Patents by Inventor Ramesh Peelamedu

Ramesh Peelamedu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microwave combustion system for internal combustion engines
    Patent number: 7671309
    Abstract: A microwave combustion system is presented that can replace the conventional spark plug in an internal combustion engine. One or more microwave pulses are provided to a microwave feed in a plug that sits in the cylinder. A microwave generated plasma generated by the plug in the vicinity of a fuel mixture can provide for highly efficient combustion of the fuel-air mixture.
    Type: Grant
    Filed: September 11, 2006
    Date of Patent: March 2, 2010
    Assignee: BTU International, Inc.
    Inventors: Devendra Kumar, Dominique Tasch, Ramesh Peelamedu, Satyendra Kumar, David Brosky, Michael Gregersen
  • MICROWAVE COMBUSTION SYSTEM FOR INTERNAL COMBUSTION ENGINES
    Publication number: 20090266325
    Abstract: A microwave combustion system is presented that can replace the conventional spark plug in an internal combustion engine. One or more microwave pulses are provided to a microwave feed in a plug that sits in the cylinder. A microwave generated plasma generated by the plug in the vicinity of a fuel mixture can provide for highly efficient combustion of the fuel-air mixture.
    Type: Application
    Filed: September 11, 2006
    Publication date: October 29, 2009
    Inventors: Devendra Kumar, Dominique Tasch, Ramesh Peelamedu, Satyendra Kumar, David Brosky, Michael Gregersen
  • Microwave hybrid and plasma rapid thermal processing of semiconductor wafers
    Publication number: 20080207008
    Abstract: Microwave energy is used as a radiation source for rapid thermal processing of semiconductor wafers. In one aspect, a hybrid material formed from a microwave modulator material is used to provide temperature uniformity across the wafer and to avoid cracking or breaking of wafers due to the development of thermal stresses. In another aspect, microwave-generated atmospheric pressure plasma is used to heat the wafer either directly or indirectly.
    Type: Application
    Filed: January 23, 2008
    Publication date: August 28, 2008
    Inventors: Ramesh Peelamedu, David C. Wong