Patents by Inventor Randall J. Werner
Randall J. Werner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10905029Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: GrantFiled: October 29, 2019Date of Patent: January 26, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
-
Patent number: 10757833Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: GrantFiled: June 21, 2019Date of Patent: August 25, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
-
Publication number: 20200068744Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: ApplicationFiled: October 29, 2019Publication date: February 27, 2020Inventors: Paul F. BODENWEBER, Kenneth C. MARSTON, Kamal K. SIKKA, Hilton T. TOY, Randall J. WERNER, Jeffrey A. ZITZ
-
Patent number: 10542636Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: GrantFiled: July 30, 2018Date of Patent: January 21, 2020Assignee: International Business Machines CorporationInventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
-
Publication number: 20190335617Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: ApplicationFiled: June 21, 2019Publication date: October 31, 2019Inventors: Paul F. BODENWEBER, Kenneth C. MARSTON, Kamal K. SIKKA, Hilton T. TOY, Randall J. WERNER, Jeffrey A. ZITZ
-
Patent number: 10381276Abstract: A laminate includes a plurality of buildup layers disposed on a core and a plurality of unit cells defined in the buildup layers. Each unit cell includes: at least one test via that passes through at least two of the buildup layers and that is electrically connected to testing locations on a probe accessible location of the laminate; and two or more dummy vias disposed in the unit cell. The dummy vias are arranged in the unit cell at one of a plurality of distances from the test via.Type: GrantFiled: December 17, 2015Date of Patent: August 13, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Sushumna Iruvanti, Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha, Krishna R. Tunga, Thomas A. Wassick, Randall J. Werner, Jeffrey A. Zitz
-
Patent number: 10249548Abstract: A laminate includes a plurality of buildup layers disposed on a core and a plurality of unit cells defined in the buildup layers. Each unit cell includes: at least one test via that passes through at least two of the buildup layers and that is electrically connected to testing locations on a probe accessible location of the laminate; and two or more dummy vias disposed in the unit cell. The dummy vias are arranged in the unit cell at one of a plurality of distances from the test via.Type: GrantFiled: November 15, 2017Date of Patent: April 2, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Sushumna Iruvanti, Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha, Krishna R. Tunga, Thomas A. Wassick, Randall J. Werner, Jeffrey A. Zitz
-
Patent number: 10172258Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: GrantFiled: March 17, 2017Date of Patent: January 1, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
-
Publication number: 20180338390Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: ApplicationFiled: July 30, 2018Publication date: November 22, 2018Inventors: Paul F. BODENWEBER, Kenneth C. MARSTON, Kamal K. SIKKA, Hilton T. TOY, Randall J. WERNER, Jeffrey A. ZITZ
-
Publication number: 20180076101Abstract: A laminate includes a plurality of buildup layers disposed on a core and a plurality of unit cells defined in the buildup layers. Each unit cell includes: at least one test via that passes through at least two of the buildup layers and that is electrically connected to testing locations on a probe accessible location of the laminate; and two or more dummy vias disposed in the unit cell. The dummy vias are arranged in the unit cell at one of a plurality of distances from the test via.Type: ApplicationFiled: November 15, 2017Publication date: March 15, 2018Inventors: Sushumna Iruvanti, Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha, Krishna R. Tunga, Thomas A. Wassick, Randall J. Werner, Jeffrey A. Zitz
-
Patent number: 9721870Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: GrantFiled: December 5, 2014Date of Patent: August 1, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
-
Publication number: 20170196119Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: ApplicationFiled: March 17, 2017Publication date: July 6, 2017Inventors: Paul F. BODENWEBER, Kenneth C. MARSTON, Kamal K. SIKKA, Hilton T. TOY, Randall J. WERNER, Jeffrey A. ZITZ
-
Publication number: 20170178982Abstract: A laminate includes a plurality of buildup layers disposed on a core and a plurality of unit cells defined in the buildup layers. Each unit cell includes: at least one test via that passes through at least two of the buildup layers and that is electrically connected to testing locations on a probe accessible location of the laminate; and two or more dummy vias disposed in the unit cell. The dummy vias are arranged in the unit cell at one of a plurality of distances from the test via.Type: ApplicationFiled: December 17, 2015Publication date: June 22, 2017Inventors: Sushumna Iruvanti, Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha, Krishna R. Tunga, Thomas A. Wassick, Randall J. Werner, Jeffrey A. Zitz
