Abstract: Adapters are described herein for accurately mounting a first component or device to a second component or device in a computer or other system. In some embodiments, the adapters comprise a structural beam member that bridges a variable gap across an opening in a bracket or other component to secure the bracket to an underlying substrate (e.g., a PCB) or other piece of hardware. The adapters may have a cross-sectional shape to provide a desired stiffness, and can have a variety of planform shapes (e.g., trapezoidal or rectangular shapes) that enable the adapter to be fitted to the mounting structure with sufficient clearance to adjacent hardware and features to enable the adapters to be used without structurally modifying existing hardware. Additionally, embodiments of the adapters described herein can allow the lateral positioning of mounting bracketry to be adjusted for proper alignment of interfacing components prior to attachment.

Abstract: A printing device includes a developer for developing a latent image with toner particles; an imaging plate comprising a plurality of pixel plates; and a plurality of voltage generators connected respectively to the pixel plates. The voltage generators positively bias selected pixel plates to form a latent image that is developed with toner from the developer. Another printing device includes a developer for developing a latent image with toner particles; an imaging plate comprising a plurality of pixel plates for selectively receiving toner particles from the developer; a plurality of voltage generators for biasing respective to pixel plates; and a background grid in the imaging plate for preventing toner particles from being deposited in areas between the pixel plates, wherein the background grid is connected to a voltage generator for applying a range of biases, positive and negative to the background grid.

Abstract: An electrical connector includes a housing having a plug cavity configured to receive a modular plug therein. A terminal assembly is coupled to the housing. The terminal assembly has a plurality of terminals configured to engage corresponding terminals of the modular plug. The electronic connector includes a magnetic assembly that has a circuit board. The terminals are terminated to the circuit board. The magnetic assembly has magnetic circuits coupled to the circuit board. Each magnetic circuit has a ferrous portion and conductors circumferentially wrapped around the ferrous portion. At least one of the magnetic circuits is coated with a coating material that includes a matrix and filler. The filler can have a higher or lower dielectric constant than the matrix. The dielectric characteristics of the nano-composite can be tuned by varying the concentrations of the filler and matrix material.

Abstract: An electrical connector includes a housing having a plug cavity configured to receive a modular plug therein. A terminal assembly is coupled to the housing. The terminal assembly has a plurality of terminals configured to engage corresponding terminals of the modular plug. The electronic connector includes a magnetic assembly that has a circuit board. The terminals are terminated to the circuit board. The magnetic assembly has magnetic circuits coupled to the circuit board. Each magnetic circuit has a ferrous portion and conductors circumferentially wrapped around the ferrous portion. At least one of the magnetic circuits is coated with a coating material that includes a matrix and filler. The filler can have a higher or lower dielectric constant than the matrix. The dielectric characteristics of the nano-composite can be tuned by varying the concentrations of the filler and matrix material.

Abstract: An electrical connector assembly is provided for mating with electrical plugs. The electrical connector assembly includes a housing having a top wall and a bottom wall that is opposite the top wall. The housing includes a mating face having ports that are configured to receive the electrical plugs therein. A jack sub-assembly is held by the housing. The jack sub-assembly includes jacks having electrical contacts held within the ports for engagement with the electrical plugs. The jack sub-assembly includes a signal pin array having signal pins for connection to a host circuit board. The signal pin array includes a front side extending along the bottom wall of the housing. An electrically conductive outer shield covers the top wall of the housing. The outer shield includes a bottom flap covering an end of the bottom wall of the housing. An electrically conductive bottom shield covers the bottom wall of the housing between the bottom flap of the outer shield and the front side of the signal pin array.

Abstract: An electrical connector assembly is provided for mating with electrical plugs. The electrical connector assembly includes a housing having a top wall and a bottom wall that is opposite the top wall. The housing includes a mating face having ports that are configured to receive the electrical plugs therein. A jack sub-assembly is held by the housing. The jack sub-assembly includes jacks having electrical contacts held within the ports for engagement with the electrical plugs. The jack sub-assembly includes a signal pin array having signal pins for connection to a host circuit board. The signal pin array includes a front side extending along the bottom wall of the housing. An electrically conductive outer shield covers the top wall of the housing. The outer shield includes a bottom flap covering an end of the bottom wall of the housing. An electrically conductive bottom shield covers the bottom wall of the housing between the bottom flap of the outer shield and the front side of the signal pin array.

Abstract: A connector assembly configured to be mounted to a device substrate is provided. She connector assembly includes a connector substrate, an electronic component. contacts, and conductive wires. The connector substrate has a mounting side and an opposite supporting side interconnected by an edge. The mounting side is used to mount the connector substrate to the device substrate. The electronic component is disposed on the supporting side of the connector substrate. The contacts are provided on the mounting side of the connector substrate and are used to electrically couple the electronic component with the device substrate. The wires are joined to the electronic component and to the contacts. The wires extend along the supporting and mounting sides and wrap around the edge of the connector substrate. The conductive wires are separated from one another by a separation gap along the supporting side and the mounting side of the connector substrate.

