Abstract: Systems, devices and methods are disclosed for suppressing the 2LO frequency spur, output from a mixer. In various exemplary embodiments, a DC bias circuit is electrically connected to provide DC bias to one or more non-linear elements of the mixer. The biasing voltage is used to cause the current-voltage characteristics and/or junction capacitances between non-linear elements to be more symmetric and/or to suppress 2LO leakage currents that form 2LO frequency spurs at the output of the mixer. The non-linear elements may comprise one of: BJT's, diodes, and FET's. The mixer may be one of: a subharmonic mixer; a fundamental resistive mixer; a fundamental subharmonic transconductance mixer; and a fundamental transconductance mixer comprising an anti-parallel diode pair. The system may further be configured to automatically determine an appropriate DC bias voltage level that will improve one of the LO-IF isolation and the LO-RF isolation.

Abstract: Systems, devices and methods are disclosed for suppressing the 2LO frequency spur, output from a mixer. In various exemplary embodiments, a DC bias circuit is electrically connected to provide DC bias to one or more non-linear elements of the mixer. The biasing voltage is used to cause the current-voltage characteristics and/or junction capacitances between non-linear elements to be more symmetric and/or to suppress 2LO leakage currents that form 2LO frequency spurs at the output of the mixer. The non-linear elements may comprise one of: BJT's, diodes, and FET's. The mixer may be one of: a subharmonic mixer; a fundamental resistive mixer; a fundamental subharmonic transconductance mixer; and a fundamental transconductance mixer comprising an anti-parallel diode pair. The system may further be configured to automatically determine an appropriate DC bias voltage level that will improve one of the LO-IF isolation and the LO-RF isolation.

Abstract: A method for affixing a resonator to a printed circuit board is provided. The method uses a thin metal film which may be affixed to a surface of a stand off, or directly to a surface of a resonator. The metalized surface may be affixed to a printed circuit board using a molten agent with a surface tension which withstands the downward force exerted by the puck's weight. The metalized surface may be affixed to a printed circuit board using a solder paste and the solder is allowed to reflow. The surface tension of the molten solder causes the resonator (or resonator puck) to self-center, ensuring proper placement and eliminating the need for repositioning. Since the resonator is not positioned using traditional glues which are subject to shifting during transportation or curing, then the resonator is not subject to shifting, eliminating the need to reposition the resonator after the resonator becomes fixed.