-
Publication number: 20160165755Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: ApplicationFiled: December 5, 2014Publication date: June 9, 2016Inventors: Paul F. BODENWEBER, Kenneth C. MARSTON, Kamal K. SIKKA, Hilton T. TOY, Randall J. WERNER, Jeffrey A. ZITZ
-
Patent number: 8090504Abstract: Methods, systems and apparatus for automatically ensuring passenger safety by identifying article(s) in need of securing in a vehicle and attaching at least one wireless signaling component to each article. Each wireless signaling component includes a wireless signaling device and a mechanical blocking device that controls a wireless signal emitted from the wireless signaling device. The emitted wireless signaling indicates a state of the article. State information relating to a state of each article is generated and received at a data network device, which generates state results based on this state information. The state results are output to an end user, whereby the state results identify those articles that are secured, unsecured, and/or improperly secured, for automatically ensuring passenger safety.Type: GrantFiled: January 9, 2008Date of Patent: January 3, 2012Assignee: International Business Machines CorporationInventors: David C. Long, Randall J. Werner
-
Publication number: 20090177357Abstract: Methods, systems and apparatus for automatically ensuring passenger safety by identifying article(s) in need of securing in a vehicle and attaching at least one wireless signaling component to each article. Each wireless signaling component includes a wireless signaling device and a mechanical blocking device that controls a wireless signal emitted from the wireless signaling device. The emitted wireless signaling indicates a state of the article. State information relating to a state of each article is generated and received at a data network device, which generates state results based on this state information. The state results are output to an end user, whereby the state results identify those articles that are secured, unsecured, and/or improperly secured, for automatically ensuring passenger safety.Type: ApplicationFiled: January 9, 2008Publication date: July 9, 2009Applicant: International Business Machines CorporationInventors: DAVID C. LONG, Randall J. Werner
-
Patent number: 7045011Abstract: An integrated circuit screen printing nozzle that has a nozzle body, a first inner layer on the nozzle body, a second outer layer on the first layer, and an opening through the nozzle body, the first layer, and the second layer. The first and second layers can be an insert held within the body. The opening allows paste material to flow through the screen printing nozzle to the stencil mask. Also, the second outer layer includes a contact surface adapted to contact the stencil mask. One feature of the invention is that the first layer is softer (has a lower durometer) than the second layer. This allows the second layer to be more durable than the first layer and for the first layer to provide additional flexibility to the second layer. Therefore, the invention provides a nozzle that has the high durability characteristics of a hard outer surface with the compliance of a soft nozzle.Type: GrantFiled: July 7, 2003Date of Patent: May 16, 2006Assignee: International Business Machines CorporationInventors: David C. Long, Jason S. Miller, Randall J. Werner
-
Patent number: 6659002Abstract: Screening of a workpiece utilizing a screening apparatus which includes a paste dispensing apparatus and a trailing squeegee assembly in close proximity to the paste dispensing apparatus. When the screening apparatus is operable, the squeegee assembly is in contact with the workpiece at the same time as a paste is dispensed from the paste dispensing apparatus.Type: GrantFiled: October 31, 2001Date of Patent: December 9, 2003Assignee: International Business Machines CorporationInventors: Daniel T. Langdon, Keith C. O'Neil, Kurt A. Smith, Randall J. Werner, Ralph R. Comulada, Jr.
-
Publication number: 20030079627Abstract: Screening of a workpiece utilizing a screening apparatus which includes a paste dispensing apparatus and a trailing squeegee assembly in close proximity to the paste dispensing apparatus. When the screening apparatus is operable, the squeegee assembly is in contact with the workpiece at the same time as a paste is dispensed from the paste dispensing apparatus.Type: ApplicationFiled: October 31, 2001Publication date: May 1, 2003Applicant: International Business Machines CorporationInventors: Daniel T. Langdon, Keith C. O'Neil, Kurt A. Smith, Randall J. Werner, Ralph R. Comulada