Abstract: An integrated circuit device includes a thin semiconductor layer disposed on a surface of a wafer, a plurality of wafer-scale integrated (WSI) circuits formed on the semiconductor layer, and a node formed on the semiconductor layer that provides an optoelectronic interface to an axial optical data bus for high-speed optical interconnectivity between the WSI circuits and other external devices interconnected to the optical data bus.

Abstract: A wafer-scale module includes a plurality of stacked wafers, each having a thin semiconductor layer disposed on a surface of the wafer, a plurality of wafer-scale integrated (WSI) circuits formed on the semiconductor layer and a plurality of nodes formed on the semiconductor layer. Each node provides an optoelectronic interface to an axial optical waveguide for high-speed optical interconnectivity between the WSI circuits and other integrated wafer circuit devices of the stack. A top plate is included and is disposed on the plurality of stacked wafer devices. A base plate, included for purposes of thermal dissipation, is disposed opposite the top plate such that the plurality of stacked wafers are sandwiched between the top plate and the base plate and all are assembled.

Abstract: A standardized interface between a spacecraft backbone structure (48) and multiple spacecraft modules (26) that are coupled to the backbone structure mechanically, electrically and optically. The interface structure includes power connection pins (42 or 50) that connect to a power bus in the backbone structure, data signal pins (44) that connect to a conventional data bus in the backbone structure, and an optical connection (46 or 56) that connects to an optical data bus (60) in the backbone structure. Optionally, the interface also includes a wireless data bus (54) using infrared propagation along the backbone structure, and a radio-frequency (RF) microstrip connector (52) for transmission of data at radio frequencies. The optical data connection employs an optical interface unit (62) in each spacecraft module (26) to convert optical signals from the optical data bus (60) to corresponding electrical signals, and a cross-point switch (74) to distribute the signals to appropriate destinations on the module.

Abstract: A compact spacecraft (10, 22) having a potentially long life in orbit as a result of its use of non-moving and solid-state components entirely or wherever possible. Amorphous silicon arrays (14, 24, 44) are used for solar energy collection. Because the arrays are not limited to a flat panel configuration, no movement is needed except for possible initial deployment. Phased arrays (12, 26) are used wherever possible for antenna arrays, in combination with torque rods (18, 3) for coarse attitude control of the spacecraft. Avionics modules (30, 50) are fabricated using large wafer-scale techniques and energy storage using long life battery or a solid-state capattery (52) technology. Propulsion is also effected with no moving parts, using waffle propulsion modules (20, 28, 54), which use elemental containers of propellant that is selectively ignited to supply propulsive force.

Abstract: A spacecraft (10) having a cryogenic cooler (24) that maintains different temperatures in thermally insulated and nested enclosures (26, 28, 12). In the coldest enclosure (26), which is maintained, for example, approximately 10.degree. K, low-temperature superconducting (LTS) processors (32, 34) perform bus and payload processing functions at very high speed. The next-coldest enclosure (28) is maintained at approximately 77.degree. K and houses high-temperature superconducting (HTS) electronic modules, such as for power regulation and distribution (40) and a payload sensor processing module (38). The third of the enclosures (12) is maintained at approximately 300.degree. K and houses other modules operating at room temperature, including a transponder (44), power control (46), energy storage (48), a propulsion subsystem (22), a downlink data processing module (49) and the cryogenic cooler (24) itself.

Abstract: A spacecraft avionics module in which integrated circuit chip packages or chips are mounted in direct contact with the surface of a radiator panel, to enhance dissipation of heat from the integrated circuit and to allow electronics to be packed more densely while still dissipating sufficient heat to allow the electronics to operate at a desirable temperature. Conduction of heat from the electronics to the radiator panel is further enhanced by the use of a thermally conductive adhesive disposed between the integrated circuit chip packages or chips and the radiator panel, which may include heatpipes for more uniform heat distribution across the panel.

Abstract: A spacecraft structure using functionally independent modules assembled around a lightweight core structure to provide a vehicle that is lighter, uses less volume, and is easier to design, manufacture and test than a conventional spacecraft. In the disclosed embodiments, the modules are formed on generally flat panels, which serve as thermal radiators. The modules extend radially from the core structure and are attached to the core structure either in coplanar rows that extend axially along the core structure or in a coplanar set that extends circumferentially around the core structure. Interconnection between modules is achieved through a backbone interface, through which the modules are connected to the core structure. A large number of variant configurations may be implemented using the modular approach, by selecting a core, components and modules of number and size to meet mission requirements.

Abstract: A process for designing and producing spacecraft more efficiently, without the excessive time, complexity and expense usually associated with spacecraft design. The process moves the design complexity usually associated with spacecraft design to payload modules whose designs are potentially reusable in other spacecraft missions. Each module is designed to be largely independent of a parent spacecraft structure, the design of which can be simplified to accommodate multiple modules that connect to the parent structure through a standardized backbone interface. Each module is designed for independent structural integrity, and to provide its own thermal management. Modules may also provide their own power regulation and, optionally, their own power storage and generation capabilities. Modules may also provide their own attitude control systems. Attachment of modules to the parent structure is simplified because of the modules' independence.

Abstract: A spacecraft avionics module that is for the most part functionally independent of a core spacecraft structure, and provides its own structural integrity, thermal management and some level of power management. The illustrative embodiment of the module is formed as a flat panel that also serves as a thermal radiator. Electronic components are mounted directly onto the panel, which is normally attached by mounting hardware to the core spacecraft structure, through a backbone interface that provides data interconnection between modules and, in some cases, supplies unregulated power to the module. The module may include a power regulation function, or may also include power storage and power generation functions. For complete independence, the module may also include its own attitude control system.

Abstract: A spacecraft avionics module having a selected degree of electrical power independence from a core spacecraft structure to which the module is attached. The module of the invention includes at least a power regulator and converter function. Other embodiments of the invention also include an energy storage device and a power generator on the module itself, for complete decentralization of electrical power management for the spacecraft.