Patents by Inventor Ralph V. Wilhelm, Jr.

Ralph V. Wilhelm, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Exhaust electrode process for exhaust gas oxygen sensor
    Patent number: 4303490
    Abstract: A method of sputtering a palladium or palladium-platinum exhaust gas electrode onto a vitrified zirconia thimble for an electrochemical-type exhaust gas oxygen sensor. Porous high surface area films are deposited that have more consistent properties. A sputtering target is spaced about 3.0-4.5 cm from the thimble and more than 6 cm from the sputtering anode. A pressure of about 10-20 millitorr is used during sputtering at a DC power of about 13-22 watts/cm.sup.2 of target area.
    Type: Grant
    Filed: September 22, 1980
    Date of Patent: December 1, 1981
    Assignee: General Motors Corporation
    Inventors: Terry J. Gold, Frederick L. Kennard, III, Paul C. Kikuchi, Ralph V. Wilhelm, Jr.
  • Electrode sputtering process for exhaust gas oxygen sensor
    Patent number: 4253931
    Abstract: A method of sputtering platinum onto a vitrified zirconia thimble to form an exhaust electrode for an electrochemical-type exhaust gas oxygen sensor. The electrode is sputtered under an atmosphere consisting essentially of more than about 50% oxygen and/or nitrogen by volume. Sensors having low symmetrical transition times are produced.
    Type: Grant
    Filed: November 30, 1979
    Date of Patent: March 3, 1981
    Assignee: General Motors Corporation
    Inventors: Terry J. Gold, Kurt D. Humphrey, Keith A. Penney, Robert J. Smith, Randy L. Voto, Ralph V. Wilhelm, Jr.
  • Exhaust electrode process for exhaust gas oxygen sensor
    Patent number: 4244798
    Abstract: A method of sputtering a platinum exhaust gas electrode onto a vitrified zirconia thimble for an electrochemical-type exhaust gas oxygen sensor. Porous high surface area platinum films are deposited that have more consistent properties. A platinum target is spaced about 3.0-4.5 cm from the thimble and more than 6 cm from the sputtering anode. A pressure of about 10-20 millitorr is used during sputtering at a DC power of about 13-22 watts/cm.sup.2 of target area.
    Type: Grant
    Filed: October 29, 1979
    Date of Patent: January 13, 1981
    Assignee: General Motors Corporation
    Inventors: Terry J. Gold, Frederick L. Kennard, III, Paul C. Kikuchi, Ralph V. Wilhelm, Jr.