Patents by Inventor Ranjit Biswas

Ranjit Biswas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5618196
    Abstract: A socket connector having improved protection against electrostatic discharges. The body of the connector is encircled by a conductive shell and contains a plurality of female contacts for receiving respective pins of a pin connector. The surface of the body facing the pin connector is coated with conductive material which is coupled to the conductive shell through a conductive stripe on the body and a resilient conductive member contacting both the stripe and the shell. Charge reaching the conductive material from the pin connector is led harmlessly to ground from the shell.
    Type: Grant
    Filed: August 18, 1995
    Date of Patent: April 8, 1997
    Assignee: Lucent Technologies, Inc.
    Inventor: Ranjit Biswas
  • Patent number: 5213748
    Abstract: In a pre-molded package assembly, a thermoplastic ring molded onto a leadframe must maintain lead coplanarity. In this invention a plastic member of liquid crystal polmar is molded onto the leads of a metal leadframe. The plastic member is a thermoplastic anisotropic material which, when formed, has a flow direction which is in the long dimension of the plastic member and a transverse direction which is in the short dimension of the plastic member. Dam members on the leadframe help contain the plastic molding compound within the mold cavity during the molding process. A puddle gate prevents the formation of a weld line in the plastic member. Upon completion of the molding process, the dam members are excised from the leadframe to provide discrete leads.
    Type: Grant
    Filed: June 27, 1991
    Date of Patent: May 25, 1993
    Assignee: AT&T Bell Laboratories
    Inventors: Ranjit Biswas, Michael A. Zimmerman
  • Patent number: 5053852
    Abstract: The present invention is a molded Hybrid Integrated Circuit package in which a carrier substrate with a various circuit elements including an integrated circuit is supported within a resilient cradle formed by down-set and compliant portions of leads arranged in a quad configuration around the periphery of the carrier substrate, with ends of the down-set portions being secured to pads arranged on the periphery of the carrier substrate. Prior to the assembly with carrier substrate and molding of the resultant subassembly, the leads form a part of a lead frame including elongated bar and dam-bar on each of the quad sides interconnecting end and central portions, respectively, of the leads, and an interconnecting array of connecting links and bridges at the ends of the dam-bars.
    Type: Grant
    Filed: July 5, 1990
    Date of Patent: October 1, 1991
    Assignee: AT&T Bell Laboratories
    Inventors: Ranjit Biswas, Hazen Curtis, III
  • Patent number: 4735351
    Abstract: A wire marker dispenser including a plurality of chambers to receive tape rolls therein. A retaining member adjacent each chamber engages a portion of the tape extending from the roll and prevents the tape extent from rolling back onto the tape roll. The tape dispenser also includes an interconnection means for connecting plural dispensers together.
    Type: Grant
    Filed: December 16, 1982
    Date of Patent: April 5, 1988
    Assignee: Thomas & Betts Corporation
    Inventor: Ranjit Biswas
  • Patent number: 4627678
    Abstract: An accessory circuit component for an electrical package is disclosed. This circuit component includes a conductive path for connecting an accessory component to selected contacts of the electrical package. The conductive path includes portions thereof which are selectively removable to create an open electrical circuit between the selected package contacts.
    Type: Grant
    Filed: February 20, 1985
    Date of Patent: December 9, 1986
    Assignee: Thomas & Betts Corporation
    Inventor: Ranjit Biswas
  • Patent number: 4519658
    Abstract: An accessory circuit component interconnected with the contacts of an electrical package comprises a flexible substrate with a circuit pattern of conductive traces thereon and a decoupling capacitor connected to selected conductive traces. A plurality of deflectable tabs inclusive of a portion of the substrate and a conductive trace are provided interiorly of side margins of the substrate. Upon assembly of the accessory component to a socket, the tabs deflect as urged by the contacts thereby providing openings through the substrate for receipt of the contacts therethrough. The conductive trace portions of the deflected tabs are connected to the contacts bearing thereagainst.
    Type: Grant
    Filed: January 24, 1983
    Date of Patent: May 28, 1985
    Assignee: Thomas & Betts Corporation
    Inventor: Ranjit Biswas
  • Patent number: 3993333
    Abstract: A snap-in connector for coupling a flexible metallic raceway to an electrical enclosure formed from a shell member, to engage the material about the knock-out in an electrical enclosure, and a core member, to engage, hold and ground a flexible metallic raceway. The core member has a cylindrical central portion about which is positioned an inwardly facing rib in the form of a portion of a helix to engage the voids between the covolutions of the raceway to hold the raceway and provide electrical continuity therewith. The shell member and core member are coupled together and provide a first lip to limit connector insertion into the knock-out and in cooperation with latch means to hold the connector to the material about the knock-out while the latch means prevents withdrawal of the connector from the knock-out.
    Type: Grant
    Filed: July 23, 1975
    Date of Patent: November 23, 1976
    Assignee: Thomas & Betts Corporation
    Inventor: Ranjit Biswas