Patents by Inventor Raschid J. Bezama
Raschid J. Bezama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8446006Abstract: Structures and methods to reduce maximum current density in a solder ball are disclosed. A method includes forming a contact pad in a last wiring level and forming a plurality of wires of the contact pad extending from side edges of the contact pad to respective ones of a plurality of vias. Each one of the plurality of wires has substantially the same electrical resistance.Type: GrantFiled: December 17, 2009Date of Patent: May 21, 2013Assignee: International Business Machines CorporationInventors: Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra, George J. Scott, Krystyna W. Semkow, Timothy D. Sullivan, Robin A. Susko, Thomas A. Wassick, Xiaojin Wei, Steven L. Wright
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Publication number: 20130062209Abstract: An electroplating apparatus including a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.Type: ApplicationFiled: September 12, 2012Publication date: March 14, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. Arvin, Raschid J. Bezama, Glen N. Biggs, Hariklia Deligianni, Tracy A. Tong
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Publication number: 20120325667Abstract: Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.Type: ApplicationFiled: September 6, 2012Publication date: December 27, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. Arvin, Raschid J. Bezama, Harry D. Cox, Krystyna W. Semkow
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Publication number: 20120187558Abstract: Interconnect structures and methods of fabricating the same are provided. The interconnect structures provide highly reliable copper interconnect structures for improving current carrying capabilities (e.g., current spreading). The structure includes an under bump metallurgy formed in a trench. The under bump metallurgy includes at least: an adhesion layer; a plated barrier layer; and a plated conductive metal layer provided between the adhesion layer and the plated barrier layer. The structure further includes a solder bump formed on the under bump metallurgy.Type: ApplicationFiled: March 29, 2012Publication date: July 26, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. ARVIN, Raschid J. BEZAMA, Harry D. COX, Timothy H. DAUBENSPECK, Krystyna W. SEMKOW, Timothy D. SULLIVAN
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Publication number: 20120152750Abstract: Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.Type: ApplicationFiled: February 28, 2012Publication date: June 21, 2012Applicant: International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama, Harry D. Cox, Krystyna W. Semkow
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Patent number: 8177945Abstract: Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.Type: GrantFiled: January 26, 2007Date of Patent: May 15, 2012Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama, Harry D. Cox, Krystyna W. Semkow
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Publication number: 20120043217Abstract: An electroplating/etch apparatus including a fluid jet and a dryer present over the tank containing the electrolyte for the electroplating/etch process. The fluid jet and the dryer remove excess liquids, such as electrolyte, from the component being plated or etched, e.g., working electrode. The working electrode is present on a holder that traverses from a first position within the tank during a plating or etch operation to a second position that is outside the containing the plating electrolyte. The fluid jet rinses the working electrode when the holder is in the second position, and the forced air dryer blows any remaining fluid from the fluid jet and the electrolyte from the working electrode into the tank.Type: ApplicationFiled: August 19, 2010Publication date: February 23, 2012Applicant: International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama, Hariklia Deligianni
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Publication number: 20120043216Abstract: An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.Type: ApplicationFiled: August 19, 2010Publication date: February 23, 2012Applicant: International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama, Glen N. Biggs, Hariklia Deligianni, Tracy A. Tong
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Patent number: 8107800Abstract: An article supports a workpiece during thermal processing. At least three elongated support members, e.g., support pins, extend upwardly from an element such as support arms for supporting the workpiece. Each of the support members includes a first portion adjacent to the workpiece. A second portion extends downwardly from the first portion. The first portion can have a thermal response faster than the thermal response of the workpiece and the second portion can have a slower thermal response. A removable element may be mounted to the support member for adjusting the thermal response of the support member. With removable elements, the support members can be adjusted to cause no net transfer of heat to or from the workpiece.Type: GrantFiled: January 8, 2008Date of Patent: January 31, 2012Assignee: International Business Machines CorporationInventors: Raschid J. Bezama, Lewis S. Goldmann, Donald R. Wall
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Publication number: 20110193218Abstract: A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall.Type: ApplicationFiled: February 5, 2010Publication date: August 11, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. Arvin, Raschid J. Bezama, Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad, Wolfgang Sauter, Timothy D. Sullivan, Brian R. Sundlof
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Patent number: 7992627Abstract: Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.Type: GrantFiled: December 18, 2008Date of Patent: August 9, 2011Assignee: International Business Machines CorporationInventors: Raschid J. Bezama, Govindarajan Natarajan, Kamal K. Sikka, Hilton T. Toy
