Patents by Inventor Ranjith KANDASAMY

Ranjith KANDASAMY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11399449
    Abstract: A server rack cooling arrangement may include a server rack enclosure defining a single undivided interior volume of space and configured to be sealable; two or more open-frame-server-units disposed within the interior volume of space and arranged in a multi-level arrangement, wherein heat-producing-electronic-components may be exposed to environmental conditions of the interior volume of space; a central condenser disposed towards a rear; a coolant reservoir for collecting condensate from the central condenser; at least one nozzle in fluid communication with the coolant reservoir and configured to deliver fine coolant droplets into the interior volume of space for impingement on the heat-producing-electronic-components; and a fan configured to generate an airflow through the two or more open-frame-server-units from a front to the rear in a manner so as to carry coolant vapour generated from impingement of the fine coolant droplets on the heat-producing-electronic-components to the central condenser.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: July 26, 2022
    Assignee: NANYANG TECHNOLOGICAL UNIVERSITY
    Inventors: Teck Neng Wong, Ranjith Kandasamy, Kok Chuan Toh, Jin Yao Ho
  • Publication number: 20210307210
    Abstract: A server rack cooling arrangement may include a server rack enclosure defining a single undivided interior volume of space and configured to be sealable; two or more open-frame-server-units disposed within the interior volume of space and arranged in a multi-level arrangement, wherein heat-producing-electronic-components may be exposed to environmental conditions of the interior volume of space; a central condenser disposed towards a rear; a coolant reservoir for collecting condensate from the central condenser; at least one nozzle in fluid communication with the coolant reservoir and configured to deliver fine coolant droplets into the interior volume of space for impingement on the heat-producing-electronic-components; and a fan configured to generate an airflow through the two or more open-frame-server-units from a front to the rear in a manner so as to carry coolant vapour generated from impingement of the fine coolant droplets on the heat-producing-electronic-components to the central condenser.
    Type: Application
    Filed: July 26, 2019
    Publication date: September 30, 2021
    Inventors: Teck Neng WONG, Ranjith KANDASAMY, Kok Chuan TOH, Jin Yao HO