Abstract: A connector and compensating terminal apparatus for use with temperature responsive instruments is adapted to accommodate sensing devices such as thermocouples and RTDs having a wide plurality of lead connectors. The apparatus includes a temperature compensating block assembly having first and second conductive blocks coupled together at opposing surfaces by means of a thermally conductive and electrically insulative material, a corresponding surface of each block is adapted to receive one lead of a thermocouple sensor or RTD which lead is held in contact on the surface of the block by a holding block having a corrugated holding surface and which holding block is movably mounted with respect to the conductive block to provide a variable spacing to enable the apparatus to accommodate the different types of thermocouple or RTD lead connectors. Additionally, there are two outside conducting blocks for two of the 3 or 4 RTD leads which leads are also held in place by the respective holding blocks.