Abstract: Device packages often include walls build on a heat sink that surrounds a device die that thermally interacts with the heat sink. Use of raised or depressed feature on said heat sink that contacts the walls improves the cohesiveness of the package. By appropriately positioning these features contaminant infusion into the package is improved without degrading cohesiveness.

Abstract: A system is provided for mounting a fiber between locks by placing the locks at or near the natural inflection points of a sinusoidally curved fiber. This is accomplished by angularly offsetting the fiber exiting the locks at equal angles from an imaginary center line drawn between the locks, and by providing enough slack in the fiber between the locks to cause the inflection points to be positioned at or near the locks.

Abstract: A silicon-based laser mounting structure is disclosed which provides improved interconnection between a semiconductor optical device, such as a laser, and an external high frequency modulation current source, by reducing the presence of parasitic inductive elements in the interconnecting network. The structure includes a stripline transmission path formed by depositing metal conductive strips on the top and bottom surfaces of a silicon substrate. The conductive strips are coupled at one end to the external modulation current source. A thin film resistor is deposited between the second end of the top conductive strip and the semiconductor optical device. This thin film resistor is utilized to provide impedance matching between the optical device and the stripline. That is, for a laser with an impedance Z.sub.L, and a stripline designed to have an impedance Z.sub.S, the resistance R is chosen such that R+Z.sub.L =Z.sub.S.

Abstract: A silicon-based laser mounting structure is disclosed which provides improved interconnection between a semiconductor optical device, such as a laser, and an external high frequency modulation current source, by reducing the presence of parasitic inductive elements in the interconnecting network. The structure includes a stripline transmission path formed by depositing metal conductive strips on the top and bottom surfaces of a silicon substrate. The conductive strips are coupled at one end to the external modulation current source. A thin film resistor is deposited between the second end of the top conductive strip and the semiconductor optical device. This thin film resistor is utilized to provide impedance matching between the optical device and the stripline. That is, for a laser with an impedance Z.sub.L, and a stripline designed to have an impedance Z.sub.S, the resistance R is chosen such that R+Z.sub.L =Z.sub.S.

Abstract: A method of achieving radial (x,y) alignment between an active device subassembly and an optical fiber subassembly of an optical package is disclosed. The method relies on the use of mating sections with essentially identical outer diameters. The subassemblies are brought into contact and are first joined at the two points where the edges of the piece parts coincide (flush points). It has been determined that by continuing the attachment process at symmetric locations about one of the flush points, minimal disturbance of throughput efficiency will be maintained. The optical throughput is continually monitored to determined at which particular flush point the attachment process should proceed. In particular, as soon as the throughput efficiency drops below a predetermined value, the attachment process is rotated to continue at the opposite flush point.

Abstract: An optical package includes a two-piece fiber subassembly which allows for separate axial and radial alignment of the fiber to the active optical device. The subassembly consists of an inner ferrule encasing the fiber and an outer sleeve which holds the ferrule. The ferrule is moved axially within the sleeve to perfect the axial alignment of the fiber and the device. The sleeve includes a number of openings around its circumference to expose the ferrule. Once axial alignment is achieved, the outer sleeve is attached to the ferrule through these openings to fix the axial alignment.