Abstract: A connector assembly configured to be mounted to a device substrate is provided. She connector assembly includes a connector substrate, an electronic component. contacts, and conductive wires. The connector substrate has a mounting side and an opposite supporting side interconnected by an edge. The mounting side is used to mount the connector substrate to the device substrate. The electronic component is disposed on the supporting side of the connector substrate. The contacts are provided on the mounting side of the connector substrate and are used to electrically couple the electronic component with the device substrate. The wires are joined to the electronic component and to the contacts. The wires extend along the supporting and mounting sides and wrap around the edge of the connector substrate. The conductive wires are separated from one another by a separation gap along the supporting side and the mounting side of the connector substrate.

Abstract: A first type of measurement and a second type of measurement are performed to determine a fingerprint of an object. A physical attribute of the object is also determined.

Abstract: A printing device includes a developer for developing a latent image with toner particles; an imaging plate comprising a plurality of pixel plates; and a plurality of voltage generators connected respectively to the pixel plates. The voltage generators positively bias selected pixel plates to form a latent image that is developed with toner from the developer. Another printing device includes a developer for developing a latent image with toner particles; an imaging plate comprising a plurality of pixel plates for selectively receiving toner particles from the developer; a plurality of voltage generators for biasing respective to pixel plates; and a background grid in the imaging plate for preventing toner particles from being deposited in areas between the pixel plates, wherein the background grid is connected to a voltage generator for applying a range of biases, positive and negative to the background grid.

Abstract: An imaging apparatus and method include a pixel and a two point switching element.

Abstract: The present invention determines temperature and current from resistance measurements of a single magnetoresistive sensor. A dual-purpose sensor includes the magnetoresistive sensor having a single pair of terminals. The sensor is multiplexed under separate current conditions to produce both a temperature measurement and a current measurement in a vicinity of the sensor. A sensor system includes the dual-purpose sensor, a resistance sensing subsystem and a controller that controls the current conditions. A method of measuring temperature and current includes measuring a first resistance of the dual-purpose sensor while a first current is flowing in a conductor adjacent to the sensor, and measuring a second resistance of the sensor while a second current is flowing in the conductor. The first current has a known value while the second current has an unknown value. The temperature and current are determined respectively from the first and second resistance measurements.

Abstract: A passive coupling structure constructed using printed circuit board traces is used to separate the low and high frequency components of an incoming digital signal. The low and high frequency components of the signal are sent to separate receivers on an integrated circuit. The low frequency receiver may be a conventional level based receiver. The high frequency receiver is a Schmitt-trigger with hysteresis around a DC level or two comparators with separate reference voltages. The outputs of these receivers are combined to produce a receiver output that has increased reliability and noise immunity.

Abstract: A passive coupling structure constructed using printed circuit board traces is used to separate the low and high frequency components of an incoming digital signal. The low and high frequency components of the signal are sent to separate receivers on an integrated circuit. The low frequency receiver may be a conventional level based receiver. The high frequency receiver is a Schmitt-trigger with hysteresis around a DC level or two comparators with separate reference voltages. The outputs of these receivers are combined to produce a receiver output that has increased reliability and noise immunity.

Abstract: A passive coupling structure constructed using printed circuit board traces is used to separate the low and high frequency components of an incoming digital signal. The low and high frequency components of the signal are sent to separate receivers on an integrated circuit. The low frequency receiver may be a conventional level based receiver. The high frequency receiver is a Schmitt-trigger with hysteresis around a DC level or two comparators with separate reference voltages. The outputs of these receivers are combined to produce a receiver output that has increased reliability and noise immunity.

Abstract: A passive coupling structure constructed using printed circuit board traces is used to separate the low and high frequency components of an incoming digital signal. The low and high frequency components of the signal are sent to separate receivers on an integrated circuit. The low frequency receiver may be a conventional level based receiver. The high frequency receiver is a Schmitt-trigger with hysteresis around a DC level or two comparators with separate reference voltages. The outputs of these receivers are combined to produce a receiver output that has increased reliability and noise immunity.

Abstract: A particulate filter for a disc drive also functions as an acoustic noise filter and a mechanical vibration filter. The impaction filter covers substantial portions of the interior of the disc drive housing, thus reducing particulates in both radial and tangential airflow currents. The impaction filter is constructed of a soft material, such as polypropylene and modified acrylic fibers, so that particulates are bound to the surface of the impaction filter upon impact. The textured surface of the filter and the static caused by the operation of the discs in close proximity with the filter cause the particulates to tend to remain bound to the filter. Because the impaction filter covers substantial portions of the interior of the disc drive housing, rather than specific locations within the housing, the particulates in the tangential airflow currents are reduced. Moreover, the fabrication and coverage area of the impaction filter reduces acoustic noise and mechanical vibrations.

Abstract: A particulate filter for a disc drive also functions as an acoustic noise filter and a mechanical vibration filter. The impaction filter covers substantial portions of the interior of the disc drive housing, thus reducing particulates in both radial and tangential airflow currents. The impaction filter is constructed of a soft material, such as polypropylene and modified acrylic fibers, so that particulates are bound to the surface of the impaction filter upon impact. The textured surface of the filter and the static caused by the operation of the discs in close proximity with the filter cause the particulates to tend to remain bound to the filter. Because the impaction filter covers substantial portions of the interior of the disc drive housing, rather than specific locations within the housing, the particulates in the tangential airflow currents are reduced. Moreover, the fabrication and coverage area of the impaction filter reduces acoustic noise and mechanical vibrations.