Abstract: A control box includes a housing defining an interior, the housing including a cover and a stiffener, the stiffener removably connected in contact with the cover, the stiffener including an outer frame and at least one cross-member. The control box further includes a heat sink removably connected in contact with the stiffener. The control box further includes a first circuit board disposed within the interior, the first circuit board positioned between the stiffener and the heat sink, and a second circuit board disposed within the interior, the second circuit board positioned between the cover and the stiffener. The cover, stiffener, and heat sink are stacked along a transverse direction.

Abstract: A SOM circuit board includes a main body having a first face surface, an opposing second face surface, a first side surface, an opposing second side surface, a first end surface, and an opposing second end surface. The first and second side surfaces have maximum lengths along a longitudinal direction which are greater than maximum lengths of the first and second end surfaces along a lateral direction. The SOM circuit board further includes a plurality of computing components, each of the plurality of computing components mounted on one of the first face surface or the second face surface. The SOM circuit board further includes an input/output connector mounted on the second face surface. The SOM circuit board further includes a plurality of mounting holes extending along the transverse direction through and between the first face surface and the second face surface.

Abstract: A control box includes a housing defining an interior, a circuit board disposed within the interior, and an input/output connector extending from the housing. The control box further includes a heat sink removably connected to the housing such that the circuit board is positioned between the housing and the heat sink. The circuit board is in contact with the heat sink.

Abstract: A SOM circuit board includes a main body having a first face surface, an opposing second face surface, a first side surface, an opposing second side surface, a first end surface, and an opposing second end surface. The first and second side surfaces have maximum lengths along a longitudinal direction which are greater than maximum lengths of the first and second end surfaces along a lateral direction. The SOM circuit board further includes a plurality of computing components, each of the plurality of computing components mounted on one of the first face surface or the second face surface. The SOM circuit board further includes an input/output connector mounted on the second face surface. The SOM circuit board further includes a plurality of mounting holes extending along the transverse direction through and between the first face surface and the second face surface.

Abstract: A control box includes a housing defining an interior, a circuit board disposed within the interior, and an input/output connector extending from the housing. The control box further includes a heat sink removably connected to the housing such that the circuit board is positioned between the housing and the heat sink. The circuit board is in contact with the heat sink.

Abstract: A control box includes a housing defining an interior, the housing including a cover and a stiffener, the stiffener removably connected in contact with the cover, the stiffener including an outer frame and at least one cross-member. The control box further includes a heat sink removably connected in contact with the stiffener. The control box further includes a first circuit board disposed within the interior, the first circuit board positioned between the stiffener and the heat sink, and a second circuit board disposed within the interior, the second circuit board positioned between the cover and the stiffener. The cover, stiffener, and heat sink are stacked along a transverse direction.

Abstract: A modular synthetic cooling jet apparatus for cooling at least one electronic component and including a first synthetic cooling jet is provided. The first synthetic cooling jet includes a first piezoelectric element, and a first pair of plates coupled to the first piezoelectric element. The first pair of plates includes a first top plate and a first bottom plate. The first synthetic cooling jet also includes a first air gap defined between the first top plate and the first bottom plate. The first flex circuit is coupled to the first piezoelectric element. The first flex circuit is configured to be coupled to an electrical power source and to transmit a first electrical signal to the first piezoelectric element. The first piezoelectric element is configured to actuate at least one of the first top plate and the first bottom plate to induce a first expelling air stream.