Patents by Inventor Randall C. Veitch
Randall C. Veitch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11726274Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.Type: GrantFiled: November 1, 2021Date of Patent: August 15, 2023Assignee: Wavefront Research, Inc.Inventors: Randall C. Veitch, Thomas W. Stone
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Patent number: 11652129Abstract: The present disclosure provides an optoelectronic module. In one aspect, the optoelectronic module includes an insertion member including a housing insert and an imager disposed in the housing insert, and a receiving member including an interposer, a housing disposed on the interposer, and an optoelectronic device electrically connected to said interposer. The housing of the receiving member is configured to engage and receive the housing insert of the insertion member. The optoelectronic device of the receiving member is configured to align with the imager of the insertion member.Type: GrantFiled: June 21, 2021Date of Patent: May 16, 2023Assignee: Wavefront Research, Inc.Inventors: David M. Vincentsen, Jonas D. Corl, Thomas A. Mitchell, Michelle M. Stone, Thomas W. Stone, Randall C. Veitch
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Patent number: 11454229Abstract: Systems and methods that maintain a vacuum for a long period of time in a portable vacuum chamber are disclosed. Systems and methods for the maintenance of a vacuum in cryogenic Dewars for imaging systems with high gas loads using an integral pump and getter are also disclosed.Type: GrantFiled: September 16, 2020Date of Patent: September 27, 2022Assignee: Wavefront Research, Inc.Inventors: Jonas D. Corl, Randall C. Veitch
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Patent number: 11163124Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.Type: GrantFiled: September 14, 2020Date of Patent: November 2, 2021Assignee: Wavefront Research, Inc.Inventors: Randall C. Veitch, Thomas W. Stone
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Patent number: 11043526Abstract: The present disclosure provides an optoelectronic module. In one aspect, the optoelectronic module includes an insertion member including a housing insert and an imager disposed in the housing insert, and a receiving member including an interposer, a housing disposed on the interposer, and an optoelectronic device electrically connected to said interposer. The housing of the receiving member is configured to engage and receive the housing insert of the insertion member. The optoelectronic device of the receiving member is configured to align with the imager of the insertion member.Type: GrantFiled: May 24, 2020Date of Patent: June 22, 2021Assignee: Wavefront Research, Inc.Inventors: David M. Vincentsen, Jonas D. Corl, Thomas A. Mitchell, Michelle M. Stone, Thomas W. Stone, Randall C. Veitch
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Patent number: 10775572Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.Type: GrantFiled: May 7, 2018Date of Patent: September 15, 2020Assignee: Wavefront Research, Inc.Inventors: Randall C. Veitch, Thomas W. Stone
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Patent number: 10665630Abstract: The present disclosure provides an optoelectronic module. In one aspect, the optoelectronic module includes an insertion member including a housing insert and an imager disposed in the housing insert, and a receiving member including an interposer, a housing disposed on the interposer, and an optoelectronic device electrically connected to said interposer. The housing of the receiving member is configured to engage and receive the housing insert of the insertion member. The optoelectronic device of the receiving member is configured to align with the imager of the insertion member.Type: GrantFiled: August 5, 2019Date of Patent: May 26, 2020Assignee: Wavefront Research, Inc.Inventors: David M. Vincentsen, Jonas D. Corl, Thomas A. Mitchell, Michelle M. Stone, Thomas W. Stone, Randall C. Veitch
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Patent number: 10373998Abstract: The present disclosure provides an optoelectronic module. In one aspect, the optoelectronic module includes an insertion member including a housing insert and an imager disposed in the housing insert, and a receiving member including an interposer, a housing disposed on the interposer, and an optoelectronic device electrically connected to said interposer. The housing of the receiving member is configured to engage and receive the housing insert of the insertion member, The optoelectronic device of the receiving member is configured to align with the imager of the insertion member.Type: GrantFiled: March 14, 2014Date of Patent: August 6, 2019Assignee: Wavefront Research, Inc.Inventors: David M. Vincentsen, Jonas D. Corl, Thomas A. Mitchell, Michelle M. Stone, Thomas W. Stone, Randall C. Veitch
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Patent number: 9964716Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.Type: GrantFiled: September 11, 2015Date of Patent: May 8, 2018Assignee: WAVEFRONT RESEARCH, INC.Inventors: Randall C. Veitch, Thomas W. Stone
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Patent number: 9559774Abstract: In one embodiment, the present teachings provide for an efficient means to implement bidirectional data and signal channels in optical interconnects. Each optical interconnect channel may include two pairs of emitters and detectors that are imaged onto each other. Many such bidirectional optical channels may be simultaneously interconnected in dense two-dimensional arrays. The send or receive state of each bidirectional optical channel may be directly set in some embodiments by an electronic control signal. In other bidirectional optical channel embodiments, the send/receive state may be controlled locally and autonomously as derived from the output of the local detector.Type: GrantFiled: August 20, 2012Date of Patent: January 31, 2017Assignee: Wavefront Research, Inc.Inventors: Randall C. Veitch, Thomas W. Stone
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Patent number: 9137889Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.Type: GrantFiled: May 7, 2012Date of Patent: September 15, 2015Assignee: Wavefront Research, Inc.Inventors: Randall C. Veitch, Thomas W. Stone
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Patent number: 8378475Abstract: Carriers enabling multichip driving of optoelectronic interconnects are disclosed. In one instance, the carriers provide a substantially perpendicular interface between the host circuit board and the optoelectronic die.Type: GrantFiled: June 1, 2009Date of Patent: February 19, 2013Assignee: Wavefront Research, Inc.Inventors: Randall C. Veitch, Thomas W. Stone
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Patent number: 8373627Abstract: A driver circuit for driving a light emitting semiconductor device. The driver circuit of this invention includes a capacitor connected between a source of voltage pulses and a light emitting semiconductor device.Type: GrantFiled: July 30, 2004Date of Patent: February 12, 2013Assignee: Wavefront Research, Inc.Inventor: Randall C. Veitch
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Patent number: 8247756Abstract: In one embodiment, the present teachings provide for an efficient means to implement bidirectional data and signal channels in optical interconnects. Each optical interconnect channel may include two pairs of emitters and detectors that are imaged onto each other. Many such bidirectional optical channels may be simultaneously interconnected in dense two-dimensional arrays. The send or receive state of each bidirectional optical channel may be directly set in some embodiments by an electronic control signal. In other bidirectional optical channel embodiments, the send/receive state may be controlled locally and autonomously as derived from the output of the local detector.Type: GrantFiled: June 3, 2009Date of Patent: August 21, 2012Assignee: Wavefront Research, Inc.Inventors: Randall C. Veitch, Thomas W. Stone
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Patent number: 8171625Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.Type: GrantFiled: June 2, 2009Date of Patent: May 8, 2012Assignee: Wavefront Research, Inc.Inventors: Randall C. Veitch, Thomas W. Stone
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Patent number: 4690569Abstract: Apparatus and method for implementing a characterized thermal profile upon a temperature/time dependent process on any material or materials susceptible to such thermal processing in accordance with a closed loop environmental feedback system and a corresponding predetermined characterized thermal profile.Type: GrantFiled: May 22, 1986Date of Patent: September 1, 1987Assignee: Qualtronics CorporationInventor: Randall C. Veitch