Patents by Inventor Randall Jay Moss
Randall Jay Moss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11292943Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than ?40° C.Type: GrantFiled: May 13, 2019Date of Patent: April 5, 2022Assignee: The Boeing CompanyInventors: Peter Babilo, Randall Jay Moss
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Publication number: 20190264073Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than ?40° C.Type: ApplicationFiled: May 13, 2019Publication date: August 29, 2019Applicant: The Boeing CompanyInventors: Peter Babilo, Randall Jay Moss
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Patent number: 10336916Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than ?40° C.Type: GrantFiled: May 23, 2018Date of Patent: July 2, 2019Assignee: The Boeing CompanyInventors: Peter Babilo, Randall Jay Moss
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Publication number: 20180265751Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than ?40° C.Type: ApplicationFiled: May 23, 2018Publication date: September 20, 2018Applicant: The Boeing CompanyInventors: Peter Babilo, Randall Jay Moss
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Patent number: 10005927Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than ?40° C.Type: GrantFiled: September 7, 2016Date of Patent: June 26, 2018Assignee: The Boeing CompanyInventors: Peter Babilo, Randall Jay Moss
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Publication number: 20160376477Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than ?40° C.Type: ApplicationFiled: September 7, 2016Publication date: December 29, 2016Applicant: The Boeing CompanyInventors: Peter Babilo, Randall Jay Moss
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Patent number: 9464214Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than ?40° C.Type: GrantFiled: February 25, 2014Date of Patent: October 11, 2016Assignee: The Boeing CompanyInventors: Peter Babilo, Randall Jay Moss
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Patent number: 9410060Abstract: Low radio frequency loss, static dissipative adhesives are disclosed that have at most 2 percent by weight amorphous carbon dispersed in a cyanate ester resin. The adhesive has an electrical conductivity that dissipates static charge with an electrical resistivity of about 3.0×105 ohms to about 3.0×1010 ohms, and low radio frequency loss with a dielectric constant of about 1.3 to about 1.7 and a loss tangent of at most 0.006 measured at 2 gigahertz.Type: GrantFiled: January 30, 2015Date of Patent: August 9, 2016Assignee: THE BOEING COMPANYInventors: Lynn Edward Long, Randall Jay Moss
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Publication number: 20150240132Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than ?40° C.Type: ApplicationFiled: February 25, 2014Publication date: August 27, 2015Applicant: The Boeing CompanyInventors: Peter Babilo, Randall Jay Moss
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Publication number: 20150144848Abstract: Low radio frequency loss, static dissipative adhesives are disclosed that have at most 2 percent by weight amorphous carbon dispersed in a cyanate ester resin. The adhesive has an electrical conductivity that dissipates static charge with an electrical resistivity of about 3.0×105 ohms to about 3.0×1010 ohms, and low radio frequency loss with a dielectric constant of about 1.3 to about 1.7 and a loss tangent of at most 0.006 measured at 2 gigahertz.Type: ApplicationFiled: January 30, 2015Publication date: May 28, 2015Inventors: Lynn Edward Long, Randall Jay Moss
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Patent number: 8980992Abstract: An adhesive including an amorphous carbon dispersed in a cyanate ester resin, wherein the adhesive has static dissipative properties and low radio frequency loss properties.Type: GrantFiled: March 4, 2009Date of Patent: March 17, 2015Assignee: The Boeing CompanyInventors: Lynn Edward Long, Randall Jay Moss
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Patent number: 8080177Abstract: The present disclosure is generally directed to electrically conductive adhesives. More particularly, the disclosure is directed to electrically conductive adhesives comprising an organic polymer resin and an electrically conductive polymer. Advantageously, the electrically conductive adhesives have low RF loss, and are thus suitable for use in a space radar antenna and in other antenna applications where antenna components are in the RF field of view.Type: GrantFiled: August 19, 2008Date of Patent: December 20, 2011Assignee: The Boeing CompanyInventors: Lynn E. Long, Randall Jay Moss
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Publication number: 20100227964Abstract: An adhesive including an amorphous carbon dispersed in a cyanate ester resin, wherein the adhesive has static dissipative properties and low radio frequency loss properties.Type: ApplicationFiled: March 4, 2009Publication date: September 9, 2010Inventors: Lynn Edward Long, Randall Jay Moss
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Publication number: 20100043971Abstract: The present disclosure is generally directed to electrically conductive adhesives. More particularly, the disclosure is directed to electrically conductive adhesives comprising an organic polymer resin and an electrically conductive polymer. Advantageously, the electrically conductive adhesives have low RF loss, and are thus suitable for use in a space radar antenna and in other antenna applications where antenna components are in the RF field of view.Type: ApplicationFiled: August 19, 2008Publication date: February 25, 2010Inventors: Lynn E. Long, Randall Jay Moss