Patents by Inventor Rangesh Raghavan

Rangesh Raghavan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Equipment front end module for transferring wafers and method of transferring wafers
    Patent number: 9818633
    Abstract: An EFEM useful for transferring wafers to and from wafer processing modules comprises an enclosure having a controlled environment therein bounded by a front wall, a back wall, first and second side walls, a top wall, and a bottom wall. The first side wall and the second side wall include two or more wafer load ports wherein each wafer load port is adapted to receive a FOUP. The front wall includes wafer ports configured to attach to respective load locks operable to allow a wafer to be transferred to a front wall cluster processing tool. The back wall includes a wafer port adapted to be in operational relationship with a back wall cluster processing tool. A robot in the EFEM enclosure is operable to transfer wafers through the wafer load ports, the first front wall wafer port, the second front wall wafer port, and the back wall wafer port.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: November 14, 2017
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Thorsten Lill, Vahid Vahedi, Candi Kristoffersen, Andrew D. Bailey, III, Meihua Shen, Rangesh Raghavan, Gary Bultman
  • EQUIPMENT FRONT END MODULE FOR TRANSFERRING WAFERS AND METHOD OF TRANSFERRING WAFERS
    Publication number: 20160111309
    Abstract: An EFEM useful for transferring wafers to and from wafer processing modules comprises an enclosure having a controlled environment therein bounded by a front wall, a back wall, first and second side walls, a top wall, and a bottom wall. The first side wall and the second side wall include two or more wafer load ports wherein each wafer load port is adapted to receive a FOUP. The front wall includes wafer ports configured to attach to respective load locks operable to allow a wafer to be transferred to a front wall cluster processing tool. The back wall includes a wafer port adapted to be in operational relationship with a back wall cluster processing tool. A robot in the EFEM enclosure is operable to transfer wafers through the wafer load ports, the first front wall wafer port, the second front wall wafer port, and the back wall wafer port.
    Type: Application
    Filed: October 17, 2014
    Publication date: April 21, 2016
    Inventors: Thorsten Lill, Vahid Vahedi, Candi Kristoffersen, Andrew D. Bailey, III, Meihua Shen, Rangesh Raghavan, Gary Bultman