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Publication number: 20110162876Abstract: Solutions for improving current spreading in organic substrates are disclosed. In one aspect, a packaging substrate is disclosed, the packaging substrate comprising: a substrate base having a first surface and a second surface; and a controlled collapse chip connect (C4) pad over a portion of the first surface, the C4 pad including: an electrolessly plated copper (Cu) layer over the first surface; an electrolytic nickel (Ni) portion over the first electrolytic Cu portion; and a first electrolytic Cu portion over the electrolytic Ni portion; wherein the electrolessly plated Cu layer has a portion extending in one direction away from the C4 pad.Type: ApplicationFiled: January 7, 2010Publication date: July 7, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. Arvin, Raschid J. Bezama
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Publication number: 20110147922Abstract: Structures and methods to reduce maximum current density in a solder ball are disclosed. A method includes forming a contact pad in a last wiring level and forming a plurality of wires of the contact pad extending from side edges of the contact pad to respective ones of a plurality of vias. Each one of the plurality of wires has substantially the same electrical resistance.Type: ApplicationFiled: December 17, 2009Publication date: June 23, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Raschid J. BEZAMA, Timothy H. DAUBENSPECK, Gary LaFONTANT, Ian D. MELVILLE, Ekta MISRA, George J. SCOTT, Krystyna W. SEMKOW, Timothy D. SULLIVAN, Robin A. SUSKO, Thomas A. WASSICK, Xiaojin WEI, Steven L. WRIGHT
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Patent number: 7869002Abstract: A method for reducing contamination in immersion lithography includes retaining a semiconductor wafer on a support surface of a wafer chuck, the wafer chuck having a gap therein, the gap located adjacent an outer edge of the wafer, and the gap containing a volume of immersion lithography fluid therein; and providing a fluid circulation path within the wafer chuck so as to facilitate the radial outward movement of the immersion lithography fluid in the gap, thereby maintaining a meniscus of the immersion lithography fluid at a selected height with respect to a top surface of the semiconductor wafer.Type: GrantFiled: July 30, 2008Date of Patent: January 11, 2011Assignee: International Business Machines CorporationInventors: Dmitriy Shneyder, Raschid J. Bezama, Dario L. Goldfarb, Kafal Lai
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Publication number: 20100258335Abstract: Interconnect structures and methods of fabricating the same are provided. The interconnect structures provide highly reliable copper interconnect structures for improving current carrying capabilities (e.g., current spreading). The structure includes an under bump metallurgy formed in a trench. The under bump metallurgy includes at least: an adhesion layer; a plated barrier layer; and a plated conductive metal layer provided between the adhesion layer and the plated barrier layer. The structure further includes a solder bump formed on the under bump metallurgy.Type: ApplicationFiled: April 10, 2009Publication date: October 14, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. Arvin, Raschid J. Bezama, Harry D. Cox, Timothy H. Daubenspeck, Krystyna W. Semkow, Timothy D. Sullivan
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Patent number: 7802442Abstract: A distribution apparatus, system and method for thermal control whereby a plate of a manifold assembly has predetermined surface features positioned on specific locations on a surface thereof for enhancing the cooling capabilities of the assembly. The predetermined surface features of the plate delay a velocity decay of a fluid impinging the surface of the plate, while also increase the surface area of the plate exposed to the impinging liquid, which in turn, maximize both the reliability and thermal performance of the overall thermal system at a given maximum operating pressure.Type: GrantFiled: July 30, 2008Date of Patent: September 28, 2010Assignee: International Business Machines CorporationInventors: Raschid J. Bezama, Govindarajan Natarajan
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Patent number: 7787101Abstract: An apparatus for reducing contamination in immersion lithography includes a wafer chuck assembly including a wafer chuck configured to hold a semiconductor wafer on a support surface thereof. An O-ring assembly has a deformable O-ring attached to movable support sections arranged in a generally circular configuration so as to surround the wafer.Type: GrantFiled: February 16, 2006Date of Patent: August 31, 2010Assignee: International Business Machines CorporationInventors: Raschid J. Bezama, Dario L. Goldfarb, Kafai Lai, Xiao H. Liu, Dmitriy Shneyder
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Patent number: 7782445Abstract: A wafer chuck assembly includes a first chuck section configured to hold a semiconductor wafer on a support surface thereof, and a second chuck section removably attached to the first chuck section. The first chuck section has a gap therein, the gap located adjacent an outer edge of the wafer, and the gap containing a volume of immersion lithography fluid therein. A fluid circulation path is configured within the first chuck section so as to facilitate the radial outward movement of the immersion lithography fluid in the gap, thereby maintaining a meniscus of the immersion lithography fluid at a selected height with respect to a top surface of the semiconductor wafer.Type: GrantFiled: July 30, 2008Date of Patent: August 24, 2010Assignee: International Business Machines CorporationInventors: Dmitriy Shneyder, Raschid J. Bezama, Dario L. Goldfarb, Kafal Lai
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Publication number: 20100200197Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.Type: ApplicationFiled: February 2, 2010Publication date: August 12, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Raschid J. Bezama, David C. Long, Govindarajan Natarajan, Thomas Weiss
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Publication number: 20100117209Abstract: The present invention is directed to a method of packaging multiple semiconductor chips on a second semiconductor chips with a built-in efficient cooling means. One embodiment is to place two multiple chip stacks on opposing sides of a vapor chamber for transferring heat away from the semiconductor chips. Another embodiment is to construct a vapor chamber with a substrate such that at least one multiple chip stack is embedded inside the vapor chamber.Type: ApplicationFiled: February 28, 2007Publication date: May 13, 2010Inventors: Raschid J. Bezama, Minhua Lu, Lawrence S. Mok