approaches a cold plate and velocity slows due to the greater cross-sectional flow area. The coolant heat energy is released by convection or condensation to the heat dissipation/fluid interface surface, and is then conducted through the cold plate, across the cold plate/heat dissipating device thermal interface, and then to the heat dissipating device. As the cooled media contracts and/or condenses to form droplets, the coolant or droplets begin to fall.

Abstract: A method and apparatus for simultaneously coupling a heat sink to an electrical device and reducing electromagnetic interference caused by the heat sink being coupled to the electrical device. A mother board, as used in an electronic circuit, is situated so that an electrical pad is located proximate to a socket for receiving the electrical device. The electrical device is placed inside the socket, and further has the heat sink thermally coupled to a top surface thereof. The heat sink serves to dissipate any heat radiating from the electrical device into a surrounding air mass. A heat sink clip physically and electrically engages with the heat sink and physically engages with the socket, thereby securing the heat sink to the device and the device to the socket. The heat sink clip also includes a tab that, when the clip is engaged with the heat sink, is in electrical contact with the pad, which in turn is in contact with a ground power supply.