Patents by Inventor Raven Demeyer

Raven Demeyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Decreasing the critical dimensions in integrated circuits
    Patent number: 9406503
    Abstract: A method for lithographic patterning of a substrate is described. The method comprises obtaining a substrate to be patterned. It further comprises subsequently performing at least twice the following cycle: applying a lithographical patterning process of a thermally shrinkable metal-oxide layer for forming a metal-oxide pattern, and thermally shrinking the metal-oxide pattern. The different metal oxide patterns formed during the at least two cycles are positioned in proximity to each other such that the shrunk metal-oxide patterns form together an overall pattern to be transferred to the substrate. After performing the cycle at least twice, the overall pattern is transferred to the substrate.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: August 2, 2016
    Assignees: IMEC VZW, Katholieke Universiteit Leuven, KU LEUVEN R&D
    Inventors: Efrain Altamirano Sanchez, Farrukh Qayyum Yasin, Raven Demeyer
  • Decreasing the Critical Dimensions in Integrated Circuits
    Publication number: 20160181090
    Abstract: A method for lithographic patterning of a substrate is described. The method comprises obtaining a substrate to be patterned. It further comprises subsequently performing at least twice the following cycle: applying a lithographical patterning process of a thermally shrinkable metal-oxide layer for forming a metal-oxide pattern, and thermally shrinking the metal-oxide pattern. The different metal oxide patterns formed during the at least two cycles are positioned in proximity to each other such that the shrunk metal-oxide patterns form together an overall pattern to be transferred to the substrate. After performing the cycle at least twice, the overall pattern is transferred to the substrate.
    Type: Application
    Filed: December 21, 2015
    Publication date: June 23, 2016
    Applicants: IMEC VZW, Katholieke Universiteit Leuven, KU LEUVEN R&D
    Inventors: Efrain Altamirano Sanchez, Farrukh Qayyum Yasin, Raven Demeyer