Patents by Inventor Randal L. Ternes

Randal L. Ternes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Switchable transmit and receive phased array antenna
    Patent number: 10297923
    Abstract: Disclosed is a switchable transmit and receive phased array antenna (“STRPAA”). As an example, the STRPAA may include a housing, a multilayer printed wiring board (“MLPWB”) within the housing having a top surface and a bottom surface, a plurality of radiating elements located on the top surface of the MLPWB, and a plurality of transmit and receive (“T/R”) modules attached to the bottom surface of the MLPWB. The STRPAA may also include a plurality of vias, wherein each via, of the plurality of vias, passes through the MLPWB and is configured as a signal path between a T/R module, of the plurality of T/R modules, on the bottom surface of the MLPWB and a radiating element, of the plurality of radiating elements, located on the top surface of the MLPWB opposite the T/R module.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: May 21, 2019
    Assignee: THE BOEING COMPANY
    Inventors: Ming Chen, Jimmy Susumu Takeuchi, Rodney D. Cameron, Isaac R. Bekker, Peter T. Heisen, Dan R. Miller, Randal L. Ternes
  • SWITCHABLE TRANSMIT AND RECEIVE PHASED ARRAY ANTENNA
    Publication number: 20160172755
    Abstract: Disclosed is a switchable transmit and receive phased array antenna (“STRPAA”). As an example, the STRPAA may include a housing, a multilayer printed wiring board (“MLPWB”) within the housing having a top surface and a bottom surface, a plurality of radiating elements located on the top surface of the MLPWB, and a plurality of transmit and receive (“T/R”) modules attached to the bottom surface of the MLPWB. The STRPAA may also include a plurality of vias, wherein each via, of the plurality of vias, passes through the MLPWB and is configured as a signal path between a T/R module, of the plurality of T/R modules, on the bottom surface of the MLPWB and a radiating element, of the plurality of radiating elements, located on the top surface of the MLPWB opposite the T/R module.
    Type: Application
    Filed: December 12, 2014
    Publication date: June 16, 2016
    Inventors: Ming Chen, Jimmy Susumu Takeuchi, Rodney D. Cameron, Isaac R. Bekker, Peter T. Heisen, Dan R. Miller, Randal L. Ternes